The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Number of Inputs | Organization | Programmable Logic Type | Core Architecture | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Primary Attributes | Number of Registers | Number of Logic Cells | Number of Equivalent Gates | Flash Size | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
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 | Mfr Part No M2S010TS-VF256 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 256-LFBGA | YES | 138 | 0°C~85°C TJ | Tray | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 256 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | NOT SPECIFIED | S-PBGA-B256 | 138 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 138 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | 1.56mm | 14mm | 14mm | Non-RoHS Compliant | |||||||||||||||||||||||
 | Mfr Part No M2S025-1FCSG325I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 325-TFBGA, CSPBGA | YES | 180 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 325 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | NOT SPECIFIED | S-PBGA-B325 | 180 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 256KB | 1.01mm | 11mm | 11mm | RoHS Compliant | |||||||||||||||||||||||
 | Mfr Part No M2S010TS-1FGG484I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | 484-FPBGA (23x23) | 233 | -40°C~100°C TJ | Tray | 2016 | SmartFusion®2 | Active | 3 (168 Hours) | 100°C | -40°C | 166MHz | M2S010TS | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 10K Logic Modules | 256KB | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-FCSG325 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 325-TFBGA, CSPBGA | YES | 180 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 325 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | NOT SPECIFIED | S-PBGA-B325 | 180 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 256KB | 1.01mm | 11mm | 11mm | RoHS Compliant | |||||||||||||||||||||||
 | Mfr Part No A2F060M3E-TQ144 | Microsemi Corporation | Datasheet | 665 | - | Min: 1 Mult: 1 | 2 Weeks | 144-LQFP | YES | MCU - 21, FPGA - 33 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | e0 | Obsolete | 3 (168 Hours) | 144 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | 225 | 1.5V | 0.5mm | 80MHz | 20 | A2F060M3E | S-PQFP-G144 | 33 | Not Qualified | 1.575V | 1.51.82.53.3V | 1.425V | EBI/EMI, I2C, SPI, UART, USART | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | 33 | 1536 CLBS, 60000 GATES | FIELD PROGRAMMABLE GATE ARRAY | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 60000 | 128KB | 1.6mm | 20mm | 20mm | Non-RoHS Compliant | ||||||||||||||||||||
| Mfr Part No A2F060M3E-TQG144 | Microsemi Corporation | Datasheet | 664 | - | Min: 1 Mult: 1 | 12 Weeks | 144-LQFP | 144-TQFP (20x20) | MCU - 21, FPGA - 33 | 0°C~85°C TJ | Tray | 2000 | SmartFusion® | Obsolete | 3 (168 Hours) | 85°C | 0°C | 80MHz | A2F060M3E | EBI/EMI, I2C, SPI, UART, USART | 80MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1FG256 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256 | 256-FPBGA (17x17) | MCU - 26, FPGA - 66 | 0°C~85°C TJ | Tray | 2009 | SmartFusion® | Obsolete | 3 (168 Hours) | 85°C | 0°C | 100MHz | A2F060M3E | 1.5V | EBI/EMI, I2C, SPI, UART, USART | 100MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | 100MHz | 8 | 1 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 1536 | 128KB | No | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1TQ144I | Microsemi Corporation | Datasheet | 669 | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | MCU - 21, FPGA - 33 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | Obsolete | 3 (168 Hours) | 100°C | -40°C | 100MHz | A2F060M3E | EBI/EMI, I2C, SPI, UART, USART | 100MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-FG256 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 2 Weeks | Surface Mount | 256-LBGA | 256 | 256-FPBGA (17x17) | MCU - 26, FPGA - 66 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | Obsolete | 3 (168 Hours) | 85°C | 0°C | 80MHz | A2F060M3E | 1.5V | EBI/EMI, I2C, SPI, UART, USART | 1.575V | 1.425V | 80MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | 100MHz | 8 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-TQ144I | Microsemi Corporation | Datasheet | 668 | - | Min: 1 Mult: 1 | 12 Weeks | 144-LQFP | 144-TQFP (20x20) | MCU - 21, FPGA - 33 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | Obsolete | 3 (168 Hours) | 100°C | -40°C | 80MHz | A2F060M3E | EBI/EMI, I2C, SPI, UART, USART | 80MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No A2F500M3G-1CSG288I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 288-TFBGA, CSPBGA | YES | MCU - 31, FPGA - 78 | -40°C~100°C TJ | Tray | 2013 | SmartFusion® | e1 | Active | 3 (168 Hours) | 288 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.5V | 0.5mm | 100MHz | 30 | A2F500M3G | S-PBGA-B288 | 78 | Not Qualified | 1.5V | 1.51.82.53.3V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | 78 | 11520 CLBS, 500000 GATES | FIELD PROGRAMMABLE GATE ARRAY | ARM | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 500000 | 512KB | 1.05mm | 11mm | 11mm | RoHS Compliant | |||||||||||||||||||
| Mfr Part No A2F060M3E-1FG256M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256 | MCU - 26, FPGA - 66 | -55°C~125°C TJ | Tray | SmartFusion® | Obsolete | 3 (168 Hours) | 8542.39.00.01 | unknown | 100MHz | A2F060M3E | EBI/EMI, I2C, SPI, UART, USART | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M2S150TS-1FC1152M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | IN PRODUCTION (Last Updated: 1 month ago) | 1152-BBGA, FCBGA | YES | 574 | -55°C~125°C TJ | Tray | 2016 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | NOT SPECIFIED | S-PBGA-B1152 | 574 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 574 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | 2.9mm | 35mm | 35mm | Non-RoHS Compliant | |||||||||||||||||||||||
| Mfr Part No M2S150T-1FCG1152M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | IN PRODUCTION (Last Updated: 3 weeks ago) | 1152-BBGA, FCBGA | YES | 574 | -55°C~125°C TJ | Tray | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 3A001.A.2.C | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B1152 | 574 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 574 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | 2.9mm | 35mm | 35mm | RoHS Compliant | |||||||||||||||||||||||||
 | Mfr Part No A2F500M3G-1PQ208I | Microsemi Corporation | Datasheet | 8 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 208-BFQFP | 208 | 208-PQFP (28x28) | MCU - 22, FPGA - 66 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | Obsolete | 3 (168 Hours) | 100°C | -40°C | 100MHz | A2F500M3G | 1.5V | Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | Ethernet, I2C, SPI, UART/USART | MCU, FPGA | ARM | 100MHz | 24 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||
| Mfr Part No M2S150TS-1FCG1152M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | IN PRODUCTION (Last Updated: 1 month ago) | 1152-BBGA, FCBGA | YES | 574 | -55°C~125°C TJ | Tray | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 3A001.A.2.C | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B1152 | 574 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 574 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | 2.9mm | 35mm | 35mm | RoHS Compliant | |||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1PQ208 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 208-BFQFP | 208 | 208-PQFP (28x28) | MCU - 22, FPGA - 66 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | Obsolete | 3 (168 Hours) | 85°C | 0°C | 100MHz | A2F200 | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | ARM | 100MHz | 8 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010S-TQ144I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | OBSOLETE (Last Updated: 1 month ago) | 144-LQFP | 144-TQFP (20x20) | 84 | -40°C~100°C TJ | Tray | SmartFusion®2 | Obsolete | 3 (168 Hours) | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 256KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090T-FGG484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 166MHz | NOT SPECIFIED | M2S090T | S-PBGA-B484 | 267 | Not Qualified | 1.26V | 1.2V | 1.14V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | ARM | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 23mm | 23mm | RoHS Compliant | ||||||||||||||||||||
 | Mfr Part No M2S090T-FGG676I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | 425 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 676 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B676 | 425 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 425 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 27mm | 27mm | RoHS Compliant |
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M2S010TS-VF256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025-1FCSG325I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010TS-1FGG484I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025T-FCSG325
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F060M3E-TQ144
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F060M3E-TQG144
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F060M3E-1FG256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F060M3E-1TQ144I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F060M3E-FG256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F060M3E-TQ144I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F500M3G-1CSG288I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F060M3E-1FG256M
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150TS-1FC1152M
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150T-1FCG1152M
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F500M3G-1PQ208I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150TS-1FCG1152M
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F200M3F-1PQ208
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010S-TQ144I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090T-FGG484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090T-FGG676I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire