The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Housing Material | Number of Terminals | Actuator Material | Jacket (Insulation) Material | ActuatorColor | Base Product Number | Brand | Cable Types | Contact Materials | Data RAM Size | Device Logic Units | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Frequency-Max | I/O Voltage | Ihs Manufacturer | Instruction Set Architecture | Interface Type | JTAG Support | L1 Cache Data Memory | L1 Cache Instruction Memory | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Mated Stacking Heights | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of CPU Cores | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Unit Weight | Usage Level | Voltage Rating AC | Voltage Rating DC | Voltage, Rating | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Termination | Connector Type | Type | Number of Positions | Terminal Finish | Number of Rows | Additional Feature | HTS Code | Subcategory | Pitch | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Current Rating | Base Part Number | Output | Pin Count | Contact Finish | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Actuator Type | Housing Color | Operating Supply Voltage | Panel Cutout Dimensions | Power Supplies | Temperature Grade | Interface | Number of Circuits | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Number of Decks | Architecture | Mating Cycles | Data Bus Width | Number of Inputs | Operating Force | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Input | Product Type | Ratio - Input:Output | Contact Timing | 1st Connector | 2nd Connector | Total RAM Bits | Number of LABs/CLBs | PLL | Differential - Input:Output | Screening Level | Index Stops | Circuit per Deck | Depth Behind Panel | Insertion Loss | Flat Flex Type | Speed Grade | Connector/Contact Type | Cable Diameter | Number of Poles per Deck | Cable End Type | Angle of Throw | Locking Feature | Divider/Multiplier | Primary Attributes | Number of Registers | Fiber Type | Number of Logic Cells | Number of Cores | Color - Connectors | Return Loss | Color - Cable | Bend Radius | Flash Size | Connection Type | Features | Product Category | Device Core | Length | Width | Contact Finish Thickness | Length - Overall | Actuator Length | Height Above Board | FFC, FCB Thickness | Material Flammability Rating | Ratings |
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 | Mfr Part No XCZU5CG-2FBVB900I | AMD | Datasheet | 785 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU5 | 256,200 | 0.892 V | AMD | 0.808 V | 204 | Tray | Active | FCBGA | 0.8500 V | Industrial grade | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 900 | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 2 | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | 234,240 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-FCSG325I | Microchip | Datasheet | 2081 | - | Min: 1 Mult: 1 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S050 | 64 kB | MICROSEMI CORP | - | - | Schneider | 136499 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 3 | SMD/SMT | 200 | 56340 LE | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.76 | Yes | 1.26 V | 1.14 V | 1.2 V | 2.5, 3.3 V | -40 to 100 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | Threaded | 11 mm | 11 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-TQG144I | Microchip | Datasheet | 2145 | - | Min: 1 Mult: 1 | TQFP-144 | YES | 144-TQFP (20x20) | 144 | M2S010 | Microchip Technology / Atmel | 64 kB | 400 kbit | 60 | MICROSEMI CORP | - | - | Cutler Hammer, Div of Eaton Co | DR1-40D8-05 | 166 MHz | 1.26 V | + 100 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | SMD/SMT | 84 I/O | 1007 LAB | 12084 LE | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.81 | Details | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0.035380 oz | -40 to 100 °C | Tray | SmartFusion2 | Yes | Pure Matte Tin (Sn) | 8542.39.00.01 | SOC - Systems on a Chip | QUAD | GULL WING | 250 | 0.5 mm | compliant | S-PQFP-G144 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | STD | FPGA - 10K Logic Modules | 1 Core | 256KB | SoC FPGA | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS095T-1FCVG784T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | PEI-Genesis | MCU - 136, FPGA - 276 | Bulk | Active | -40°C ~ 125°C (TJ) | * | - | 857.6KB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-1VFG400 | Microchip | Datasheet | 2162 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 16-TSSOP (0.173, 4.40mm Width) | 16-TSSOP | M2S025 | 64 kB | 133MHz | - | - | -- | 166 MHz | Microchip Technology | SMD/SMT | 207 | 27696 LE | Tray | Active | Compliant | 0°C ~ 70°C | Tape & Reel (TR) | -- | Active | -- | Zero Delay Buffer | 3 V ~ 3.6 V | IDT2309-1 | LVTTL | 1 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | LVTTL | 1:9 | Yes with Bypass | No/No | No/No | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090T-FGG676I | Microchip | Datasheet | 1709 | - | Min: 1 Mult: 1 | Surface Mount, Right Angle | 676-BGA | YES | 676-FBGA (27x27) | Thermoplastic, Glass Filled | 676 | -- | -- | M2S090 | Phosphor Bronze | 64 kB | MICROSEMI CORP | - | - | -- | Microsemi Corporation | M2S090T-FGG676I | 166 MHz | Microchip Technology | 3 | SMD/SMT | 425 | 86316 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.78 | Yes | 1.26 V | 1.14 V | 1.2 V | 50V | -20°C ~ 85°C | Tape & Reel (TR) | -- | e1 | Active | -- | Solder | 26 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | 0.039 (1.00mm) | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 0.5A | Tin | S-PBGA-B676 | 425 | Not Qualified | Black | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | -- | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPC | Contacts, Bottom | Straight | -- | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | Solder Retention | 27 mm | 27 mm | 120.0µin (3.05µm) | 0.126 (3.20mm) | 0.30mm | UL94 V-0 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-1VF400 | Microchip | Datasheet | 2122 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 1517-BBGA, FCBGA | 1517-FBGA (40x40) | M2S060 | 64 kB | - | - | 166 MHz | Microchip Technology | 696 | 56520 LE | Tray | Active | Non-Compliant | 0°C ~ 85°C (TJ) | Stratix® V GX | Active | 0.82 V ~ 0.88 V | 5SGXMA5 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 490000 | 53105664 | 185000 | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090T-1FG676 | Microchip | Datasheet | 1734 |
| Min: 1 Mult: 1 | Surface Mount | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S090 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S090T-1FG676 | 22.86mm, 31.9mm | 166 MHz | Microchip Technology | 3 | SMD/SMT | 425 | 86316 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.27 | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tube | MICTOR | e0 | Obsolete | Plug, Outer Shroud Contacts | 266 | Tin/Lead (Sn/Pb) | 2 | 8542.39.00.01 | Field Programmable Gate Arrays | 0.025 (0.64mm) | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | Gold | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | Board Guide, Ground Bus (Plane) | 27 mm | 27 mm | 30.0µin (0.76µm) | 0.892 (22.66mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-1VFG400 | Microchip | Datasheet | 2327 |
| Min: 1 Mult: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | -- | M2S050 | Twin Zip | 64 kB | MICROSEMI CORP | - | - | -- | Microsemi Corporation | M2S050-1VFG400 | 166 MHz | Microchip Technology | 3 | SMD/SMT | 207 | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.76 | Yes | 1.26 V | 1.14 V | 1.2 V | -- | -- | e1 | Active | -- | Multimode, Duplex | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | LC Duplex | ST (2) | 0.20dB | 0.08 (2.0mm) | FPGA - 50K Logic Modules | 62.5/125 | 56340 | 1 Core | Beige | -- | Orange | -- | 256KB | Riser, Zipcord | 17 mm | 17 mm | 131.2 (40.0m) | OFNR | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-1FGG676 | Microchip | Datasheet | 1890 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Panel Mount | 676-BGA | 676-FBGA (27x27) | M2S060 | Silver Alloy | 64 kB | - | - | 166 MHz | Microchip Technology | 387 | 56520 LE | Tray | Active | Compliant | 115V | 28V | 0°C ~ 85°C (TJ) | 42 | Active | 8 | 1A (AC/DC) | -- | Solder Lug | Flatted (6.35mm Dia) | -- | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 1 | MCU, FPGA | 5.761 ~ 83gfm | Non-Shorting (BBM) | Fixed | SP8T | 26.04mm | 1 | 36° | FPGA - 60K Logic Modules | 1 Core | 256KB | -- | 11.10mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-1VF256 | Microchip | Datasheet | 4 | - | Min: 1 Mult: 1 | Panel Mount | 256-LFBGA | 256-FPBGA (14x14) | M2S005 | Silver Alloy | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 161 | 6060 LE | Tray | Active | 115V | 28V | 0°C ~ 85°C (TJ) | 44 | Active | 4 | 1A (AC/DC) | -- | Solder Lug | Flatted (6.35mm Dia) | -- | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | -- | MCU, FPGA | 5.761 ~ 83gfm | Shorting (MBB) | Fixed | 3P4T | -- | 3 | 30° | FPGA - 5K Logic Modules | 1 Core | 128KB | Shaft and Panel Sealed | 11.10mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-2FSVE1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Panel Mount | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Silver Alloy | AMD | 366 | Tray | Active | 115V | 28V | -40°C ~ 100°C (TJ) | 44 | Active | 3 | 1A (AC/DC) | -- | Solder Lug | Flatted (6.35mm Dia) | -- | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1 | MCU, FPGA | 5.761 ~ 83gfm | Shorting (MBB) | Fixed | 4P3T | 26.04mm | 4 | 30° | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Shaft and Panel Sealed | 11.10mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-1FCS325 | Microchip | Datasheet | 2064 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Panel Mount | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S050 | Silver Alloy | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S050T-1FCS325 | 166 MHz | Microchip Technology | SMD/SMT | 200 | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.81 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | 115V | 28V | 0°C ~ 85°C (TJ) | 42 | e0 | Active | 4 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | 1A (AC/DC) | -- | Solder Lug | S-PBGA-B325 | 200 | Not Qualified | Flatted (6.35mm Dia) | -- | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 3 | MCU, FPGA | 200 | 5.761 ~ 83gfm | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | Non-Shorting (BBM) | Fixed | DP4T | 43.61mm | 2 | 36° | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | -- | 11 mm | 11 mm | 11.10mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAZU7EV-1FBVB900I | AMD | Datasheet | 704 |
| Min: 1 Mult: 1 | Panel Mount | 900-BBGA, FCBGA | 900-FCBGA (31x31) | Silver Alloy | 1.8, 2.5, 3.3 V | RISC | CAN/Serial I2C/SPI/UART/USB | Yes | AMD | 220 | Tray | Active | Industrial grade | 115V | 28V | -40 to 100 °C | 44 | Active | 5 | 1A (AC/DC) | 900 | -- | Solder Lug | Flatted (6.35mm Dia) | 5 V | -- | CAN/Serial I2C/SPI/U | 500MHz, 600MHz, 1.2GHz | 256 KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | -- | MCU, FPGA | 64 Bit | 5.761 ~ 83gfm | Non-Shorting (BBM) | Industrial | Fixed | DP5T | -- | 2 | 30° | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | Shaft and Panel Sealed | ARM Cortex-A53/ARM Cortex-R5 | 11.10mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-L2FFVE1156I | AMD | Datasheet | 692 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 366 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-1FSVG1517E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | 1.8/2.5/3.3 V | RISC | Yes | AMD | Surface Mount | 6 | 561 | Tray | Active | 0 to 100 °C | Zynq® UltraScale+™ RFSoC | 1517 | 110, 230 V | CAN/Serial I2C/SPI/U | 500MHz, 1.2GHz | 256 KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 64 Bit | Extended | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ARM Cortex-A53/ARM Cortex-R5 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS250T-FCSG536EES | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | 536-LFBGA | Microchip Technology | MCU - 136, FPGA - 372 | Tray | Active | 0°C ~ 100°C | PolarFire™ | - | 2.2MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-1FG676I | Microchip | Datasheet | 1721 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S060 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S060TS-1FG676I | 166 MHz | Microchip Technology | 3 | 387 | 56520 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.88 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B676 | 387 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 387 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-L1FSVE1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 366 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-2FSVG1517I | AMD | Datasheet | 724 |
| Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 561 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - |
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XCZU5CG-2FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
2,955.491862
-
M2S050T-FCSG325I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-TQG144I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MPFS095T-1FCVG784T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025TS-1VFG400
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090T-FGG676I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060-1VF400
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090T-1FG676
Microchip
Package:Embedded - System On Chip (SoC)
447.473402
-
M2S050-1VFG400
Microchip
Package:Embedded - System On Chip (SoC)
216.870920
-
M2S060-1FGG676
Microchip
Package:Embedded - System On Chip (SoC)
240.999806
-
M2S005-1VF256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU43DR-2FSVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050T-1FCS325
Microchip
Package:Embedded - System On Chip (SoC)
182.639059
-
XAZU7EV-1FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
3,717.413381
-
XCZU43DR-L2FFVE1156I
AMD
Package:Embedded - System On Chip (SoC)
30,185.227739
-
XCZU48DR-1FSVG1517E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MPFS250T-FCSG536EES
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-1FG676I
Microchip
Package:Embedded - System On Chip (SoC)
307.666446
-
XCZU47DR-L1FSVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU48DR-2FSVG1517I
AMD
Package:Embedded - System On Chip (SoC)
35,913.391897