The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
- Number of I/Os
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- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Contact Plating | Mount | Mounting Type | Package / Case | Supplier Device Package | 1st Connector Mounting Type | 2nd Connector Mounting Type | 1st Connector Mounting Feature | 1st Contact Gender | 2nd Connector Mounting Feature | 2nd Contact Gender | Base Product Number | Cable Types | Frequency-Max | Mfr | Number of I/Os | Overall Impedance | Package | Product Status | RoHS | Voltage Rated | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Number of Terminations | Termination | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Max Operating Temperature | Min Operating Temperature | Composition | Color | Applications | Gender | Power (Watts) | Capacitance | Fastening Type | Voltage - Supply | Orientation | Ingress Protection | Depth | Style | Output | Function | Number of Outputs | Number of Contacts | Voltage - Input (Max) | Output Type | Voltage - Input (Min) | Failure Rate | Lead Spacing | Number of Circuits | Plating | Speed | Output Configuration | RAM Size | Lead Style | Current - Output | Core Processor | Peripherals | Connectivity | Reset | Voltage - Output (Min/Fixed) | Topology | Architecture | Voltage - Threshold | Number of Voltages Monitored | Reset Timeout | Frequency - Switching | Synchronous Rectifier | Input | Ratio - Input:Output | 1st Connector | 2nd Connector | Voltage - Output (Max) | Differential - Input:Output | Primary Attributes | Flash Size | Features | Height Seated (Max) | Length | Thickness (Max) | Radiation Hardening | Ratings |
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 | Mfr Part No XCZU47DR-L2FFVE1156I | Xilinx | Datasheet | 4000 | - | Min: 1 Mult: 1 | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) | SI5330 | 350 MHz | Skyworks Solutions Inc. | 366 | Tray | Obsolete | -40°C ~ 85°C | - | Fanout Buffer (Distribution), Translator | 1.71V ~ 3.63V | LVPECL | 1 | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | CMOS, HSTL, LVTTL, SSTL | 1:4 | No/Yes | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-L1FSVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | 120084 | Molex | 366 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-L1FFVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | YDL68G | TE Connectivity Deutsch Connectors | 366 | Bag | Active | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU49DR-L1FSVF1760I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | 073404 | Molex | 622 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-2FSVG1517I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | 098853 | Molex | 561 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU49DR-1FFVF1760E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount, MLCC | 1206 (3216 Metric) | 1760-FCBGA (42.5x42.5) | Vishay Vitramon | 622 | Tape & Reel (TR) | Active | 100V | -55°C ~ 150°C | GA | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±20% | X7R | Automotive | 0.18 µF | - | - | 500MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | - | - | 0.067 (1.70mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU49DR-2FSVF1760E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | SC-74A, SOT-753 | SOT-23-5 | MAX6307 | Analog Devices Inc./Maxim Integrated | 622 | Tape & Reel (TR) | Obsolete | 0°C ~ 70°C (TA) | - | Multi-Voltage Supervisor | Open Drain or Open Collector | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Active Low | MCU, FPGA | 4.1V, Adj | 2 | 1ms Minimum | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-L2FFVG1517I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Axial | Axial | SPP2UL | TT Electronics/IRC | 561 | Cut Tape (CT) | Discontinued at Digi-Key | -55°C ~ 200°C | SPP | 0.169 Dia x 0.571 L (4.30mm x 14.50mm) | ±5% | 2 | ±300ppm/°C | 6.8 Ohms | Wirewound | 2W | - | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Fusible, Moisture Resistant, Safety, Weldable | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-2FSVE1156E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 16-WQFN Exposed Pad | 16-TQFN (5x5) | MAX5097 | Analog Devices Inc./Maxim Integrated | 366 | Tape & Reel (TR) | Active | -40°C ~ 125°C (TJ) | - | Step-Down | 1 | 40V | Adjustable (Fixed) | 5V | 533MHz, 1.333GHz | Positive | 256KB | 600mA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.24V (3.3V) | Buck | MCU, FPGA | 330kHz | No | 11V | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-L1FSVG1517I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | 120066 | Molex | 561 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-L2FFVG1517I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | 055935 | Molex | 561 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-L2FSVG1517I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | Panel Mount | Free Hanging (In-Line) | Bulkhead - Front Side Nut | Female | - | Female | Q-1S05D0 | RG-58 | 3 GHz | Amphenol Custom Cable | 561 | 50 Ohms | Bag | Active | - | - | Black | - | N-Type to Fakra | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | N-Type Jack, Right Angle | Fakra Jack, Right Angle | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Shielded | 36.00 (914.40mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-L1FFVG1517I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Axial | Axial | RLR20 | Vishay Dale | 561 | Tape & Reel (TR) | Active | -65°C ~ 150°C | Military, MIL-PRF-39017/02, RLR20 | 0.138 Dia x 0.375 L (3.51mm x 9.53mm) | ±2% | 2 | ±100ppm/°C | 1.6 kOhms | Metal Film | 0.5W, 1/2W | M (1%) | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Military, Moisture Resistant, Weldable | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-2FSVG1517I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | Vishay Vitramon | 561 | Bulk | Obsolete | -40°C ~ 100°C (TJ) | * | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-1FSVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | 121055 | Molex | 366 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-1FSVG1517E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1206 (3216 Metric) | 1206 | PFC-W1206 | TT Electronics/IRC | 561 | Cut Tape (CT) | Discontinued at Digi-Key | -65°C ~ 150°C | PFC - Precision | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±0.1% | 2 | ±25ppm/°C | 2.49 kOhms | Thin Film | 0.333W, 1/3W | - | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Anti-Sulfur, Moisture Resistant | 0.028 (0.71mm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3CG-1SFVC784E | AMD | Datasheet | 1615 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU3 | AMD | 252 | Tray | Active | Non-Compliant | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB006R24C3E3V | Intel | Datasheet | 539 | - | Min: 1 Mult: 1 | Gold | Bulkhead, Front Side Nut, Jam Nut, Panel | - | - | Intel | 576 | Tray | Active | Compliant | 0°C ~ 100°C (TJ) | Bulk | Agilex F | Crimp | Crimp, Receptacle | 66 | 175 °C | -65 °C | Female | Threaded | Straight | 46.02 mm | 66 | Cadmium | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | 31.57 mm | No | Environment Resistant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA027R25A3E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 624 | Tray | Active | Non-Compliant | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-1LSEVSVA2197 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - |
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XCZU47DR-L2FFVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU48DR-L1FSVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU48DR-L1FFVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU49DR-L1FSVF1760I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU48DR-2FSVG1517I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU49DR-1FFVF1760E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU49DR-2FSVF1760E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU43DR-L2FFVG1517I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU43DR-2FSVE1156E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU48DR-L1FSVG1517I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU48DR-L2FFVG1517I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU43DR-L2FSVG1517I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU43DR-L1FFVG1517I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU43DR-2FSVG1517I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU48DR-1FSVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU43DR-1FSVG1517E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU3CG-1SFVC784E
AMD
Package:Embedded - System On Chip (SoC)
425.840571
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AGFB006R24C3E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA027R25A3E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1802-1LSEVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire