The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Automotive | Base Product Number | Core | Data Bus Width (bit) | Data Cache Size | Data RAM Size | Distributed RAM | ECCN (US) | Embedded Block RAM - EBR | Ethernet Speed | EU RoHS | Factory Pack QuantityFactory Pack Quantity | Family Name | HTS | I2C | I2S | Ihs Manufacturer | Instruction Cache Size | Interface Type | L1 Cache Data Memory | L1 Cache Instruction Memory | Lead Shape | Manufacturer Part Number | Maximum Clock Frequency | Maximum Clock Rate (MHz) | Maximum Operating Supply Voltage | Maximum Operating Temperature | Maximum Operating Temperature (°C) | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Minimum Operating Temperature (°C) | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | MSL | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Height | Package Length | Package Shape | Package Style | Package Width | Part Life Cycle Code | PCB changed | PCI | PPAP | Processing Unit | Product Status | Programmability | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Standard Package Name | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Supported PMIC Devices | SVHC | Tradename | Typical Operating Supply Voltage | UART | USART | Watchdog | Operating Temperature | Packaging | Series | JESD-609 Code | Part Status | Type | Terminal Finish | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Type | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Core Architecture | Total RAM Bits | Speed Grade | Voltage - I/O | Primary Attributes | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Number of Logic Cells | Co-Processors/DSP | Number of Cores | Security Features | Display & Interface Controllers | Flash Size | SATA | SPI | CAN | PWM | Device Core | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No M2S005S-1VFG256 | Microchip Technology | Datasheet | 15 |
| Min: 1 Mult: 1 | VFPBGA-256 | 256-FPBGA (17x17) | M2S005 | ARM Cortex M3 | 64 kB | 119 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 161 | 505 LAB | 6060 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S025-FCSG325 | Microchip Technology | Datasheet | 152 |
| Min: 1 Mult: 1 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S025 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S025-FCSG325 | 166 MHz | 1.26 V | Microchip Technology | Yes | 3 | 180 | 2308 LAB | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.78 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 180 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S005-1FGG484 | Microchip Technology | Datasheet | 62 |
| Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S005 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | MSL 3 - 168 hours | 209 | 505 LAB | 6060 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 191Kbit | FPGA - 5K Logic Modules | 1 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S010-1FG484 | Microchip Technology | Datasheet | 4000 | - | Min: 1 Mult: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S010 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S010-1FG484 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | 3 | SMD/SMT | 233 | 1007 LAB | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 10K Logic Modules | 9744 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S060T-1FG676 | Microchip Technology | Datasheet | 2300 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S060 | ARM Cortex M3 | 64 kB | 40 | MICROSEMI CORP | - | - | M2S060T-1FG676 | 166 MHz | Microchip Technology | Yes | 3 | 387 | 4710 LAB | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.88 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B676 | 387 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 387 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S060T-1FG484I | Microchip Technology | Datasheet | 1755 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | M2S060 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | 267 | 4710 LAB | 56520 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion2 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S025-VFG256 | Microchip Technology | Datasheet | 1964 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | M2S025 | ARM Cortex M3 | 64 kB | 119 | MICROSEMI CORP | - | - | M2S025-VFG256 | 166 MHz | Microchip Technology | Yes | 3 | 138 | 2308 LAB | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.78 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B256 | 138 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S050T-FG896 | Microchip Technology | Datasheet | 2154 |
| Min: 1 Mult: 1 | BGA-896 | 896-FBGA (31x31) | M2S050 | ARM Cortex M3 | 64 kB | 1.314 Mbit | 64 kB | 27 | - | - | 166 MHz | + 85 C | Microchip Technology | 0 C | Yes | SMD/SMT | 377 I/O | 4695 LAB | 56340 LE | Tray | Obsolete | N | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No i.MX 6UltraLite | MCIMX6G3CVM05AB | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | - | - | Min: 1 Mult: 1 | No | 5A992C | Compliant | 8542.31.00.01 | Surface Mount | 0.98(Max) | 14 | 14 | 289 | No | MAP-BGA | Yes | Tray | Active | 289 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No ADSP-CM419F | Analog Devices, Inc. | Datasheet | - | - | Min: 1 Mult: 1 | No | 32 | 3A991.a.2 | Compliant | ADSP-CM41xF | 8542.31.00.01 | 1 | 0 | CAN/I2C/SPI/UART | Ball | 240 | 105 | -40 | Surface Mount | 1.01 | 15 | 15 | 210 | 0 | No | Microprocessor | Yes | BGA | CSP-BGA | 4 | 0 | 1 | Tray | Obsolete | Applications Processor | 210 | 160KB | Flash | 1MB | ARM | 0 | 0 | 1 | 1 | 1 | ARM Cortex M4 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6S6AVM08ABR | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | - | - | Min: 1 Mult: 1 | Yes | 32 | 5A992C | 10Mbps/100Mbps/1000Mbps | Compliant | i.MX 6Solo | 8542.31.00.01 | 4 | 3 | CAN/Ethernet/I2C/I2S/SPI/UART/USB | Ball | 800 | 125 | -40 | Surface Mount | 1.16 | 21 | 21 | 624 | Yes | Microprocessor | Yes | BGA | MAP-BGA | 5 | 0 | 2 | Tape and Reel | NRND | Applications Processor | 624 | 128KB | ROM | 96KB | ARM | 1 | 4 | 4 | 2 | 4 | ARM Cortex A9 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MIMXRT1021CAG4AR | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | - | - | Min: 1 Mult: 1 | No | 32 | 16KB | 5A992c. | 10Mbps/100Mbps | Compliant | 8542.31.00.01 | 4 | 0 | 16KB | CAN/Ethernet/I2C/SPI/UART/USB | Gull-wing | 396 | 105 | -40 | Surface Mount | 1.45(Max) | 20 | 20 | 144 | 0 | No | Microprocessor | Yes | QFP | LQFP | 8 | 0 | 1 | Tape and Reel | Active | Applications Processor | 144 | 256KB | ROM | 96KB | ARM | 1 | 1 | 4 | 2 | ARM Cortex M7 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MIMXRT1064DVJ6A | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | - | - | Min: 1 Mult: 1 | No | 32 | 32KB | 5A992C | 10Mbps/100Mbps | Compliant | i.MX | 8542.31.00.01 | 4 | 3 | 32KB | CAN/Ethernet/I2C/I2S/SPI/UART/USB | Ball | 600 | 85 | 0 | Surface Mount | 1.18(Max) | 12 | 12 | 196 | 0 | No | Microcontroller | Yes | BGA | LFBGA | 8 | 0 | Tray | NRND | Applications Processor | 196 | 1MB | Flash | 4MB | ARM | 2 | 1 | 4 | 3 | 4 | ARM Cortex M7 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MSCMMX6XYCM08AA | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | - | - | Min: 1 Mult: 1 | No | 32 | 32KB|16KB | 5A992 | Compliant | i.MX 6SoloX | 8542.31.00.01 | 4 | 5 | 32KB|16KB | CAN/Ethernet/I2C/I2S/SPI/UART/USB | Ball | 800 | 105 | -40 | Surface Mount | 0.73(Max) | 13 | 13 | 265 | 0 | No | Microprocessor | Yes | BGA | BGA | MMPF0100 | 6 | 0 | Obsolete | Applications Processor | 265 | 96KB | ARM | 1 | 2 | 5 | 2 | ARM Cortex A9|ARM Cortex M4 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6X2CVN08AB | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | 160 |
| Min: 1 Mult: 1 | 400-LFBGA | 400-MAPBGA (17x17) | No | 32 | 16KB|32KB | 5A992c. | 10Mbps/100Mbps/1000Mbps | Compliant | i.MX 6SoloX | 8542.31.00.01 | 4 | 3 | 16KB|32KB | CAN/Ethernet/I2C/I2S/SPI/UART/USB | Ball | 800/227 | 105 | Freescale Semiconductor | -40 | Surface Mount | Bulk | 1.12 | 17 | 17 | 400 | 0 | No | Microprocessor | Active | Yes | BGA | PBGA | 6 | 0 | 3 | -40°C ~ 105°C (TA) | Tray | i.MX6SX | NRND | System-On-Chip | 400 | 200MHz, 800MHz | 176KB | ARM® Cortex®-A9, ARM® Cortex®-M4 | ROM | 96KB | ARM | 1.8V, 2.5V, 2.8V, 3.15V | 2 | 2 Core, 32-Bit | Yes | LPDDR2, LVDDR3, DDR3 | 3 | AC97, CAN, I²C, I²S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART | Multimedia; NEON™ MPE | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | Keypad, LCD | - | 5 | 2 | 8 | ARM Cortex M4|ARM Cortex A9 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No i.MX 6SoloX | MCIMX6X4EVM10AB | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | - | - | Min: 1 Mult: 1 | No | 32 | 32KB | 5A992 | 10Mbps/100Mbps/1000Mbps | Compliant | i.MX 6SoloX | 8542.31.00.01 | 4 | 3 | 32KB | CAN/Ethernet/I2C/I2S/SPI/UART/USB | 1000/200 | 105 | -20 | Surface Mount | 1.18(Max) | 19 | 19 | 529 | 0 | No | Microprocessor | Yes | MAP-BGA | 6 | 0 | 3 | Tray | Active | System-On-Chip | 529 | 176KB | ROM | 96KB | ARM | 2 | 3 | 5 | 2 | 8 | ARM Cortex A9|ARM Cortex M4 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No i.MX 8MDual | MiMX8MD6CVAHZAA | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | - | - | Min: 1 Mult: 1 | No | 32 | 32KB | 5A992C | Compliant | 8542.31.00.01 | 4 | 0 | 32KB | Ethernet/I2C/SPI/UART/USB | 1300 | 105 | -40 | Surface Mount | 1.73 | 17 | 17 | 621 | 2 | No | Microcontroller | Yes | FBGA | 4 | 0 | Applications Processor | 621 | 160KB | ROM | 128KB | ARM | 1 | 2 | 3 | 0 | ARM Cortex A53|ARM Cortex M4 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCIMX6QP7CVT8AB | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | 29 |
| Min: 1 Mult: 1 | No | 32 | 32KB | 5A992c. | 10Mbps/100Mbps/1000Mbps | Compliant | i.MX 6Quad | 8542.31.00.01 | 3 | 1 | 32KB | CAN/Ethernet/I2C/I2S/SPI/UART/USB | Ball | 800 | 105 | -40 | Surface Mount | 1.6 | 21 | 21 | 624 | 1 | No | Yes | FBGA | Yes | 5 | 0 | 2 | Tray | Active | Applications Processor | 624 | 16KB | ROM | 96KB | ARM | 1 | 4 | 5 | 2 | ARM Cortex A9 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PIMX8QM5AVUDDAA | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | - | - | Min: 1 Mult: 1 | Unknown | Supplier Unconfirmed | 8542.31.00.01 | Unknown | Unconfirmed | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No i.MX RT1050 | MIMXRT1052CVL5B | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | - | - | Min: 1 Mult: 1 | No | 32 | 32KB | 5A992 | Compliant | 8542.31.00.01 | 4 | 0 | 32KB | CAN/Ethernet/I2C/SPI/UART/USB | 528 | 105 | -40 | Surface Mount | 1.27(Max) | 10 | 10 | 196 | 0 | No | Microprocessor | Yes | MAP-BGA | 8 | 0 | Tray | Preliminary | Applications Processor | 196 | 512KB | ROM | 96KB | ARM | 1 | 2 | 4 | 2 | ARM Cortex M7 |
M2S005S-1VFG256
Microchip Technology
Package:Embedded - System On Chip (SoC)
41.903247
M2S025-FCSG325
Microchip Technology
Package:Embedded - System On Chip (SoC)
67.240402
M2S005-1FGG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
49.040818
M2S010-1FG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S060T-1FG676
Microchip Technology
Package:Embedded - System On Chip (SoC)
259.345635
M2S060T-1FG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S025-VFG256
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S050T-FG896
Microchip Technology
Package:Embedded - System On Chip (SoC)
185.008912
i.MX 6UltraLite | MCIMX6G3CVM05AB
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - System On Chip (SoC)
Price: please inquire
ADSP-CM419F
Analog Devices, Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
MCIMX6S6AVM08ABR
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - System On Chip (SoC)
Price: please inquire
MIMXRT1021CAG4AR
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - System On Chip (SoC)
Price: please inquire
MIMXRT1064DVJ6A
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - System On Chip (SoC)
Price: please inquire
MSCMMX6XYCM08AA
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - System On Chip (SoC)
Price: please inquire
MCIMX6X2CVN08AB
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - System On Chip (SoC)
44.899444
i.MX 6SoloX | MCIMX6X4EVM10AB
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - System On Chip (SoC)
Price: please inquire
i.MX 8MDual | MiMX8MD6CVAHZAA
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - System On Chip (SoC)
Price: please inquire
MCIMX6QP7CVT8AB
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - System On Chip (SoC)
91.378059
PIMX8QM5AVUDDAA
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - System On Chip (SoC)
Price: please inquire
i.MX RT1050 | MIMXRT1052CVL5B
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - System On Chip (SoC)
Price: please inquire
