The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Data Rate | Architecture | Number of Inputs | Programmable Logic Type | Number of Logic Elements/Cells | Core Architecture | Number of Gates | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Primary Attributes | Number of Logic Cells | Flash Size | Height Seated (Max) | Length | Width | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No A2F060M3E-FG256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256 | 256-FPBGA (17x17) | MCU - 26, FPGA - 66 | -40°C~100°C TJ | Tray | SmartFusion® | Obsolete | 3 (168 Hours) | 100°C | -40°C | 80MHz | A2F060M3E | 1.5V | EBI/EMI, I2C, SPI, UART, USART | 1.575V | 1.425V | 80MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | 100MHz | 8 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||
 | Mfr Part No A2F500M3G-PQG208I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 208-BFQFP | 208 | 208-PQFP (28x28) | MCU - 22, FPGA - 66 | -40°C~100°C TJ | Tray | 2010 | SmartFusion® | Active | 3 (168 Hours) | 100°C | -40°C | 80MHz | A2F500M3G | Ethernet, I2C, SPI, UART, USART | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | Ethernet, I2C, SPI, UART/USART | MCU, FPGA | ARM | 100MHz | 24 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | RoHS Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1PQG208I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 208-BFQFP | 208 | 208-PQFP (28x28) | MCU - 22, FPGA - 66 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | Active | 3 (168 Hours) | 100°C | -40°C | 100MHz | A2F500M3G | 1.5V | Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 13.5kB | 16.5mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | Ethernet, I2C, SPI, UART/USART | 400 kbps | MCU, FPGA | 5500 | ARM | 500000 | 100MHz | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | RoHS Compliant | ||||||||||||||||||||||||||||||||
 | Mfr Part No M2S010-TQ144I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | OBSOLETE (Last Updated: 2 days ago) | 144-LQFP | YES | 84 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | NOT SPECIFIED | S-PQFP-G144 | 84 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 84 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 256KB | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | ||||||||||||||||||||||||
 | Mfr Part No M2S050TS-VFG400 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 400-LFBGA | YES | 207 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 400 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B400 | 207 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 207 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 256KB | 1.51mm | 17mm | 17mm | RoHS Compliant | ||||||||||||||||||||||||
 | Mfr Part No M2S050TS-FGG484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B484 | 267 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 256KB | 2.44mm | 23mm | 23mm | RoHS Compliant | ||||||||||||||||||||||||
| Mfr Part No M2S060TS-VFG400 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 400-LFBGA | YES | 207 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 400 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B400 | 207 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 207 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 1.51mm | 17mm | 17mm | RoHS Compliant | ||||||||||||||||||||||||
 | Mfr Part No M2S060-FGG676I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 3 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 676-BGA | YES | 387 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 676 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B676 | 387 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 387 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 2.44mm | 27mm | 27mm | RoHS Compliant | ||||||||||||||||||||||||
| Mfr Part No M2S060T-VFG400I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 400-LFBGA | YES | 207 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 400 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B400 | 207 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 207 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 1.51mm | 17mm | 17mm | RoHS Compliant | ||||||||||||||||||||||||
| Mfr Part No M2S060-1VFG400I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 400-LFBGA | YES | 207 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 400 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B400 | 207 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 207 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 1.51mm | 17mm | 17mm | RoHS Compliant | ||||||||||||||||||||||||
| Mfr Part No M2S025TS-1VFG256T2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 256-LBGA | 138 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, SmartFusion®2 | yes | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 256KB | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-FGG484I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BGA | YES | 267 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B484 | 267 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 2.44mm | 23mm | 23mm | RoHS Compliant | ||||||||||||||||||||||||
| Mfr Part No M2S060T-FGG676 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | 387 | 0°C~85°C TJ | Tray | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 676 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B676 | 387 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 387 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 2.44mm | 27mm | 27mm | RoHS Compliant | |||||||||||||||||||||||||
| Mfr Part No M2S050TS-1VF400I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | 400 | 400-VFBGA (17x17) | 207 | -40°C~100°C TJ | Tray | SmartFusion®2 | Active | 3 (168 Hours) | 100°C | -40°C | 166MHz | M2S050TS | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 50K Logic Modules | 256KB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-1VF400I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 400-LFBGA | YES | 207 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 400 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | NOT SPECIFIED | S-PBGA-B400 | 207 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 207 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||
| Mfr Part No M2S060T-1FGG484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B484 | 267 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 2.44mm | 23mm | 23mm | RoHS Compliant | ||||||||||||||||||||||||
| Mfr Part No M2S060T-1VFG400I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 400-LFBGA | YES | 400 | 207 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 400 | MATTE TIN | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | 207 | Not Qualified | 1.2V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 60K Logic Modules | 56520 | 256KB | RoHS Compliant | ||||||||||||||||||||||||||||||
 | Mfr Part No M2S090T-FCSG325 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 325-TFBGA, CSPBGA | YES | 180 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 325 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | NOT SPECIFIED | R-PBGA-B325 | 180 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | 1.16mm | 13.5mm | 11mm | RoHS Compliant | |||||||||||||||||||||||
| Mfr Part No M2S060TS-FG484I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BGA | YES | 267 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | NOT SPECIFIED | S-PBGA-B484 | 267 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||||||||||||
| Mfr Part No M2S060TS-1FGG676 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | 387 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 676 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B676 | 387 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 387 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 2.44mm | 27mm | 27mm | RoHS Compliant |
-
A2F060M3E-FG256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-PQG208I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-1PQG208I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-TQ144I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050TS-VFG400
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050TS-FGG484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-VFG400
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060-FGG676I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060T-VFG400I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060-1VFG400I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025TS-1VFG256T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060T-FGG484I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060T-FGG676
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050TS-1VF400I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060T-1VF400I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060T-1FGG484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060T-1VFG400I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090T-FCSG325
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-FG484I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-1FGG676
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire