The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Contact Plating | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | # I/Os (Max) | Base Product Number | Base/Housing Material | Body Orientation | Brand | Contact Materials | Core | Data RAM Size | Data RAM Type | Development Kit | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | Interface Type | L1 Cache Data Memory | L1 Cache Instruction Memory | Logic Cells | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Data Rate | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Blocks/Elements | Number of Logic Elements | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Process Technology | Processor Series | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supplier Package | Supply Current Receiving | Supply Current Transmitting | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Switching Regulator | Termination Method | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Part Status | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Gender | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Number of Contacts | Operating Frequency | Output Voltage | Operating Supply Voltage | Power Supplies | Temperature Grade | Interface | Memory Size | Number of Ports | Speed | RAM Size | Output Current | Core Processor | Peripherals | Program Memory Type | Program Memory Size | Connectivity | Output Power | Data Rate | Architecture | Data Bus Width | Number of Inputs | Organization | Seated Height-Max | Utilized IC / Part | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Protocol | Core Architecture | Frequency Range | Screening Level | Power - Output | Speed Grade | RF Family/Standard | Number of Transceivers | Antenna Type | Sensitivity | Primary Attributes | Serial Interfaces | Current - Receiving | Current - Transmitting | Number of CLBs | Number of Logic Cells | Number of Timers | Modulation | Number of Cores | Flash Size | Input Voltage | Product Category | ADC Resolution | Height | Length | Width |
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 | Mfr Part No M2S025TS-VF256 | Microchip Technology | Datasheet | 2179 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 256-LFBGA | 256-FPBGA (14x14) | M2S025 | ARM Cortex M3 | 64 kB | 119 | - | - | 166 MHz | Microchip Technology | Yes | 138 | 2308 LAB | 27696 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010TS-1VFG400 | Microchip Technology | Datasheet | 20 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | VFPBGA-400 | 400-VFBGA (17x17) | M2S010 | ARM Cortex M3 | 64 kB | 90 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 195 | 1007 LAB | 12084 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-VF400I | Microchip Technology | Datasheet | 1815 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | VFPBGA-400 | 400-VFBGA (17x17) | M2S025 | ARM Cortex M3 | 64 kB | 90 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 207 | 2308 LAB | 27696 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EFR32MG1P231F256GM48-C0 | Silicon Labs | Datasheet | - | - | Min: 1 Mult: 1 | QFN-48 | ARM Cortex M4 | 32 kB | RAM | SLWRB4154A | 260 | I2C, I2S, SMBus, SPI, UART, USART | 40 MHz | 1 Mbps | + 85 C | - 40 C | Yes | SMD/SMT | EFR32MG1 | Details | 8.7 mA, 9.8 mA | 8.2 mA | 3.3 V | 3.3 V | EFR32 | Tray | EFR32MG1 | Bluetooth, Zigbee | 2.4 GHz | Flash | 256 kB | 19.5 dBm | 32 bit | - 94 dBm | 2 Timer | 12 bit | 0.85 mm | 7 mm | 7 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EG21GGB-MINIPCIE-S | Quectel | Datasheet | 92 |
| Min: 1 Mult: 1 | Card Edge | Module | EG21 | 100 | Quectel | Socket Mount | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Active | Details | Mini PCIe | Wireless communication module | 0.368613 oz | Industrial grade | -40 to 80 °C | Reel | - | LTE Cat 1 Module | 3V ~ 3.6V | - | 3.8 V | - | 42Mbps | - | BeiDou, EDGE, Galileo, GLONASS, GPS, GNSS, GPRS, GSM, HSPA+, LTE, UMTS, WCDMA | 700/800/850/900/1700/1800/1900/2100/2600 MHz | Industrial | 33dBm | Cellular, Navigation | Antenna Not Included | -110.5dBm | I²C, PCM, UART, USB | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EFR32MG1B231F256GM32-C0 | Silicon Labs | Datasheet | 4 |
| Min: 1 Mult: 1 | QFN-32 | ARM Cortex M4 | 32 kB | RAM | SLWRB4154A | 490 | I2C, I2S, SMBus, SPI, UART, USART | 40 MHz | 1 Mbps | + 85 C | - 40 C | Yes | SMD/SMT | EFR32MG1 | Details | 8.7 mA, 9.8 mA | 8.2 mA | 3.3 V | 3.3 V | EFR32 | Tray | EFR32MG1 | Bluetooth, Zigbee | 2.4 GHz | Flash | 256 kB | 19.5 dBm | 32 bit | - 94 dBm | 2 Timer | 12 bit | 0.85 mm | 5 mm | 5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASXMB3G4F40C4N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | INTEL CORP | Intel Corporation | 5ASXMB3G4F40C4N | MCU - 208, FPGA - 540 | 85 °C | PLASTIC/EPOXY | BGA | FBGA-1517 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.28 | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Arria V SX | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASXMB3 | S-PBGA-B1517 | 540 | COMMERCIAL EXTENDED | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 13207 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASXBB3D6F40C6N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | INTEL CORP | Intel Corporation | 5ASXBB3D6F40C6N | MCU - 208, FPGA - 540 | 85 °C | PLASTIC/EPOXY | BGA | FBGA-1517 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | End Of Life | 5.28 | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Arria V SX | Active | BOTTOM | BALL | 1 mm | compliant | 5ASXBB3 | S-PBGA-B1517 | 540 | COMMERCIAL EXTENDED | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 13207 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASXFB3G4F35I5N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | INTEL CORP | Intel Corporation | 5ASXFB3G4F35I5N | MCU - 208, FPGA - 385 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.28 | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Arria V SX | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASXFB3 | S-PBGA-B1152 | 385 | Not Qualified | 1.1,1.2/3.3,2.5 V | INDUSTRIAL | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 385 | 13207 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC4C6U23I7N | ALTERA | Datasheet | 2159 |
| Min: 1 Mult: 1 | 672-FBGA | YES | 484 | 672-UBGA (23x23) | 672 | INTEL CORP | Intel Corporation | 5CSXFC4C6U23I7N | MCU - 181, FPGA - 145 | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 2.03 | Compliant | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SX | Active | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 800 MHz | 5CSXFC4 | S-PBGA-B672 | 145 | Not Qualified | 1.1 V | 1.1,1.2/3.3,2.5 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 2.9 MB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3.125 Gbps | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | 40000 | ARM | 6 | FPGA - 40K Logic Elements | 40000 | -- | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA4U23I7SN | ALTERA | Datasheet | 2370 |
| Min: 1 Mult: 1 | 672-FBGA | YES | 672-UBGA (23x23) | 672 | INTEL CORP | Intel Corporation | 5CSEBA4U23I7SN | MCU - 181, FPGA - 145 | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 5.58 | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SE | Active | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | S-PBGA-B672 | 145 | Not Qualified | 1.1,1.2/3.3,2.5 V | 800MHz | 64KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 40K Logic Elements | 40000 | -- | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA5U19C7SN | ALTERA | Datasheet | 1906 |
| Min: 1 Mult: 1 | 484-FBGA | YES | 484-UBGA (19x19) | 484 | INTEL CORP | Intel Corporation | 5CSEBA5U19C7SN | MCU - 151, FPGA - 66 | 85 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 5.55 | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 5CSEBA5 | S-PBGA-B484 | 66 | Not Qualified | 1.1,1.2/3.3,2.5 V | OTHER | 800MHz | 64KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | 1.9 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | -- | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASXBB5D4F40I5N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | INTEL CORP | Intel Corporation | 5ASXBB5D4F40I5N | MCU - 208, FPGA - 540 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FBGA-1517 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.28 | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Arria V SX | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASXBB5 | S-PBGA-B1517 | 540 | INDUSTRIAL | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 17434 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEMA6F31A7N | ALTERA | Datasheet | 2275 |
| Min: 1 Mult: 1 | 896-BGA | YES | 896-FBGA (31x31) | 896 | INTEL CORP | Intel Corporation | 5CSEMA6F31A7N | 3 | MCU - 181, FPGA - 288 | 125 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 2.04 | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 125°C (TJ) | Tray | Automotive, AEC-Q100, Cyclone® V SE | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5CSEMA6 | S-PBGA-B896 | 288 | Not Qualified | 1.1,1.2/3.3,2.5 V | AUTOMOTIVE | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 2 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | -- | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA4U19C7N | ALTERA | Datasheet | 1799 |
| Min: 1 Mult: 1 | 484-FBGA | 484-UBGA (19x19) | INTEL CORP | Intel Corporation | 5CSEBA4U19C7N | MCU - 151, FPGA - 66 | FBGA, BGA484,22X22,32 | Active | Yes | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | 8542.39.00.01 | compliant | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 40K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090-1FG676I | Microchip | Datasheet | 1779 |
| Min: 1 Mult: 1 | 676-BGA | 676-FBGA (27x27) | M2S090 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 425 | 86316 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 90K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FC1152I | Microchip | Datasheet | 1843 |
| Min: 1 Mult: 1 | Gold | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 15 | M2S150 | PCT (Polychlorinated Terphenyl) | Right Angle | Microchip Technology / Atmel | Copper Alloy | 64 kB | 24 | MICROSEMI CORP | - | - | Microchip | M2S150T-1FC1152I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | SMD/SMT | 574 | 12177 LAB | 146124 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | N | No | 1.26 V | 1.14 V | 1.2 V | Solder | 1.2 V | 1.234218 oz | -55 to 125 °C | Tray | SmartFusion®2 | e0 | D-Subminiature | Tin/Lead (Sn/Pb) | Receptacle | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | 1152 | S-PBGA-B1152 | 574 | Not Qualified | 15 POS | 1.2 V | 1 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | 1 | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-1VFG400I | Microchip | Datasheet | 2042 | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S025 | 64 kB | - | - | 166 MHz | Microchip Technology | Through Hole | SMD/SMT | 207 | 27696 LE | Tray | Active | Eighth-Brick | Yes | -40 to 125 °C | SmartFusion®2 | Step Down | 8 | 1 | 3.3 V | 166MHz | 64KB | 20 A | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 66 W | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | 36 to 75 V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-VFG400 | Microchip | Datasheet | 2049 |
| Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | 207 | M2S050 | 64 kB | SMARTFUSION2 | - | - | 56340 | 166 MHz | + 85 C | Microchip Technology | 0 C | Surface Mount | SMD/SMT | 207 | 56340 | 56340 LE | 1.26(V) | 1.14(V) | 1.2(V) | 0C to 85C | 85C | 0C | COMMERCIALC | Tray | VFBGA | 65nm | Active | Yes | No | 0°C ~ 85°C (TJ) | Tray | SmartFusion®2 | 400 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090-1FG484I | Microchip | Datasheet | 1762 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S090 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 267 | 86316 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 90K Logic Modules | 1 Core | 512KB |
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M2S025TS-VF256
Microchip Technology
Package:Embedded - System On Chip (SoC)
124.240552
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M2S010TS-1VFG400
Microchip Technology
Package:Embedded - System On Chip (SoC)
65.289643
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M2S025TS-VF400I
Microchip Technology
Package:Embedded - System On Chip (SoC)
167.218941
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EFR32MG1P231F256GM48-C0
Silicon Labs
Package:Embedded - System On Chip (SoC)
Price: please inquire
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EG21GGB-MINIPCIE-S
Quectel
Package:Embedded - System On Chip (SoC)
72.326211
-
EFR32MG1B231F256GM32-C0
Silicon Labs
Package:Embedded - System On Chip (SoC)
8.519423
-
5ASXMB3G4F40C4N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5ASXBB3D6F40C6N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5ASXFB3G4F35I5N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSXFC4C6U23I7N
ALTERA
Package:Embedded - System On Chip (SoC)
264.869075
-
5CSEBA4U23I7SN
ALTERA
Package:Embedded - System On Chip (SoC)
182.429431
-
5CSEBA5U19C7SN
ALTERA
Package:Embedded - System On Chip (SoC)
192.318288
-
5ASXBB5D4F40I5N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSEMA6F31A7N
ALTERA
Package:Embedded - System On Chip (SoC)
514.940244
-
5CSEBA4U19C7N
ALTERA
Package:Embedded - System On Chip (SoC)
150.324973
-
M2S090-1FG676I
Microchip
Package:Embedded - System On Chip (SoC)
311.754501
-
M2S150T-1FC1152I
Microchip
Package:Embedded - System On Chip (SoC)
528.956497
-
M2S025T-1VFG400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050-VFG400
Microchip
Package:Embedded - System On Chip (SoC)
125.949537
-
M2S090-1FG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire