The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mount | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Number of Terminations | Temperature Coefficient | Resistance | Composition | Color | Gender | Power (Watts) | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | RAM Size | Cable Length | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Features | Product Category | Height | Height Seated (Max) | Length | Width |
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![]() | Mfr Part No XCZU48DR-1FSVG1517I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | 093090 | Molex | 561 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFB014R24C2E2VAA | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS027H3F35I2SG | ALTERA | Datasheet | 725 |
| Min: 1 Mult: 1 | FBGA-1152 | YES | 1152 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027H3F35I2SG | 1.2 GHz | Yes | SMD/SMT | 384 | 33750 LAB | 270000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965286 | Active | NOT SPECIFIED | 5.43 | Non-Compliant | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||
![]() | Mfr Part No AGFB019R25A3I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | D38999/24MC | TE Connectivity Deutsch Connectors | 480 | Bag | Active | -40°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVC1902-2HSIVSVD1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 0805 (2012 Metric) | 0805 | RN732A | KOA Speer Electronics, Inc. | 726 | Tape & Reel (TR) | Obsolete | -55°C ~ 155°C | RN73 | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±0.1% | 2 | ±50ppm/°C | 48.1 kOhms | Thin Film | 0.1W, 1/10W | 800MHz, 1.65GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | Moisture Resistant | 0.024 (0.60mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVC1802-1MLIVSVD1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | Panduit Corp | 692 | Bulk | Obsolete | -40°C ~ 100°C (TJ) | * | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFA014R24C2I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Base | - | - | Intel | 744 | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | Agilex F | 240 V | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | 0 m | 0 m | 0 m | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC7Z030-2FBG676I | AMD | Datasheet | 2224 |
| Min: 1 Mult: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | XC7Z030 | AMD | 130 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFA023R25A3E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU9EG-2FFVC900E | AMD | Datasheet | 668 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU9 | AMD | 204 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | Black | 533MHz, 600MHz, 1.3GHz | 256KB | 762 mm | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFB014R24C3E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No I.MX 6QUAD / MCIMX6Q6AVT10AE | NXP | Datasheet | - | - | Min: 1 Mult: 1 | Non-Compliant | Female | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFC019R25A2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No CYW54591RKUBGT | Cypress | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFB012R24B2I3V | Intel | Datasheet | 726 |
| Min: 1 Mult: 1 | - | - | Intel | 768 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS016E4F27I3LG | ALTERA | Datasheet | 512 |
| Min: 1 Mult: 1 | 0805 (2012 Metric) | YES | 0805 | 672 | RN732A | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS016E4F27I3LG | 1.2 GHz | KOA Speer Electronics, Inc. | Yes | SMD/SMT | 240 | 20000 LAB | 160000 LE | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA672,26X26,40 | BGA672,26X26,40 | SQUARE | GRID ARRAY | 964721 | Active | Obsolete | NOT SPECIFIED | 5.47 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -55°C ~ 155°C | Tray | RN73 | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±0.1% | Active | 2 | ±5ppm/°C | 56 kOhms | Thin Film | 0.1W, 1/10W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B672 | 240 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 160K Logic Elements | 160000 | 2 Core | -- | Moisture Resistant | SoC FPGA | 0.024 (0.60mm) | 27 mm | 27 mm | ||||||||||
![]() | Mfr Part No MCIMX7S3DVK08SB | NXP | Datasheet | - | - | Min: 1 Mult: 1 | C&K | Bulk | Obsolete | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVE1752-1MSIVSVA1596 | AMD | Datasheet | 580 |
| Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | AMD | 500 | Tray | Active | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1402-2MSIVSVF1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 800 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFA027R24C3E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - |
XCZU48DR-1FSVG1517I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
AGFB014R24C2E2VAA
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
10AS027H3F35I2SG
ALTERA
Package:Embedded - System On Chip (SoC)
2,087.320778
AGFB019R25A3I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVC1902-2HSIVSVD1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVC1802-1MLIVSVD1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
AGFA014R24C2I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
XC7Z030-2FBG676I
AMD
Package:Embedded - System On Chip (SoC)
382.285832
AGFA023R25A3E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU9EG-2FFVC900E
AMD
Package:Embedded - System On Chip (SoC)
3,907.933500
AGFB014R24C3E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
I.MX 6QUAD / MCIMX6Q6AVT10AE
NXP
Package:Embedded - System On Chip (SoC)
Price: please inquire
AGFC019R25A2E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
CYW54591RKUBGT
Cypress
Package:Embedded - System On Chip (SoC)
Price: please inquire
AGFB012R24B2I3V
Intel
Package:Embedded - System On Chip (SoC)
9,654.120839
10AS016E4F27I3LG
ALTERA
Package:Embedded - System On Chip (SoC)
902.234696
MCIMX7S3DVK08SB
NXP
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVE1752-1MSIVSVA1596
AMD
Package:Embedded - System On Chip (SoC)
19,628.657538
XCVM1402-2MSIVSVF1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
AGFA027R24C3E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
