The category is 'Embedded - System On Chip (SoC)'

  • All Manufacturers
  • Packaging
  • Series
  • Package / Case
  • Number of I/Os
  • Architecture
  • Connectivity
  • Core Processor
  • Operating Temperature
  • Peripherals
  • Primary Attributes
  • RAM Size
  • Moisture Sensitivity Level (MSL)

Image

Part Number

Manufacturer

Datasheet

Availability

Pricing(USD)

Quantity

RoHS

Lifecycle Status

Contact Plating

Package / Case

Surface Mount

Supplier Device Package

Number of Terminals

# I/Os (Max)

Base Product Number

Body Orientation

Brand

Contact Materials

Core

Data RAM Size

Factory Pack QuantityFactory Pack Quantity

Family Name

I/O Voltage

Ihs Manufacturer

Instruction Set Architecture

JTAG Support

L1 Cache Data Memory

L1 Cache Instruction Memory

Logic Cells

Manufacturer

Manufacturer Part Number

Maximum Clock Frequency

Maximum Operating Supply Voltage

Maximum Operating Temperature

Mfr

Minimum Operating Supply Voltage

Minimum Operating Temperature

Moisture Sensitive

Moisture Sensitivity Levels

Mounting

Mounting Styles

Number of CPU Cores

Number of I/Os

Number of Logic Array Blocks - LABs

Number of Logic Blocks/Elements

Number of Logic Elements

Operating Supply Voltage (Max)

Operating Supply Voltage (Min)

Operating Supply Voltage (Typ)

Operating Temp Range

Operating Temperature (Max.)

Operating Temperature (Min.)

Operating Temperature Classification

Operating Temperature-Max

Package

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Package Type

Part Life Cycle Code

Process Technology

Product Status

Programmable

Qualification

Rad Hardened

Reflow Temperature-Max (s)

Risk Rank

RoHS

Rohs Code

Shipping Restrictions

Supply Voltage-Max

Supply Voltage-Min

Supply Voltage-Nom

Terminate To

Termination Method

Typical Operating Supply Voltage

Usage Level

Voltage, Rating

Operating Temperature

Packaging

Series

JESD-609 Code

Temperature Coefficient

Resistance

Terminal Finish

Gender

HTS Code

Subcategory

Power Rating

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Terminal Pitch

Resistor Type

Reach Compliance Code

Pin Count

JESD-30 Code

Function

Number of Outputs

Qualification Status

Operating Frequency

Operating Supply Voltage

Power Supplies

Temperature Grade

Interface

Speed

RAM Size

Core Processor

Number of Resistors

Peripherals

Program Memory Size

Connectivity

Family

Architecture

Data Bus Width

Number of Inputs

Seated Height-Max

Programmable Logic Type

Product Type

Screening Level

Speed Grade

Resistance Tolerance

Primary Attributes

Number of Logic Cells

Number of Cores

Flash Size

Product Category

Product Length

Product Width

Device Core

Length

Width

XCVC1502-1MLIVBVA1024

Mfr Part No

XCVC1502-1MLIVBVA1024

Xilinx Datasheet

-

-

Min: 1

Mult: 1

Gold

Straight

Xilinx

Phosphor Bronze

1

Xilinx

+ 110 C

- 40 C

Panel Mount

Flexible Cable

Solder

-65 to 165 °C

Receptacle

SOC - Systems on a Chip

0, 11 GHz

800 mV

System-On-Modules - SOM

SoC FPGA

17.5 mm

XCVM1502-2MLIVFVB1369

Mfr Part No

XCVM1502-2MLIVFVB1369

Xilinx Datasheet

-

-

Min: 1

Mult: 1

Xilinx

Xilinx

+ 110 C

- 40 C

30 V

200 ppm/K

3.3

SOC - Systems on a Chip

0.05 W

General Purpose

800 mV

System-On-Modules - SOM

5

SoC FPGA

0.6 mm

0.3 mm

XCVC1502-1LSEVSVA1596

Mfr Part No

XCVC1502-1LSEVSVA1596

Xilinx Datasheet

-

-

Min: 1

Mult: 1

1596-BFBGA

1596-BGA (37.5x37.5)

Xilinx

1

Xilinx

+ 100 C

AMD Xilinx

0 C

478

Tray

Active

0°C ~ 100°C (TJ)

Versal™ AI Core

SOC - Systems on a Chip

700 mV

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

High Frequency Relays

MPU, FPGA

System-On-Modules - SOM

Versal™ Prime FPGA, 80k Logic Cells

-

SoC FPGA

XCVM1502-1LSEVFVC1760

Mfr Part No

XCVM1502-1LSEVFVC1760

Xilinx Datasheet

-

-

Min: 1

Mult: 1

Xilinx

1

Xilinx

+ 100 C

0 C

SOC - Systems on a Chip

700 mV

System-On-Modules - SOM

SoC FPGA

XCVM1302-2LSEVFVB1369

Mfr Part No

XCVM1302-2LSEVFVB1369

Xilinx Datasheet

-

-

Min: 1

Mult: 1

Xilinx

Xilinx

+ 110 C

0 C

SOC - Systems on a Chip

125 mW

High Reliability, MIL-PRF-55182

700 mV

System-On-Modules - SOM

1

SoC FPGA

XCVC1502-1MSEVBVA1024

Mfr Part No

XCVC1502-1MSEVBVA1024

Xilinx Datasheet

-

-

Min: 1

Mult: 1

Xilinx

1

Xilinx

+ 100 C

0 C

SOC - Systems on a Chip

800 mV

High Frequency Relays

System-On-Modules - SOM

SoC FPGA

XCVM1302-2MSIVFVB1369

Mfr Part No

XCVM1302-2MSIVFVB1369

Xilinx Datasheet

-

-

Min: 1

Mult: 1

Xilinx

Xilinx

+ 110 C

- 40 C

200 ppm/K

3.9 kOhm

SOC - Systems on a Chip

0.125 W

General Purpose

800 mV

System-On-Modules - SOM

5

SoC FPGA

2

1.25

XCVC1502-2MLEVBVA1024

Mfr Part No

XCVC1502-2MLEVBVA1024

Xilinx Datasheet

-

-

Min: 1

Mult: 1

Xilinx

1

Xilinx

+ 110 C

0 C

25 V

200.0000 ppm/°C

2.2

SOC - Systems on a Chip

0.125 W

0.65 mm

800 mV

2

System-On-Modules - SOM

5

SoC FPGA

1 mm

1 mm

XCVC1502-2MLIVSVG1369

Mfr Part No

XCVC1502-2MLIVSVG1369

Xilinx Datasheet

-

-

Min: 1

Mult: 1

Xilinx

Xilinx

+ 110 C

- 40 C

Bolt-On

SOC - Systems on a Chip

Fuse Block

800 mV

System-On-Modules - SOM

SoC FPGA

XCVM1402-1MSIVFVB1369

Mfr Part No

XCVM1402-1MSIVFVB1369

Xilinx Datasheet

-

-

Min: 1

Mult: 1

Xilinx

Xilinx

+ 110 C

- 40 C

25.0000 ppm/°C

953 Ohm

SOC - Systems on a Chip

0.125 W

High Reliability, MIL-PRF-55182

800 mV

System-On-Modules - SOM

0.1

SoC FPGA

7.62

XCVM1502-2HSIVFVC1760

Mfr Part No

XCVM1502-2HSIVFVC1760

Xilinx Datasheet

-

-

Min: 1

Mult: 1

Xilinx

1

Xilinx

+ 110 C

- 40 C

30.0000 ppm/°C

20 kOhm

SOC - Systems on a Chip

10.0000 W

Power

880 mV

System-On-Modules - SOM

5

SoC FPGA

47.62

XCVC1502-2MSEVBVA1024

Mfr Part No

XCVC1502-2MSEVBVA1024

Xilinx Datasheet

-

-

Min: 1

Mult: 1

Xilinx

1

Xilinx

+ 110 C

0 C

200 ppm/K

2.15 Ohm

SOC - Systems on a Chip

0.0625 W

General Purpose

800 mV

System-On-Modules - SOM

1

SoC FPGA

1

0.5

XCVM1402-1LLIVFVB1369

Mfr Part No

XCVM1402-1LLIVFVB1369

Xilinx Datasheet

-

-

Min: 1

Mult: 1

Xilinx

Xilinx

+ 110 C

- 40 C

AEC-Q200

100 ppm/K

15 Ohm

SOC - Systems on a Chip

0.75 W

General Purpose

700 mV

System-On-Modules - SOM

1

SoC FPGA

5 mm

2.5 mm

M2S150TS-1FCSG536I

Mfr Part No

M2S150TS-1FCSG536I

Microchip Technology Datasheet

748
In Stock

  • 1: $685.169153
  • 10: $646.385993
  • 100: $609.798106
  • 500: $575.281233
  • View all price

Min: 1

Mult: 1

536-LFBGA, CSPBGA

536-CSPBGA (16x16)

M2S150

ARM Cortex M3

64 kB

90

1.2, 1.5, 1.8, 2.5, 3.3 V

RISC

Yes

-

-

166 MHz

Microchip Technology

Yes

1

293

12177 LAB

146124 LE

Tray

Active

Details

This product may require additional documentation to export from the United States.

Industrial grade

-40 to 100 °C

Tray

SmartFusion2

536

1.2 V

CAN/Ethernet/Serial

166MHz

64 KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

32 Bit

Industrial

FPGA - 150K Logic Modules

1 Core

512KB

ARM Cortex-M3

M2S090-1FGG676

Mfr Part No

M2S090-1FGG676

Microchip Technology Datasheet

1648
In Stock

  • 1: $411.392253
  • 10: $388.105898
  • 100: $366.137640
  • 500: $345.412868
  • View all price

Min: 1

Mult: 1

BGA-676

YES

676-FBGA (27x27)

676

M2S090

ARM Cortex M3

64 kB

40

MICROSEMI CORP

-

-

M2S090-1FGG676

166 MHz

Microchip Technology

Yes

3

SMD/SMT

425

7193 LAB

86316 LE

85 °C

Tray

PLASTIC/EPOXY

BGA

FBGA-676

BGA676,26X26,40

SQUARE

GRID ARRAY

Active

Active

40

5.27

Details

Yes

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B676

425

Not Qualified

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

425

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

FPGA - 90K Logic Modules

86316

1 Core

512KB

27 mm

27 mm

M2S050T-FG484

Mfr Part No

M2S050T-FG484

Microchip Technology Datasheet

2007
In Stock

-

Min: 1

Mult: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

M2S050

ARM Cortex M3

64 kB

60

MICROSEMI CORP

-

-

M2S050T-FG484

166 MHz

1.26 V

Microchip Technology

1.14 V

Yes

3

SMD/SMT

267

4695 LAB

56340 LE

85 °C

Tray

PLASTIC/EPOXY

BGA

FBGA-484

BGA484,22X22,40

SQUARE

GRID ARRAY

Active

Active

30

5.84

N

No

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

1.2000 V

0 to 85 °C

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

267

Not Qualified

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

STD

FPGA - 50K Logic Modules

48672

1 Core

256KB

23 mm

23 mm

M2S010-1FG484I

Mfr Part No

M2S010-1FG484I

Microchip Technology Datasheet

4000
In Stock

  • 1: $102.765333
  • 10: $96.948427
  • 100: $91.460780
  • 500: $86.283755
  • View all price

Min: 1

Mult: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

M2S010

ARM Cortex M3

64 kB

60

MICROSEMI CORP

-

-

M2S010-1FG484I

166 MHz

Microchip Technology

Yes

3

SMD/SMT

233

1007 LAB

12084 LE

Tray

PLASTIC/EPOXY

BGA

BGA, BGA484,22X22,40

BGA484,22X22,40

SQUARE

GRID ARRAY

Active

Active

30

5.3

N

No

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

1 mm

not_compliant

S-PBGA-B484

233

Not Qualified

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

233

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

1

FPGA - 10K Logic Modules

9744

1 Core

256KB

23 mm

23 mm

M2S090T-FCS325I

Mfr Part No

M2S090T-FCS325I

Microchip Technology Datasheet

2188
In Stock

  • 1: $275.774930
  • 10: $260.165028
  • 100: $245.438706
  • 500: $231.545949
  • View all price

Min: 1

Mult: 1

FCBGA-325

325-FCBGA (11x13.5)

180

M2S090

ARM Cortex M3

64 kB

176

SMARTFUSION2

-

-

86316

166 MHz

Microchip Technology

Yes

Surface Mount

SMD/SMT

180

7193 LAB

86316

86316 LE

1.26(V)

1.14(V)

1.2(V)

-40C to 100C

100C

-40C

Industrial

Tray

FCBGA

65nm

Active

Yes

No

N

This product may require additional documentation to export from the United States.

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

325

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 90K Logic Modules

1 Core

512KB

M2S090T-FGG484I

Mfr Part No

M2S090T-FGG484I

Microchip Technology Datasheet

2295
In Stock

-

Min: 1

Mult: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

M2S090

ARM Cortex M3

64 kB

60

MICROSEMI CORP

-

-

M2S090T-FGG484I

166 MHz

Microchip Technology

Yes

3

SMD/SMT

267

7193 LAB

86316 LE

Tray

PLASTIC/EPOXY

BGA

BGA, BGA484,22X22,40

BGA484,22X22,40

SQUARE

GRID ARRAY

Active

Active

40

5.78

Details

Yes

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

1.2000 V

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B484

267

Not Qualified

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

STD

FPGA - 90K Logic Modules

86316

1 Core

512KB

23 mm

23 mm

M2S050T-FGG896I

Mfr Part No

M2S050T-FGG896I

Microchip Technology Datasheet

2044
In Stock

  • 1: $285.274869
  • 10: $269.127235
  • 100: $253.893618
  • 500: $239.522281
  • View all price

Min: 1

Mult: 1

Production (Last Updated: 2 months ago)

FPBGA-896

YES

896-FBGA (31x31)

896

M2S050

ARM Cortex M3

64 kB

27

MICROSEMI CORP

-

-

M2S050T-FGG896I

166 MHz

Microchip Technology

Yes

SMD/SMT

377

4695 LAB

56340 LE

Tray

PLASTIC/EPOXY

BGA

BGA, BGA896,30X30,40

BGA896,30X30,40

SQUARE

GRID ARRAY

Active

Active

40

5.76

Details

Yes

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

1.2000 V

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

377

Not Qualified

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

377

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

STD

FPGA - 50K Logic Modules

56340

1 Core

256KB

31 mm

31 mm