The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Base Product Number | Core | Data RAM Size | Device Logic Gates | Factory Pack QuantityFactory Pack Quantity | L1 Cache Data Memory | L1 Cache Instruction Memory | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Package | Product Status | RoHS | Shipping Restrictions | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Size | Propagation Delay | Connectivity | Architecture | Data Bus Width | Number of Inputs | Programmable Logic Type | Core Architecture | Number of Gates | Boundary Scan | Speed Grade | RAM (words) | Primary Attributes | Number of Registers | Number of Logic Cells | Number of Cores | Bus Compatibility | Flash Size | UV Erasable | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
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 | Mfr Part No A2F500M3G-FG484 | Microchip Technology | Datasheet | 2216 |
| Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | A2F500 | ARM Cortex M3 | 64 kB | 500000 | 60 | - | - | 80 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | SMD/SMT | 204 I/O | - | 6000 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion | 1.5000 V | 0 to 85 °C | Tray | A2F500 | 2 mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 500000 | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7Z045-3FFG676E | Xilinx Inc. | Datasheet | 477 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | ROMless | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 1GHz | 30 | XC7Z045 | S-PBGA-B676 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -3 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.37mm | 27mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7Z007S-1CLG400I | Xilinx Inc. | Datasheet | 2376 | - | Min: 1 Mult: 1 | 10 Weeks | 400-LFBGA, CSPBGA | YES | 100 | -40°C~100°C TJ | Tray | 2016 | Zynq®-7000 | e3 | yes | Active | 3 (168 Hours) | 400 | Matte Tin (Sn) | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | NOT SPECIFIED | S-PBGA-B400 | 1.05V | 0.95V | 667MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 667MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | YES | 256000 | Artix™-7 FPGA, 23K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.6mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7Z012S-2CLG485E | Xilinx Inc. | Datasheet | 784 |
| Min: 1 Mult: 1 | 10 Weeks | 484-LFBGA, CSPBGA | YES | 150 | 0°C~100°C TJ | Tray | 2016 | Zynq®-7000 | e3 | yes | Active | 3 (168 Hours) | 485 | Matte Tin (Sn) | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | NOT SPECIFIED | S-PBGA-B485 | 1.05V | 0.95V | 766MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 800MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | YES | 256000 | Artix™-7 FPGA, 55K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.6mm | 19mm | 19mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7Z007S-1CLG225I | Xilinx Inc. | Datasheet | 1584 |
| Min: 1 Mult: 1 | 10 Weeks | 225-LFBGA, CSPBGA | YES | 54 | -40°C~100°C TJ | Tray | 2016 | Zynq®-7000 | e1 | yes | Active | 3 (168 Hours) | 225 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 0.8mm | 30 | S-PBGA-B225 | 1.05V | 0.95V | 667MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 667MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | YES | 256000 | Artix™-7 FPGA, 23K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.5mm | 13mm | 13mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FG256 | Microchip Technology | Datasheet | 2100 |
| Min: 1 Mult: 1 | FPBGA-256 | 256-FPBGA (17x17) | A2F500 | ARM Cortex M3 | 64 kB | 500000 | 90 | - | - | 80 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | SMD/SMT | 117 I/O | - | 6000 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion | 1.5000 V | 0 to 85 °C | Tray | A2F500 | 2 mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 500000 | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 5CSXFC6D6F31I7N | Intel | Datasheet | 2152 | - | Min: 1 Mult: 1 | 8 Weeks | 896-BGA | YES | MCU - 181, FPGA - 288 | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SX | Active | 3 (168 Hours) | 896 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | NOT SPECIFIED | 5CSXFC6 | S-PBGA-B896 | 288 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | 2mm | 31mm | 31mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 5CSXFC6C6U23C8N | Intel | Datasheet | 2196 | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SX | Active | 3 (168 Hours) | 672 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | 5CSXFC6 | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | 1.85mm | 23mm | 23mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z015-1CLG485I | Xilinx Inc. | Datasheet | 792 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 484-LFBGA, CSPBGA | 485 | 130 | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 485 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | 667MHz | NOT SPECIFIED | Not Qualified | 1.05V | 11.8V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | 256000 | Artix™-7 FPGA, 74K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | N | 1.6mm | 19mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-VFG400I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | VFPBGA-400 | ARM Cortex M3 | 64 kB | 90 | - | - | 166 MHz | Yes | SMD/SMT | 1007 LAB | 12084 LE | Details | This product may require additional documentation to export from the United States. | 0.236569 oz | Tray | SmartFusion2 | 256 kB | 1 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC6C6U23I7N | Intel | Datasheet | 14102 | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SX | Active | 3 (168 Hours) | 672 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | 5CSXFC6 | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | 1.85mm | 23mm | 23mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z030-L2FBG676I | Xilinx Inc. | Datasheet | 1651 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 676-BBGA, FCBGA | 130 | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 800MHz | NOT SPECIFIED | S-PBGA-B676 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | YES | 256000 | Kintex™-7 FPGA, 125K Logic Cells | 157200 | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 27mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z035-3FBG676E | Xilinx Inc. | Datasheet | 792 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 676-BBGA, FCBGA | 130 | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 676 | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 800MHz | NOT SPECIFIED | S-PBGA-B676 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 110 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | YES | 3 | 256000 | Kintex™-7 FPGA, 275K Logic Cells | 343800 | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 27mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7Z035-1FFG900C | Xilinx Inc. | Datasheet | 792 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 900-BBGA, FCBGA | 900-FCBGA (31x31) | 130 | 0°C~85°C TJ | Tray | 2010 | Zynq®-7000 | Active | 4 (72 Hours) | 85°C | 0°C | 667MHz | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 120 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | 1 | Kintex™-7 FPGA, 275K Logic Cells | 343800 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z035-L2FFG900I | Xilinx Inc. | Datasheet | 1008 | - | Min: 1 Mult: 1 | 10 Weeks | 900-BBGA, FCBGA | YES | 130 | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | S-PBGA-B900 | 1.05V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | YES | 256000 | Kintex™-7 FPGA, 275K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.35mm | 31mm | 31mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z030-3FBG676E | Xilinx Inc. | Datasheet | 396 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | 676 | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 1GHz | 30 | XC7Z030 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -3 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 27mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z045-1FFG676C | Xilinx Inc. | Datasheet | 509 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | ROMless | 130 | 0°C~85°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 667MHz | 30 | XC7Z045 | S-PBGA-B676 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -1 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.37mm | 27mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-FGG484 | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | + 85 C | 0 C | Yes | SMD/SMT | 273 I/O | 2308 LAB | 27696 LE | Details | Tray | SmartFusion2 | 1.2 V | 256 kB | 1 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XCZU4EV-1SFVC784E | Xilinx Inc. | Datasheet | 310 | - | Min: 1 Mult: 1 | 11 Weeks | 784-BFBGA, FCBGA | 252 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC5D6F31I7N | Intel | Datasheet | 16234 | - | Min: 1 Mult: 1 | 8 Weeks | 896-BGA | YES | MCU - 181, FPGA - 288 | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SX | Active | 3 (168 Hours) | 896 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | NOT SPECIFIED | 5CSXFC5 | S-PBGA-B896 | 288 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | 2mm | 31mm | 31mm | RoHS Compliant |
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A2F500M3G-FG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
141.311003
-
XC7Z045-3FFG676E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
1,388.444925
-
XC7Z007S-1CLG400I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z012S-2CLG485E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
148.333024
-
XC7Z007S-1CLG225I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
30.827962
-
A2F500M3G-FG256
Microchip Technology
Package:Embedded - System On Chip (SoC)
116.239885
-
5CSXFC6D6F31I7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSXFC6C6U23C8N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z015-1CLG485I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
31.873291
-
M2S010-VFG400I
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSXFC6C6U23I7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z030-L2FBG676I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
246.439568
-
XC7Z035-3FBG676E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
752.005678
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XC7Z035-1FFG900C
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
156.287690
-
XC7Z035-L2FFG900I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z030-3FBG676E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
287.072749
-
XC7Z045-1FFG676C
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
1,786.986655
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M2S025T-FGG484
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU4EV-1SFVC784E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSXFC5D6F31I7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire