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Embedded - System On Chip (SoC) (6000)

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Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Factory Lead Time	Lifecycle Status	Contact Plating	Mount	Package / Case	Surface Mount	Supplier Device Package	Number of Terminals	Base Product Number	Clock Frequency-Max	Core	Data RAM Size	Distributed RAM	Embedded Block RAM - EBR	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	L1 Cache Data Memory	L1 Cache Instruction Memory	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Supply Voltage	Maximum Operating Temperature	Memory Types	Mfr	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Typical Operating Supply Voltage	Unit Weight	Operating Temperature	Packaging	Published	Series	JESD-609 Code	Pbfree Code	Part Status	Moisture Sensitivity Level (MSL)	Number of Terminations	ECCN Code	Terminal Finish	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Supply Voltage	Terminal Pitch	Reach Compliance Code	Frequency	Time@Peak Reflow Temperature-Max (s)	Base Part Number	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Temperature Grade	Supply Voltage-Min (Vsup)	Interface	Max Supply Voltage	Min Supply Voltage	Speed	RAM Size	Core Processor	Peripherals	Program Memory Size	Propagation Delay	Connectivity	Architecture	Data Bus Width	Number of Inputs	Organization	Seated Height-Max	Programmable Logic Type	Core Architecture	Number of Gates	Boundary Scan	Speed Grade	RAM (words)	Primary Attributes	Number of Registers	Number of CLBs	Number of Logic Cells	Number of Cores	Bus Compatibility	Number of Equivalent Gates	Flash Size	Height Seated (Max)	Length	Width	Radiation Hardening	RoHS Status
Mfr Part No 5CSXFC6D6F31C7N	Intel	Datasheet	1766 In Stock	-	Min: 1 Mult: 1	8 Weeks				896-BGA	YES																								MCU - 181, FPGA - 288																								0°C~85°C TJ	Tray	2018	Cyclone® V SX			Active	3 (168 Hours)	896						BOTTOM	BALL	NOT SPECIFIED	1.1V	1mm			NOT SPECIFIED	5CSXFC6	S-PBGA-B896	288	Not Qualified		1.13V	1.11.2/3.32.5V		1.07V				800MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		288			FIELD PROGRAMMABLE GATE ARRAY						FPGA - 110K Logic Elements			110000					2mm	31mm	31mm		RoHS Compliant
Mfr Part No 5CSEBA4U19C8SN	Intel	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks				484-FBGA	YES																								MCU - 151, FPGA - 66																								0°C~85°C TJ	Tray	2018	Cyclone® V SE			Active	3 (168 Hours)	484						BOTTOM	BALL	NOT SPECIFIED	1.1V	0.8mm			NOT SPECIFIED		S-PBGA-B484	66	Not Qualified		1.13V	1.11.2/3.32.5V		1.07V				600MHz	64KB	Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		66			FIELD PROGRAMMABLE GATE ARRAY						FPGA - 40K Logic Elements			40000					1.9mm	19mm	19mm		RoHS Compliant
Mfr Part No 5CSEBA2U19I7SN	Intel	Datasheet	33 In Stock	-	Min: 1 Mult: 1	8 Weeks				484-FBGA	YES																								MCU - 151, FPGA - 66																								-40°C~100°C TJ	Tray	2018	Cyclone® V SE			Active	3 (168 Hours)	484				8542.39.00.01		BOTTOM	BALL	NOT SPECIFIED	1.1V	0.8mm			NOT SPECIFIED	5CSEBA2	S-PBGA-B484	66	Not Qualified		1.13V	1.11.2/3.32.5V		1.07V				800MHz	64KB	Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		66			FIELD PROGRAMMABLE GATE ARRAY						FPGA - 25K Logic Elements			25000					1.9mm	19mm	19mm		RoHS Compliant
Mfr Part No XCZU15EG-2FFVB1156I	Xilinx Inc.	Datasheet	96 In Stock	-	Min: 1 Mult: 1	11 Weeks				1156-BBGA, FCBGA																									328																								-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			Active	4 (72 Hours)					8542.31.00.01				NOT SPECIFIED					NOT SPECIFIED													533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA											Zynq®UltraScale+™ FPGA, 747K+ Logic Cells												ROHS3 Compliant
Mfr Part No XCZU4EV-2SFVC784E	Xilinx Inc.	Datasheet	320 In Stock	-	Min: 1 Mult: 1	11 Weeks				784-BFBGA, FCBGA																									252																								0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV		yes	Active	4 (72 Hours)					8542.31.00.01				NOT SPECIFIED					NOT SPECIFIED													533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA											Zynq®UltraScale+™ FPGA, 192K+ Logic Cells												ROHS3 Compliant
Mfr Part No 5CSXFC6C6U23C7N	Intel	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks				672-FBGA	YES																								MCU - 181, FPGA - 145																								0°C~85°C TJ	Tray	2018	Cyclone® V SX			Active	3 (168 Hours)	672				8542.39.00.01		BOTTOM	BALL	NOT SPECIFIED	1.1V	0.8mm			NOT SPECIFIED	5CSXFC6	S-PBGA-B672	145	Not Qualified		1.13V	1.11.2/3.32.5V		1.07V				800MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		145			FIELD PROGRAMMABLE GATE ARRAY						FPGA - 110K Logic Elements			110000					1.85mm	23mm	23mm		RoHS Compliant
Mfr Part No 5CSEBA2U23A7N	Intel	Datasheet	2066 In Stock	-	Min: 1 Mult: 1	8 Weeks				672-FBGA	YES																								MCU - 181, FPGA - 145																								-40°C~125°C TJ	Tray		Automotive, AEC-Q100, Cyclone® V SE			Active	3 (168 Hours)	672				8542.39.00.01		BOTTOM	BALL	NOT SPECIFIED	1.1V	0.8mm			NOT SPECIFIED		S-PBGA-B672	145	Not Qualified		1.13V	1.11.2/3.32.5V		1.07V				700MHz	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		145			FIELD PROGRAMMABLE GATE ARRAY						FPGA - 25K Logic Elements			25000					1.85mm	23mm	23mm		RoHS Compliant
Mfr Part No M2S090-1FGG484	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1					FPBGA-484		484-FPBGA (23x23)		M2S090		ARM Cortex M3	64 kB			60		-	-		166 MHz				Microchip Technology			Yes		SMD/SMT	267	7193 LAB	86316 LE		Tray								Active			Details		This product may require additional documentation to export from the United States.					1.2000 V		0 to 85 °C	Tray		SmartFusion2																															166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA									1		FPGA - 90K Logic Modules				1 Core			512KB
Mfr Part No XC7Z045-3FBG676E	Xilinx Inc.	Datasheet	485 In Stock	1: $1,173.009651 10: $1,134.438734 25: $1,126.552864 50: $1,118.721811 View all price	Min: 1 Mult: 1	10 Weeks		Copper, Silver, Tin		676-BBGA, FCBGA	YES																	ROMless							130																								0°C~100°C TJ	Tray	2009	Zynq®-7000	e1		Active	3 (168 Hours)	676	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)		8542.39.00.01		BOTTOM	BALL	245	1V	1mm		1GHz	30	XC7Z045	S-PBGA-B676			1V	1.05V				CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b					ARM		YES	-3	256000	Kintex™-7 FPGA, 350K Logic Cells					CAN; ETHERNET; I2C; SPI; UART; USB			2.54mm	27mm		No	ROHS3 Compliant
Mfr Part No XCZU4EV-2SFVC784I	Xilinx Inc.	Datasheet	768 In Stock	-	Min: 1 Mult: 1	11 Weeks				784-BFBGA, FCBGA																									252																								-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			Active	4 (72 Hours)					8542.31.00.01				NOT SPECIFIED					NOT SPECIFIED													533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA											Zynq®UltraScale+™ FPGA, 192K+ Logic Cells												ROHS3 Compliant
Mfr Part No XC7Z015-L1CLG485I	Xilinx Inc.	Datasheet	396 In Stock	1: $48.131422 10: $45.407002 100: $42.836795 500: $40.412070 View all price	Min: 1 Mult: 1	10 Weeks		Copper, Silver, Tin	Surface Mount	484-LFBGA, CSPBGA																									130																								-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		Active	3 (168 Hours)	485	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01		BOTTOM	BALL	NOT SPECIFIED	1V	0.8mm		667MHz	NOT SPECIFIED		S-PBGA-B485								CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		120 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						ARM		YES		256000	Artix™-7 FPGA, 74K Logic Cells	92400				CAN; ETHERNET; I2C; SPI; UART; USB			1.6mm	19mm	19mm		ROHS3 Compliant
Mfr Part No XC7Z035-1FFG676C	Xilinx Inc.	Datasheet	792 In Stock	1: $155.105782 10: $146.326210 100: $138.043594 500: $130.229806 View all price	Min: 1 Mult: 1	10 Weeks				676-BBGA, FCBGA	YES																								130																								0°C~85°C TJ	Tray	2010	Zynq®-7000	e1		Active	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01		BOTTOM	BALL	NOT SPECIFIED	1V	1mm		667MHz	NOT SPECIFIED		S-PBGA-B676				1.05V			0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						ARM		YES		256000	Kintex™-7 FPGA, 275K Logic Cells					CAN; ETHERNET; I2C; SPI; UART; USB			3.37mm	27mm	27mm		ROHS3 Compliant
Mfr Part No M2S050-FGG484	Atmel (Microchip Technology)	Datasheet	-	-	Min: 1 Mult: 1					BGA-484						ARM Cortex M3	64 kB	1.314 Mbit	64 kB	60		-	-		166 MHz		+ 85 C				0 C	Yes		SMD/SMT	267 I/O	4695 LAB	56340 LE													Details		This product may require additional documentation to export from the United States.								Tray		SmartFusion2																							1.2 V												256 kB																		1 Core
Mfr Part No XCZU4CG-1SFVC784I	Xilinx Inc.	Datasheet	32 In Stock	-	Min: 1 Mult: 1	11 Weeks				784-BFBGA, FCBGA																									252																								-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			Active	4 (72 Hours)					8542.31.00.01				NOT SPECIFIED					NOT SPECIFIED													500MHz, 1.2GHz	256KB	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA											Zynq®UltraScale+™ FPGA, 192K+ Logic Cells												ROHS3 Compliant
Mfr Part No XCZU9EG-2FFVC900I	Xilinx Inc.	Datasheet	537 In Stock	-	Min: 1 Mult: 1	11 Weeks				900-BBGA, FCBGA																									204																								-40°C~100°C TJ	Tray		Zynq® UltraScale+™ MPSoC EG	e1		Active	4 (72 Hours)			Tin/Silver/Copper (Sn/Ag/Cu)		8542.31.00.01				NOT SPECIFIED					NOT SPECIFIED													533MHz, 600MHz, 1.3GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA											Zynq®UltraScale+™ FPGA, 599K+ Logic Cells												ROHS3 Compliant
Mfr Part No M2S005S-TQG144I	Atmel (Microchip Technology)	Datasheet	-	-	Min: 1 Mult: 1					TQFP-144						ARM Cortex M3	64 kB			60		-	-		166 MHz							Yes		SMD/SMT		505 LAB	6060 LE													Details		This product may require additional documentation to export from the United States.						0.046530 oz		Tray		SmartFusion2																																			128 kB																		1 Core
Mfr Part No A2F500M3G-1FG256	Microchip Technology	Datasheet	1928 In Stock	1: $130.453093 10: $123.068956 100: $116.102788 500: $109.530933 View all price	Min: 1 Mult: 1					FPBGA-256	YES	256-FPBGA (17x17)	256	A2F500	100 MHz	ARM Cortex M3	64 kB			90	MICROSEMI CORP	-	-	A2F500M3G-1FG256	100 MHz	1.575 V	+ 85 C		Microchip Technology	1.425 V	0 C	Yes	3	SMD/SMT	117 I/O	-	6000 LE	85 °C	Tray	PLASTIC/EPOXY	LBGA	17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256	BGA256,16X16,40	SQUARE	GRID ARRAY, LOW PROFILE	Active	Active	30	5.24	N	No	This product may require additional documentation to export from the United States.	1.575 V	1.425 V	1.5 V	SmartFusion	1.5000 V		0 to 85 °C	Tray		A2F500							TIN LEAD/TIN LEAD SILVER		8542.39.00.01	CMOS	BOTTOM	BALL	225		1 mm	compliant				S-PBGA-B256	66	Not Qualified			1.5,1.8,2.5,3.3 V	OTHER					100MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	512 kB		EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA		66	11520 CLBS, 500000 GATES	1.7 mm	FIELD PROGRAMMABLE GATE ARRAY		500000		1		ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops		11520	11520	1 Core		500000	512KB		17 mm	17 mm
Mfr Part No XC7Z020-L1CLG400I	Xilinx Inc.	Datasheet	396 In Stock	1: $36.098580 10: $34.055264 100: $32.127607 500: $30.309064 View all price	Min: 1 Mult: 1	10 Weeks		Copper, Silver, Tin	Surface Mount	400-LFBGA, CSPBGA																									130																								-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		Active	3 (168 Hours)	400	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01		BOTTOM	BALL	NOT SPECIFIED	1V	0.8mm		667MHz	NOT SPECIFIED		S-PBGA-B400								CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						ARM		YES		256000	Artix™-7 FPGA, 85K Logic Cells	106400				CAN; ETHERNET; I2C; SPI; UART; USB			1.6mm	17mm	17mm		ROHS3 Compliant
Mfr Part No M2S060-1FCS325I	Microchip Technology	Datasheet	1809 In Stock	1: $189.796638 10: $179.053432 100: $168.918332 500: $159.356917 View all price	Min: 1 Mult: 1		Production (Last Updated: 2 months ago)			325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	M2S060		ARM Cortex M3	64 kB			176	MICROSEMI CORP	-	-	M2S060-1FCS325I	166 MHz				Microchip Technology			Yes			200	4710 LAB	56520 LE		Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	30	5.87	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	SmartFusion2			-40°C ~ 100°C (TJ)	Tray		SmartFusion2	e0						Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240		0.5 mm	not_compliant				S-PBGA-B325	200	Not Qualified			1.2 V						166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		200		1.01 mm	FIELD PROGRAMMABLE GATE ARRAY						FPGA - 60K Logic Modules			56520	1 Core			256KB		11 mm	11 mm
Mfr Part No XC7Z030-L2FFG676I	Xilinx Inc.	Datasheet	532 In Stock	1: $642.729435 10: $606.348523 100: $572.026908 500: $539.648028 View all price	Min: 1 Mult: 1	10 Weeks		Copper, Silver, Tin	Surface Mount	676-BBGA, FCBGA																									130																								-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		Active	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01		BOTTOM	BALL	NOT SPECIFIED	1V	1mm		800MHz	NOT SPECIFIED		S-PBGA-B676								CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		256KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA		100 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						ARM		YES		256000	Kintex™-7 FPGA, 125K Logic Cells	157200				CAN; ETHERNET; I2C; SPI; UART; USB			3.24mm	27mm	27mm		ROHS3 Compliant