The category is 'Embedded - System On Chip (SoC)'
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- Series
- Package / Case
- Number of I/Os
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- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Data Rate | Architecture | Number of Inputs | Organization | Programmable Logic Type | Number of Logic Elements/Cells | Core Architecture | Number of Gates | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Primary Attributes | Number of Registers | Number of Logic Cells | Number of Equivalent Gates | Flash Size | Height | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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![]() | Mfr Part No M2S005-1VFG256 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 256-LBGA | YES | 161 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 256 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B256 | 161 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 161 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | 1.56mm | 14mm | 14mm | RoHS Compliant | |||||||||||||||||||||||||||||
![]() | Mfr Part No M2S005S-1FG484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 484-FPBGA (23x23) | 209 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | Active | 3 (168 Hours) | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 128KB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S005S-1VFG400I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 400-LFBGA | 400 | 400-VFBGA (17x17) | 169 | -40°C~100°C TJ | Tray | 2016 | SmartFusion®2 | Active | 3 (168 Hours) | 100°C | -40°C | 166MHz | M2S005S | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 5K Logic Modules | 128KB | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A2F200M3F-1PQG208 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 208-BFQFP | 208 | 208-PQFP (28x28) | MCU - 22, FPGA - 66 | 0°C~85°C TJ | Tray | 2013 | SmartFusion® | Active | 3 (168 Hours) | 85°C | 0°C | 100MHz | A2F200 | 1.5V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 4.5kB | 7mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | 400 kbps | MCU, FPGA | 2500 | ARM | 200000 | 100MHz | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | RoHS Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A2F060M3E-1TQG144 | Microsemi Corporation | Datasheet | 666 | - | Min: 1 Mult: 1 | 144-LQFP | 144 | 144-TQFP (20x20) | 1.319103g | MCU - 21, FPGA - 33 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | Obsolete | 3 (168 Hours) | 85°C | 0°C | 100MHz | A2F060M3E | 1.5V | EBI/EMI, I2C, SPI, UART, USART | 1.575V | 1.425V | 100MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | 1 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 1536 | 128KB | 1.4mm | 20mm | 20mm | No | RoHS Compliant | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S150T-1FC1152M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | IN PRODUCTION (Last Updated: 3 weeks ago) | 1152-BBGA, FCBGA | YES | 574 | -55°C~125°C TJ | Tray | SmartFusion®2 | e0 | Active | 4 (72 Hours) | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | NOT SPECIFIED | S-PBGA-B1152 | 574 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 574 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | 2.9mm | 35mm | 35mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||
![]() | Mfr Part No A2F060M3E-1FGG256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | YES | 256 | MCU - 26, FPGA - 66 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | e1 | Obsolete | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 250 | 1.5V | 1mm | 100MHz | 30 | A2F060M3E | 66 | Not Qualified | 1.575V | 1.425V | EBI/EMI, I2C, SPI, UART, USART | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | 1536 CLBS, 60000 GATES | FIELD PROGRAMMABLE GATE ARRAY | ARM | 8 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 60000 | 128KB | 1.7mm | 17mm | 17mm | RoHS Compliant | ||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S025TS-1FG484M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 484-BGA | YES | 267 | -55°C~125°C TJ | Tray | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | NOT SPECIFIED | S-PBGA-B484 | 267 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 256KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS027E2F29E1SG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 780-BBGA, FCBGA | YES | 360 | 0°C~100°C TJ | Tray | Arria 10 SX | Discontinued | 3 (168 Hours) | 780 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B780 | 360 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 270K Logic Elements | 270000 | 3.35mm | 29mm | 29mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BCM3218SF02 | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | Active | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BCM58101LB2KFBG | Broadcom Limited | Datasheet | 2183 | - | Min: 1 Mult: 1 | Active | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BCM1125HB0K400G | Broadcom Limited | Datasheet | 4 | - | Min: 1 Mult: 1 | 8 Weeks | Obsolete | 1 (Unlimited) | 400MHz | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 114991695 | Seeed Technology Co., Ltd | Datasheet | - | - | Min: 1 Mult: 1 | 9 Weeks | Module | 48 | -30°C~85°C | Bulk | Sipeed MAIX-I | Active | 1 (Unlimited) | 400MHz | 8MB | RISC-V Dual Core 64bit | DMA, I2S, PWM, WDT | I2C, SPI, UART/USART | MPU | Audio Processor (APU), Neural Network Processor (KPU) | 8MB/16MB/128MB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S005S-1TQG144 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 144-LQFP | YES | 84 | 0°C~85°C TJ | Tray | 2006 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 144 | MATTE TIN | 8542.39.00.01 | QUAD | GULL WING | NOT SPECIFIED | 1.2V | 0.5mm | NOT SPECIFIED | S-PQFP-G144 | 84 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 84 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | 1.6mm | 20mm | 20mm | RoHS Compliant | ||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S025-FCSG325 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 325-TFBGA, CSPBGA | YES | 180 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 325 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | NOT SPECIFIED | S-PBGA-B325 | 180 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 256KB | 1.01mm | 11mm | 11mm | RoHS Compliant | |||||||||||||||||||||||||||||
![]() | Mfr Part No A2F500M3G-1FG256IX94 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 256-LBGA | 256-FPBGA (17x17) | MCU - 25, FPGA - 66 | -40°C~100°C TJ | Tray | SmartFusion® | Active | 3 (168 Hours) | A2F500M3G | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S005S-1TQG144T2 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 144-LQFP | 144-TQFP (20x20) | 213 | 0°C~85°C TJ | Tray | SmartFusion®2 | Active | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S010T-1VF256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 days ago) | 256-LFBGA | YES | 138 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | NOT SPECIFIED | S-PBGA-B256 | 138 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||
![]() | Mfr Part No M2S025T-1VFG256I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 256-LBGA | YES | 138 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 256 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B256 | 138 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 256KB | 1.56mm | 14mm | 14mm | RoHS Compliant | ||||||||||||||||||||||||||||||
![]() | Mfr Part No A2F500M3G-1PQ208 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 208-BFQFP | 208 | 208-PQFP (28x28) | MCU - 22, FPGA - 66 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | Obsolete | 3 (168 Hours) | 85°C | 0°C | 100MHz | A2F500M3G | 1.5V | Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | Ethernet, I2C, SPI, UART/USART | MCU, FPGA | ARM | 100MHz | 24 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | Non-RoHS Compliant |
M2S005-1VFG256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S005S-1FG484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S005S-1VFG400I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
A2F200M3F-1PQG208
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
A2F060M3E-1TQG144
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S150T-1FC1152M
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
A2F060M3E-1FGG256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S025TS-1FG484M
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
10AS027E2F29E1SG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
BCM3218SF02
Broadcom Limited
Package:Embedded - System On Chip (SoC)
Price: please inquire
BCM58101LB2KFBG
Broadcom Limited
Package:Embedded - System On Chip (SoC)
Price: please inquire
BCM1125HB0K400G
Broadcom Limited
Package:Embedded - System On Chip (SoC)
Price: please inquire
114991695
Seeed Technology Co., Ltd
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S005S-1TQG144
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S025-FCSG325
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
A2F500M3G-1FG256IX94
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S005S-1TQG144T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S010T-1VF256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S025T-1VFG256I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
A2F500M3G-1PQ208
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
