The category is 'Embedded - System On Chip (SoC)'

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  • Primary Attributes
  • RAM Size
  • Moisture Sensitivity Level (MSL)

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Part Number

Manufacturer

Datasheet

Availability

Pricing(USD)

Quantity

RoHS

Factory Lead Time

Contact Plating

Mount

Package / Case

Surface Mount

Number of Pins

Supplier Device Package

Number of Terminals

Base Product Number

Core

Data RAM Size

Factory Pack QuantityFactory Pack Quantity

Ihs Manufacturer

L1 Cache Data Memory

L1 Cache Instruction Memory

Manufacturer Part Number

Maximum Clock Frequency

Maximum Operating Temperature

Mfr

Minimum Operating Temperature

Moisture Sensitive

Moisture Sensitivity Levels

Mounting Styles

Number of I/Os

Number of Logic Array Blocks - LABs

Number of Logic Elements

Operating Temperature-Max

Package

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part Life Cycle Code

Product Status

Reflow Temperature-Max (s)

Risk Rank

RoHS

Rohs Code

Shipping Restrictions

Supply Voltage-Max

Supply Voltage-Min

Supply Voltage-Nom

Tradename

Typical Operating Supply Voltage

Unit Weight

Operating Temperature

Packaging

Published

Series

JESD-609 Code

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

ECCN Code

Terminal Finish

Additional Feature

HTS Code

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Reach Compliance Code

Frequency

Time@Peak Reflow Temperature-Max (s)

Base Part Number

JESD-30 Code

Number of Outputs

Qualification Status

Operating Supply Voltage

Supply Voltage-Max (Vsup)

Power Supplies

Temperature Grade

Supply Voltage-Min (Vsup)

Interface

Speed

RAM Size

uPs/uCs/Peripheral ICs Type

Core Processor

Peripherals

Clock Frequency

Program Memory Size

Connectivity

Architecture

Data Bus Width

Number of Inputs

Seated Height-Max

Programmable Logic Type

Core Architecture

Number of Gates

Boundary Scan

Speed Grade

RAM (words)

Primary Attributes

Number of Logic Cells

Number of Cores

Bus Compatibility

Flash Size

UV Erasable

Height Seated (Max)

Length

Width

Radiation Hardening

RoHS Status

XCZU4EG-1SFVC784I

Mfr Part No

XCZU4EG-1SFVC784I

Xilinx Inc. Datasheet

160
In Stock

-

Min: 1

Mult: 1

11 Weeks

784-BFBGA, FCBGA

252

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC EG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

ROHS3 Compliant

XCZU7EV-2FFVC1156I

Mfr Part No

XCZU7EV-2FFVC1156I

Xilinx Inc. Datasheet

7172
In Stock

-

Min: 1

Mult: 1

11 Weeks

1156-BBGA, FCBGA

360

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC EV

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 504K+ Logic Cells

ROHS3 Compliant

A2F500M3G-1PQ208I

Mfr Part No

A2F500M3G-1PQ208I

Microchip Technology Datasheet

-

-

Min: 1

Mult: 1

208-BFQFP

208-PQFP (28x28)

A2F500M3G

ARM Cortex M3

64 kB

24

-

-

100 MHz

+ 100 C

Microchip Technology

- 40 C

Yes

SMD/SMT

113 I/O

-

6000 LE

Tray

Obsolete

N

This product may require additional documentation to export from the United States.

