The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Package / Case | Surface Mount | Supplier Device Package | Base Product Number | Core | Data RAM Size | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | L1 Cache Data Memory | L1 Cache Instruction Memory | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Package | Product Status | Shipping Restrictions | Operating Temperature | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Programmable Logic Type | Core Architecture | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No XCZU5EV-3FBVB900E | Xilinx Inc. | Datasheet | 150 | - | Min: 1 Mult: 1 | 11 Weeks | 900-BBGA, FCBGA | 204 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010S-TQG144I | Microchip Technology | Datasheet | 5 |
| Min: 1 Mult: 1 | TQFP-144 | 144-TQFP (20x20) | M2S010 | ARM Cortex M3 | 64 kB | 400 kbit | 60 | - | - | 166 MHz | + 100 C | Microchip Technology | - 40 C | SMD/SMT | 84 I/O | 1007 LAB | 12084 LE | Tray | Active | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||
 | Mfr Part No 10AS027E4F29I3SG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 780-BBGA, FCBGA | YES | 360 | -40°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 780 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B780 | 360 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 270K Logic Elements | 270000 | 3.35mm | 29mm | 29mm | RoHS Compliant | ||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-2FFVE1924I | Xilinx Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 11 Weeks | 1924-BBGA, FCBGA | 668 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EV-L1FBVB900I | Xilinx Inc. | Datasheet | 1080 | - | Min: 1 Mult: 1 | 11 Weeks | 900-BBGA, FCBGA | YES | 204 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | Active | 4 (72 Hours) | 900 | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B900 | 0.742V | 0.698V | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 10AS048K3F35I2SG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 11 Weeks | 1152-BBGA, FCBGA | YES | 396 | -40°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B1152 | 396 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 480K Logic Elements | 480000 | 3.5mm | 35mm | 35mm | RoHS Compliant | |||||||||||||||||||||||||||||||||
 | Mfr Part No 5CSEBA5U23C6N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | Active | 3 (168 Hours) | 672 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | 5CSEBA5 | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | 1.85mm | 23mm | 23mm | RoHS Compliant | |||||||||||||||||||||||||||||||
| Mfr Part No BCM3380ZKFSBG | Broadcom Limited | Datasheet | 168 | - | Min: 1 Mult: 1 | 2016 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XCZU6CG-L2FFVB1156E | Xilinx Inc. | Datasheet | 64 | - | Min: 1 Mult: 1 | 11 Weeks | 1156-BBGA, FCBGA | YES | 328 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B1156 | 0.742V | 0.698V | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EG-L1FBVB900I | Xilinx Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 11 Weeks | 900-BBGA, FCBGA | YES | 204 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 900 | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B900 | 0.742V | 0.698V | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EV-L1FFVF1517I | Xilinx Inc. | Datasheet | 79 | - | Min: 1 Mult: 1 | 11 Weeks | 1517-BBGA, FCBGA | YES | 464 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | Active | 4 (72 Hours) | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B1517 | 0.742V | 0.698V | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU17EG-3FFVE1924E | Xilinx Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 11 Weeks | 1924-BBGA, FCBGA | 668 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 10AS066K3F40E2SG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 1517-BBGA, FCBGA | YES | 696 | 0°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | 0.9V | 1mm | S-PBGA-B1517 | 0.93V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | 3.5mm | 40mm | 40mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 5ASXBB3D6F35C6N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 26 Weeks | 1152-BBGA, FCBGA | MCU - 208, FPGA - 385 | 0°C~85°C TJ | Tray | Arria V SX | Active | 3 (168 Hours) | 5ASXBB3 | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 350K Logic Elements | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA2U23I7SN | Intel | Datasheet | 33 | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SE | Active | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Elements | 25000 | 1.85mm | 23mm | 23mm | RoHS Compliant | |||||||||||||||||||||||||||||||
| Mfr Part No 5CSEMA4U23A7N | Intel | Datasheet | 2244 | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, Cyclone® V SE | Active | 3 (168 Hours) | 672 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 40K Logic Elements | 40000 | 1.85mm | 23mm | 23mm | RoHS Compliant | |||||||||||||||||||||||||||||||||
 | Mfr Part No XCZU3EG-L1SFVA625I | Xilinx Inc. | Datasheet | 60 | - | Min: 1 Mult: 1 | 11 Weeks | 625-BFBGA, FCBGA | YES | 180 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 625 | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B625 | 0.742V | 0.698V | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7Z020-1CLG484CES | Xilinx Inc. | Datasheet | 1 | - | Min: 1 Mult: 1 | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) | 130 | 0°C~85°C TJ | Tray | 2010 | Zynq®-7000 | Obsolete | 3 (168 Hours) | 85°C | 0°C | 667MHz | XC7Z020 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | Artix™-7 FPGA, 85K Logic Cells | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027E4F29E3SG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 780-BBGA, FCBGA | YES | 360 | 0°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 780 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B780 | 360 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 270K Logic Elements | 270000 | 3.35mm | 29mm | 29mm | RoHS Compliant | ||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-L2FFVC1760E | Xilinx Inc. | Datasheet | 48 | - | Min: 1 Mult: 1 | 11 Weeks | 1760-BBGA, FCBGA | YES | 512 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B1760 | 0.742V | 0.698V | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | ROHS3 Compliant |
-
XCZU5EV-3FBVB900E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010S-TQG144I
Microchip Technology
Package:Embedded - System On Chip (SoC)
49.616499
-
10AS027E4F29I3SG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU19EG-2FFVE1924I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU4EV-L1FBVB900I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS048K3F35I2SG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSEBA5U23C6N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
BCM3380ZKFSBG
Broadcom Limited
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU6CG-L2FFVB1156E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU7EG-L1FBVB900I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU7EV-L1FFVF1517I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU17EG-3FFVE1924E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS066K3F40E2SG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5ASXBB3D6F35C6N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSEBA2U23I7SN
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSEMA4U23A7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU3EG-L1SFVA625I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z020-1CLG484CES
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS027E4F29E3SG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU11EG-L2FFVC1760E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire