The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Number of Inputs | Programmable Logic Type | Core Architecture | Speed Grade | Primary Attributes | Number of Logic Cells | Flash Size | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No M2S090-1FCSG325I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 325-TFBGA, CSPBGA | YES | 325 | 180 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 325 | MATTE TIN | LG-MIN, WD-MIN | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | NOT SPECIFIED | 180 | Not Qualified | 1.2V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 90K Logic Modules | 512KB | RoHS Compliant | ||||||||||||||||||||
 | Mfr Part No M2S090-FGG484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | YES | 484 | 267 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 166MHz | NOT SPECIFIED | M2S090 | 267 | Not Qualified | 1.2V | 1.26V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | ARM | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 23mm | 23mm | RoHS Compliant | |||||||||||||
 | Mfr Part No M2S060-1FGG676I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 676-BGA | YES | 387 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 676 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B676 | 387 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 387 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 2.44mm | 27mm | 27mm | RoHS Compliant | ||||||||||||||
 | Mfr Part No M2S050TS-FG896I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 896-BGA | YES | 377 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 896 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | NOT SPECIFIED | S-PBGA-B896 | 377 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 377 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 256KB | 2.44mm | 31mm | 31mm | Non-RoHS Compliant | |||||||||||||
| Mfr Part No M2S060-FGG484I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 484-BGA | YES | 267 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B484 | 267 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 2.44mm | 23mm | 23mm | RoHS Compliant | ||||||||||||||
| Mfr Part No M2S060TS-1FG676I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | 387 | -40°C~100°C TJ | Tray | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 676 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | NOT SPECIFIED | S-PBGA-B676 | 387 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 387 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | ||||||||||||||
 | Mfr Part No M2S060TS-1VFG400T2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | 207 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, SmartFusion®2 | yes | Active | 3 (168 Hours) | NOT SPECIFIED | NOT SPECIFIED | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 256KB | RoHS Compliant | ||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-FCSG325I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 325-TFBGA, CSPBGA | YES | 180 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 325 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | NOT SPECIFIED | R-PBGA-B325 | 180 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | 1.16mm | 13.5mm | 11mm | RoHS Compliant | |||||||||||||
| Mfr Part No M2S090TS-1FCS325I | Microsemi Corporation | Datasheet | 8000 | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 325-TFBGA, CSPBGA | YES | 325 | 180 | -40°C~100°C TJ | Tray | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | NOT SPECIFIED | 180 | Not Qualified | 1.2V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 90K Logic Modules | 512KB | Non-RoHS Compliant | ||||||||||||||||||||
| Mfr Part No M2S060-VFG400I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 6 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 400-LFBGA | YES | 207 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 400 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B400 | 207 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 207 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 1.51mm | 17mm | 17mm | RoHS Compliant | ||||||||||||||
| Mfr Part No M2S060TS-1FCSG325I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 325-TFBGA, CSPBGA | YES | 200 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 325 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | NOT SPECIFIED | S-PBGA-B325 | 200 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 200 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 1.01mm | 11mm | 11mm | RoHS Compliant | |||||||||||||
| Mfr Part No M2S090T-1FGG484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 166MHz | NOT SPECIFIED | M2S090T | S-PBGA-B484 | 267 | Not Qualified | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | ARM | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 23mm | 23mm | RoHS Compliant | |||||||||||
| Mfr Part No M2S060-1VF400I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 400-LFBGA | YES | 207 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 400 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | NOT SPECIFIED | S-PBGA-B400 | 207 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 207 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 1.51mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||
| Mfr Part No M2S050TS-1VFG400I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | 400 | 400-VFBGA (17x17) | 207 | -40°C~100°C TJ | Tray | SmartFusion®2 | Active | 3 (168 Hours) | 100°C | -40°C | 166MHz | M2S050TS | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 50K Logic Modules | 256KB | RoHS Compliant | ||||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-1FCSG325I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 325-TFBGA, CSPBGA | YES | 180 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 325 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | NOT SPECIFIED | R-PBGA-B325 | 180 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | 1.16mm | 13.5mm | 11mm | RoHS Compliant | |||||||||||||
| Mfr Part No M2S150-FCV484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BFBGA | YES | 273 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | NOT SPECIFIED | S-PBGA-B484 | 273 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 273 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | 3.15mm | 19mm | 19mm | Non-RoHS Compliant | ||||||||||||
| Mfr Part No M2S050T-FGG896I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 896-BGA | YES | 377 | -40°C~100°C TJ | Tray | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 896 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B896 | 377 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 377 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 256KB | 2.44mm | 31mm | 31mm | RoHS Compliant | |||||||||||||||
| Mfr Part No M2S090TS-FG676I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | 425 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 676 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | NOT SPECIFIED | S-PBGA-B676 | 425 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 425 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||
| Mfr Part No M2S150-1FCV484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BFBGA | YES | 273 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | NOT SPECIFIED | S-PBGA-B484 | 273 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 273 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | 3.15mm | 19mm | 19mm | Non-RoHS Compliant | ||||||||||||
| Mfr Part No M2S090T-1FGG676 | Microsemi Corporation | Datasheet | 1760 | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | 425 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 676 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 166MHz | NOT SPECIFIED | M2S090T | S-PBGA-B676 | 425 | Not Qualified | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 425 | FIELD PROGRAMMABLE GATE ARRAY | ARM | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 27mm | 27mm | RoHS Compliant |
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M2S090-1FCSG325I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090-FGG484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060-1FGG676I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050TS-FG896I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060-FGG484I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-1FG676I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-1VFG400T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090TS-FCSG325I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090TS-1FCS325I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060-VFG400I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-1FCSG325I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090T-1FGG484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060-1VF400I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050TS-1VFG400I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090TS-1FCSG325I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150-FCV484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050T-FGG896I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090TS-FG676I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150-1FCV484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090T-1FGG676
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire