The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Number of Inputs | Programmable Logic Type | Core Architecture | Primary Attributes | Number of Logic Cells | Flash Size | Height Seated (Max) | Length | Width | RoHS Status |
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 | Mfr Part No IB899F-370 | iBASE Technology | Datasheet | - | - | Min: 1 Mult: 1 | Active | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IB906F-1G | iBASE Technology | Datasheet | - | - | Min: 1 Mult: 1 | Active | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IB916F-7100 | iBASE Technology | Datasheet | - | - | Min: 1 Mult: 1 | Active | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IB903F-Q2G | iBASE Technology | Datasheet | - | - | Min: 1 Mult: 1 | Active | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IB899F-371 | iBASE Technology | Datasheet | - | - | Min: 1 Mult: 1 | Active | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IB915AF-6600 | iBASE Technology | Datasheet | - | - | Min: 1 Mult: 1 | Active | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IB908AF-4650 | iBASE Technology | Datasheet | - | - | Min: 1 Mult: 1 | Active | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IB899F-300 | iBASE Technology | Datasheet | - | - | Min: 1 Mult: 1 | Active | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IB909AF-5650 | iBASE Technology | Datasheet | - | - | Min: 1 Mult: 1 | Active | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M2S010T-VFG256 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 256-LBGA | YES | 256 | 138 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 256 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | 138 | Not Qualified | 1.2V | 1.26V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | 1.56mm | 14mm | 14mm | RoHS Compliant | |||||||||||||||
 | Mfr Part No M2S150T-FCG1152I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 1152-BBGA, FCBGA | YES | 574 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 4 (72 Hours) | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B1152 | 574 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 574 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | 2.9mm | 35mm | 35mm | RoHS Compliant | ||||||||||||||
| Mfr Part No M2S010T-VF256 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 256-LFBGA | YES | 138 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | NOT SPECIFIED | S-PBGA-B256 | 138 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | ||||||||||||
| Mfr Part No M2S010-VF256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 2 days ago) | 256-LFBGA | YES | 138 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | NOT SPECIFIED | S-PBGA-B256 | 138 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||
 | Mfr Part No M2S005S-1FGG484T2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 209 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, SmartFusion®2 | yes | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 128KB | RoHS Compliant | |||||||||||||||||||||||||||||||||
| Mfr Part No M2S010T-1VFG256 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 256-LBGA | YES | 138 | 0°C~85°C TJ | Tray | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 256 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B256 | 138 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | 1.56mm | 14mm | 14mm | RoHS Compliant | ||||||||||||||
| Mfr Part No M2S010T-VF256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 256-LFBGA | YES | 138 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | NOT SPECIFIED | S-PBGA-B256 | 138 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | ||||||||||||
| Mfr Part No M2S010T-1FGG484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 484-FPBGA (23x23) | 233 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | Active | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S010T | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 10K Logic Modules | 256KB | RoHS Compliant | |||||||||||||||||||||||||||||
| Mfr Part No M2S010TS-FG484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 484-BGA | YES | 233 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | NOT SPECIFIED | S-PBGA-B484 | 233 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 233 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||
 | Mfr Part No M2S010T-1VF400 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 400-LFBGA | 400 | 400-VFBGA (17x17) | 195 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | Active | 3 (168 Hours) | 85°C | 0°C | 166MHz | M2S010T | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 10K Logic Modules | 256KB | Non-RoHS Compliant | ||||||||||||||||||||||||||||
| Mfr Part No M2S010TS-1FGG484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 484-BGA | 484-FPBGA (23x23) | 233 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | Active | 3 (168 Hours) | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 256KB | RoHS Compliant |
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IB899F-370
iBASE Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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IB906F-1G
iBASE Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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IB916F-7100
iBASE Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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IB903F-Q2G
iBASE Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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IB899F-371
iBASE Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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IB915AF-6600
iBASE Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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IB908AF-4650
iBASE Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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IB899F-300
iBASE Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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IB909AF-5650
iBASE Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010T-VFG256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150T-FCG1152I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010T-VF256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010-VF256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005S-1FGG484T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010T-1VFG256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010T-VF256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010T-1FGG484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010TS-FG484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010T-1VF400
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010TS-1FGG484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire