The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Contact Plating | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | # I/Os (Max) | Base Product Number | Body Orientation | Brand | Contact Materials | Core | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Family Name | I/O Voltage | Ihs Manufacturer | Instruction Set Architecture | JTAG Support | L1 Cache Data Memory | L1 Cache Instruction Memory | Logic Cells | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of CPU Cores | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Blocks/Elements | Number of Logic Elements | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Process Technology | Product Status | Programmable | Qualification | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Terminate To | Termination Method | Typical Operating Supply Voltage | Usage Level | Voltage, Rating | Operating Temperature | Packaging | Series | JESD-609 Code | Temperature Coefficient | Resistance | Terminal Finish | Gender | HTS Code | Subcategory | Power Rating | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Resistor Type | Reach Compliance Code | Pin Count | JESD-30 Code | Function | Number of Outputs | Qualification Status | Operating Frequency | Operating Supply Voltage | Power Supplies | Temperature Grade | Interface | Speed | RAM Size | Core Processor | Number of Resistors | Peripherals | Program Memory Size | Connectivity | Family | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Screening Level | Speed Grade | Resistance Tolerance | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Product Category | Product Length | Product Width | Device Core | Length | Width |
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![]() | Mfr Part No XCVC1502-1MLIVBVA1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Gold | Straight | Xilinx | Phosphor Bronze | 1 | Xilinx | + 110 C | - 40 C | Panel Mount | Flexible Cable | Solder | -65 to 165 °C | Receptacle | SOC - Systems on a Chip | 0, 11 GHz | 800 mV | System-On-Modules - SOM | SoC FPGA | 17.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1502-2MLIVFVB1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | Xilinx | + 110 C | - 40 C | 30 V | 200 ppm/K | 3.3 | SOC - Systems on a Chip | 0.05 W | General Purpose | 800 mV | System-On-Modules - SOM | 5 | SoC FPGA | 0.6 mm | 0.3 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVC1502-1LSEVSVA1596 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | Xilinx | 1 | Xilinx | + 100 C | AMD Xilinx | 0 C | 478 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | SOC - Systems on a Chip | 700 mV | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | High Frequency Relays | MPU, FPGA | System-On-Modules - SOM | Versal™ Prime FPGA, 80k Logic Cells | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1502-1LSEVFVC1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 100 C | 0 C | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1302-2LSEVFVB1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | Xilinx | + 110 C | 0 C | SOC - Systems on a Chip | 125 mW | High Reliability, MIL-PRF-55182 | 700 mV | System-On-Modules - SOM | 1 | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVC1502-1MSEVBVA1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 100 C | 0 C | SOC - Systems on a Chip | 800 mV | High Frequency Relays | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1302-2MSIVFVB1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | Xilinx | + 110 C | - 40 C | 200 ppm/K | 3.9 kOhm | SOC - Systems on a Chip | 0.125 W | General Purpose | 800 mV | System-On-Modules - SOM | 5 | SoC FPGA | 2 | 1.25 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVC1502-2MLEVBVA1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | 0 C | 25 V | 200.0000 ppm/°C | 2.2 | SOC - Systems on a Chip | 0.125 W | 0.65 mm | 800 mV | 2 | System-On-Modules - SOM | 5 | SoC FPGA | 1 mm | 1 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVC1502-2MLIVSVG1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | Xilinx | + 110 C | - 40 C | Bolt-On | SOC - Systems on a Chip | Fuse Block | 800 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1402-1MSIVFVB1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | Xilinx | + 110 C | - 40 C | 25.0000 ppm/°C | 953 Ohm | SOC - Systems on a Chip | 0.125 W | High Reliability, MIL-PRF-55182 | 800 mV | System-On-Modules - SOM | 0.1 | SoC FPGA | 7.62 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1502-2HSIVFVC1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | - 40 C | 30.0000 ppm/°C | 20 kOhm | SOC - Systems on a Chip | 10.0000 W | Power | 880 mV | System-On-Modules - SOM | 5 | SoC FPGA | 47.62 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVC1502-2MSEVBVA1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | 0 C | 200 ppm/K | 2.15 Ohm | SOC - Systems on a Chip | 0.0625 W | General Purpose | 800 mV | System-On-Modules - SOM | 1 | SoC FPGA | 1 | 0.5 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCVM1402-1LLIVFVB1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | Xilinx | + 110 C | - 40 C | AEC-Q200 | 100 ppm/K | 15 Ohm | SOC - Systems on a Chip | 0.75 W | General Purpose | 700 mV | System-On-Modules - SOM | 1 | SoC FPGA | 5 mm | 2.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S150TS-1FCSG536I | Microchip Technology | Datasheet | 748 |
| Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | M2S150 | ARM Cortex M3 | 64 kB | 90 | 1.2, 1.5, 1.8, 2.5, 3.3 V | RISC | Yes | - | - | 166 MHz | Microchip Technology | Yes | 1 | 293 | 12177 LAB | 146124 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | Industrial grade | -40 to 100 °C | Tray | SmartFusion2 | 536 | 1.2 V | CAN/Ethernet/Serial | 166MHz | 64 KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 32 Bit | Industrial | FPGA - 150K Logic Modules | 1 Core | 512KB | ARM Cortex-M3 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S090-1FGG676 | Microchip Technology | Datasheet | 1648 |
| Min: 1 Mult: 1 | BGA-676 | YES | 676-FBGA (27x27) | 676 | M2S090 | ARM Cortex M3 | 64 kB | 40 | MICROSEMI CORP | - | - | M2S090-1FGG676 | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 425 | 7193 LAB | 86316 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.27 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S050T-FG484 | Microchip Technology | Datasheet | 2007 | - | Min: 1 Mult: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S050 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S050T-FG484 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | 3 | SMD/SMT | 267 | 4695 LAB | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 50K Logic Modules | 48672 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S010-1FG484I | Microchip Technology | Datasheet | 4000 |
| Min: 1 Mult: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S010 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S010-1FG484I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 233 | 1007 LAB | 12084 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 10K Logic Modules | 9744 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S090T-FCS325I | Microchip Technology | Datasheet | 2188 |
| Min: 1 Mult: 1 | FCBGA-325 | 325-FCBGA (11x13.5) | 180 | M2S090 | ARM Cortex M3 | 64 kB | 176 | SMARTFUSION2 | - | - | 86316 | 166 MHz | Microchip Technology | Yes | Surface Mount | SMD/SMT | 180 | 7193 LAB | 86316 | 86316 LE | 1.26(V) | 1.14(V) | 1.2(V) | -40C to 100C | 100C | -40C | Industrial | Tray | FCBGA | 65nm | Active | Yes | No | N | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 325 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 90K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S090T-FGG484I | Microchip Technology | Datasheet | 2295 | - | Min: 1 Mult: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S090 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S090T-FGG484I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 267 | 7193 LAB | 86316 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.78 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S050T-FGG896I | Microchip Technology | Datasheet | 2044 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | FPBGA-896 | YES | 896-FBGA (31x31) | 896 | M2S050 | ARM Cortex M3 | 64 kB | 27 | MICROSEMI CORP | - | - | M2S050T-FGG896I | 166 MHz | Microchip Technology | Yes | SMD/SMT | 377 | 4695 LAB | 56340 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.76 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B896 | 377 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 377 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 31 mm | 31 mm |
XCVC1502-1MLIVBVA1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1502-2MLIVFVB1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVC1502-1LSEVSVA1596
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1502-1LSEVFVC1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1302-2LSEVFVB1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVC1502-1MSEVBVA1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1302-2MSIVFVB1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVC1502-2MLEVBVA1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVC1502-2MLIVSVG1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1402-1MSIVFVB1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1502-2HSIVFVC1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVC1502-2MSEVBVA1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCVM1402-1LLIVFVB1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S150TS-1FCSG536I
Microchip Technology
Package:Embedded - System On Chip (SoC)
685.169153
M2S090-1FGG676
Microchip Technology
Package:Embedded - System On Chip (SoC)
411.392253
M2S050T-FG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S010-1FG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
102.765333
M2S090T-FCS325I
Microchip Technology
Package:Embedded - System On Chip (SoC)
275.774930
M2S090T-FGG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S050T-FGG896I
Microchip Technology
Package:Embedded - System On Chip (SoC)
285.274869
