The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | Shell Material | Supplier Device Package | Material | Insert Material | Number of Terminals | Backshell Material, Plating | Accessory | Base Product Number | Brand | Contact Finish Mating | Contact Materials | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Inflammability class of insulation material according to with UL94 | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Material of contact surface | Maximum Clock Frequency | Mfr | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Overvoltage category | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Pollution degree | Primary Material | Product Status | Rated current In | Rated surge voltage | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Spare part | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Type of accessory/spare part | Type of fastening | Voltage Rated | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Number of Terminations | Termination | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Max Operating Temperature | Min Operating Temperature | Composition | Color | Applications | Power (Watts) | HTS Code | Capacitance | Fastening Type | Subcategory | Current Rating (Amps) | Technology | Voltage - Supply | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Frequency | Frequency Stability | Output | Shell Finish | Shell Size - Insert | JESD-30 Code | Function | Base Resonator | Current - Supply (Max) | Number of Outputs | Qualification Status | Failure Rate | Lead Spacing | Power Supplies | Temperature Grade | Current - Supply (Disable) (Max) | Interface | Speed | RAM Size | Shell Size, MIL | Lead Style | Core Processor | Peripherals | Program Memory Size | Spread Spectrum Bandwidth | Connectivity | Cable Opening | Architecture | Number of Inputs | Seated Height-Max | Number of Ways | Programmable Logic Type | Product Type | Core Architecture | Absolute Pull Range (APR) | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Features | Product Category | IP Rating | Height | Height Seated (Max) | Length | Width | Thickness (Max) | Contact Finish Thickness - Mating | Material Flammability Rating | Ratings |
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![]() | Mfr Part No XC7Z035-2FFG900I | AMD | Datasheet | 577 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XC7Z035 | AMD | 130 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 275K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFB027R24C2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU7EG-1FFVF1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU7 | AMD | 464 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1502-1MLINFVB1369 | AMD | Datasheet | 594 | - | Min: 1 Mult: 1 | AMD | 478 | Tray | Active | Versal™ Prime | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFB019R25A2I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A2F500M3G-1FG256M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256 | 256-FPBGA (17x17) | A2F500 | MICROSEMI CORP | Microsemi Corporation | A2F500M3G-1FG256M | Microchip Technology | MCU - 25, FPGA - 66 | Tray | Active | Active | 2.54 | Non-Compliant | No | -55°C ~ 125°C (TJ) | SmartFusion® | 125 °C | -55 °C | 8542.39.00.01 | unknown | 100 MHz | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFA014R24C3I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Polycarbonate | Intel | 744 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 2 | FPGA - 1.4M Logic Elements | - | IP66, IP67 | 355mm | 255mm | 122mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGIB022R31B2I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Yes | Intel | 720 | Tray | Active | Yes | Cover | -40°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFB027R25A3I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | V0 | Gold | Intel | 624 | III | Tray | 2 | Active | 6 | 2.5 | Other | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFB012R24B2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Panel Mount, Through Hole | - | - | Stainless Steel | - | Fluorosilicone Elastomer | - | D38999/25HE | Gold | Nickel Iron Alloy | TE Connectivity Deutsch Connectors | 768 | Bulk | Metal | Active | 600VAC, 850VDC | -65°C ~ 200°C | MIL-DTL-38999 Series III, DTS | Solder | Receptacle, Female Sockets | 23 | Silver | Aviation, Communication Systems, Industrial | Threaded | - | D | Shielded | Environment Resistant | Electroless Nickel | 17-99 | 1.4GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MPU, FPGA | FPGA - 1.2M Logic Elements | - | Hermetically Sealed | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066H2F34I2SGES | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | YES | 1152-FCBGA (35x35) | 1152 | 500SAB | INTEL CORP | Intel Corporation | 10AS066H2F34I2SGES | Skyworks Solutions Inc. | 492 | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | Obsolete | 5.66 | 0.93 V | 0.87 V | 0.9 V | 0°C ~ 85°C | Tray | Si500S | 0.157 L x 0.126 W (4.00mm x 3.20mm) | Discontinued at Digi-Key | XO (Standard) | 8542.39.00.01 | 3.3V | BOTTOM | BALL | 1 mm | compliant | 70.3125 MHz | ±20ppm | CMOS | S-PBGA-B1152 | Enable/Disable | Crystal | 24mA | INDUSTRIAL | 10.7mA | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | - | FPGA - 660K Logic Elements | -- | 0.035 (0.90mm) | 35 mm | 35 mm | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS048K4F35I3SG | ALTERA | Datasheet | 771 |
| Min: 1 Mult: 1 | YES | 1152 | INTEL CORP | Intel Corporation | 10AS048K4F35I3SG | Panduit Corp | 396 | 100 °C | -40 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Obsolete | NOT SPECIFIED | 5.47 | Yes | 0.93 V | 0.87 V | 0.9 V | -40°C ~ 100°C (TJ) | Tray | * | Active | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 396 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 480K Logic Elements | 480000 | -- | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS032H4F35E3SG | ALTERA | Datasheet | 704 |
| Min: 1 Mult: 1 | Surface Mount, MLCC | 1812 (4532 Metric) | YES | 1152 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS032H4F35E3SG | 1.2 GHz | Vishay Vitramon | Yes | SMD/SMT | 384 | 40000 LAB | 320000 LE | 100 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965298 | Active | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 100V | -55°C ~ 150°C | Tray | GA | 0.177 L x 0.126 W (4.50mm x 3.20mm) | ±5% | Active | C0G, NP0 | Automotive | 8542.39.00.01 | 150 pF | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | - | - | 0.9 V | OTHER | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | - | SoC FPGA | - | 35 mm | 35 mm | 0.086 (2.18mm) | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS048H2F34E2LG | ALTERA | Datasheet | 617 |
| Min: 1 Mult: 1 | YES | 1152 | MS27497T14F | INTEL CORP | Intel Corporation | 10AS048H2F34E2LG | Corsair | 492 | 100 °C | Bag | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | NOT SPECIFIED | 5.47 | Yes | 0.93 V | 0.87 V | 0.9 V | 0°C ~ 100°C (TJ) | Tray | * | Active | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 492 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 480K Logic Elements | 480000 | -- | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS032H1F34I1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount, MLCC | 1206 (3216 Metric) | YES | 1152-FBGA (35x35) | 1152 | INTEL CORP | Intel Corporation | 10AS032H1F34I1SG | Vishay Vitramon | 384 | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | SQUARE | GRID ARRAY | Obsolete | Active | 5.66 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | 50V | -55°C ~ 150°C | Tray | GA | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±20% | Discontinued at Digi-Key | X8R | Automotive | 8542.39.00.01 | 1200 pF | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | - | - | INDUSTRIAL | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 320K Logic Elements | -- | - | - | 35 mm | 35 mm | 0.067 (1.70mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS022E3F29E2SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | FBGA-780 | YES | - | Composite | Thermoplastic | 780 | - | D38999/26JH | Intel / Altera | Gold | Copper Alloy | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS022E3F29E2SG | 1.2 GHz | TE Connectivity Deutsch Connectors | Yes | SMD/SMT | 288 | 27500 LAB | 220000 LE | 100 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | 973473 | Active | Composite | Discontinued at Digi-Key | NOT SPECIFIED | 5.46 | Non-Compliant | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | - | -65°C ~ 175°C | Tray | Military, MIL-DTL-38999 Series III, ACT | Active | Crimp | Plug, Female Sockets | 55 | Olive Drab | Aerospace, Military | 8542.39.00.01 | Threaded | SOC - Systems on a Chip | 7.5A | CMOS | BOTTOM | B | BALL | Shielded | NOT SPECIFIED | Environment Resistant | 1 mm | compliant | Olive Drab Cadmium | 23-55 | S-PBGA-B780 | 288 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | H | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | 288 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 220K Logic Elements | 220000 | 2 Core | -- | - | SoC FPGA | 29 mm | 29 mm | 50.0µin (1.27µm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS048K3F35E2SG | ALTERA | Datasheet | 612 |
| Min: 1 Mult: 1 | FBGA-1152 | YES | 1152 | DL66R | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS048K3F35E2SG | 1.2 GHz | TE Connectivity Deutsch Connectors | Yes | SMD/SMT | 396 | 60000 LAB | 480000 LE | 100 °C | Bag | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 964910 | Active | Active | NOT SPECIFIED | 5.47 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | * | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 396 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 480K Logic Elements | 480000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066H3F34I2SG | ALTERA | Datasheet | 589 |
| Min: 1 Mult: 1 | Axial | YES | Axial | 1152 | RLR05 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066H3F34I2SG | 1.2 GHz | Vishay Dale | Yes | SMD/SMT | 492 | 82500 LAB | 660000 LE | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965379 | Active | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -65°C ~ 150°C | Tray | Military, MIL-PRF-39017/05, RLR05 | 0.066 Dia x 0.150 L (1.68mm x 3.81mm) | ±2% | Active | 2 | ±100ppm/°C | 30 Ohms | Metal Film | 0.125W, 1/8W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 492 | Not Qualified | M (1%) | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | Military, Moisture Resistant, Weldable | SoC FPGA | - | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS032H2F34E1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | YAFD54 | INTEL CORP | Intel Corporation | 10AS032H2F34E1SG | TE Connectivity Deutsch Connectors | 384 | 100 °C | Bulk | PLASTIC/EPOXY | BGA | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Obsolete | Active | NOT SPECIFIED | 5.66 | Yes | 0.93 V | 0.87 V | 0.9 V | 0°C ~ 100°C (TJ) | Tray | * | Discontinued at Digi-Key | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 320K Logic Elements | 320000 | -- | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS048E4F29I3SG | ALTERA | Datasheet | 424 |
| Min: 1 Mult: 1 | 0603 (1608 Metric) | YES | 0603 | 780 | RNCF0603B | INTEL CORP | Intel Corporation | 10AS048E4F29I3SG | Stackpole Electronics Inc | 360 | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | Active | Active | NOT SPECIFIED | 5.47 | Yes | 0.93 V | 0.87 V | 0.9 V | -55°C ~ 155°C | Tray | RNCF | 0.061 L x 0.031 W (1.55mm x 0.80mm) | ±0.1% | Active | 2 | ±25ppm/°C | 23.2 Ohms | Thin Film | 0.167W, 1/6W | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B780 | 360 | Not Qualified | - | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 480K Logic Elements | 480000 | -- | Automotive AEC-Q200 | 0.022 (0.55mm) | 29 mm | 29 mm | AEC-Q200 |
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