SmartFusion

0.183425 oz

-40°C ~ 100°C (TJ)

Tray

A2F500

100MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

512 kB

Ethernet, I²C, SPI, UART/USART

MCU, FPGA

500000

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

1 Core

512KB

XCZU3CG-1SFVA625E

Mfr Part No

XCZU3CG-1SFVA625E

Xilinx Inc. Datasheet

2044
In Stock

-

Min: 1

Mult: 1

11 Weeks

625-BFBGA, FCBGA

180

0°C~100°C TJ

Bulk

2016

Zynq® UltraScale+™ MPSoC CG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

ROHS3 Compliant

XCZU19EG-L1FFVC1760I

Mfr Part No

XCZU19EG-L1FFVC1760I

Xilinx Inc. Datasheet

288
In Stock

-

Min: 1

Mult: 1

11 Weeks

1760-BBGA, FCBGA

YES

512

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC EG

Active

4 (72 Hours)

ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

8542.31.00.01

BOTTOM

BALL

NOT SPECIFIED

0.72V

NOT SPECIFIED

R-PBGA-B1760

0.742V

0.698V

500MHz, 600MHz, 1.2GHz

256KB

MICROPROCESSOR CIRCUIT

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

ROHS3 Compliant

XCZU2CG-1SFVC784E

Mfr Part No

XCZU2CG-1SFVC784E

Xilinx Inc. Datasheet

1838
In Stock

  • 1: $299.409611
  • 10: $282.461896
  • 100: $266.473488
  • 500: $251.390083
  • View all price

Min: 1

Mult: 1

11 Weeks

784-BFBGA, FCBGA

252

0°C~100°C TJ

Tray

Zynq® UltraScale+™ MPSoC CG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

ROHS3 Compliant

M2S150T-1FC1152I

Mfr Part No

M2S150T-1FC1152I

Atmel (Microchip Technology) Datasheet

-

-

Min: 1

Mult: 1

FCBGA-1152

ARM Cortex M3

64 kB

24

-

-

166 MHz

Yes

SMD/SMT

12177 LAB

146124 LE

N

1.234218 oz

Tray

SmartFusion2

512 kB

1 Core

XC7Z014S-1CLG484I

Mfr Part No

XC7Z014S-1CLG484I

Xilinx Inc. Datasheet

1812
In Stock

  • 1: $103.216277
  • 10: $97.373846
  • 100: $91.862119
  • 500: $86.662377
  • View all price

Min: 1

Mult: 1

10 Weeks

484-LFBGA, CSPBGA

YES

200

-40°C~100°C TJ

Tray

2016

Zynq®-7000

e3

yes

Active

3 (168 Hours)

484

Matte Tin (Sn)

8542.31.00.01

BOTTOM

BALL

NOT SPECIFIED

1V

0.8mm

NOT SPECIFIED

S-PBGA-B484

1.05V

0.95V

667MHz

256KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

667MHz

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

YES

256000

Artix™-7 FPGA, 65K Logic Cells

CAN; ETHERNET; I2C; SPI; UART; USB

1.6mm

19mm

19mm

ROHS3 Compliant

XC7Z045-L2FFG900I

Mfr Part No

XC7Z045-L2FFG900I

Xilinx Inc. Datasheet

549
In Stock

  • 1: $3,404.626464
  • 10: $3,292.675497
  • 25: $3,269.786988
  • 50: $3,247.057585
  • View all price

Min: 1

Mult: 1

10 Weeks

900-BBGA, FCBGA

YES

130

-40°C~100°C TJ

Tray

2010

Zynq®-7000

e1

Active

4 (72 Hours)

900

3A991.D

Tin/Silver/Copper (Sn/Ag/Cu)

PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

8542.39.00.01

BOTTOM

BALL

245

1V

1mm

800MHz

30

S-PBGA-B900

1.05V

0.95V

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

ARM

YES

256000

Kintex™-7 FPGA, 350K Logic Cells

CAN; ETHERNET; I2C; SPI; UART; USB

3.35mm

31mm

31mm

ROHS3 Compliant

M2S050T-1FGG484I

Mfr Part No

M2S050T-1FGG484I

Microchip Technology Datasheet

1992
In Stock

  • 1: $192.038848
  • 10: $181.168725
  • 100: $170.913892
  • 500: $161.239520
  • View all price

Min: 1

Mult: 1

FPBGA-484

YES

484-FPBGA (23x23)

484

M2S050

ARM Cortex M3

64 kB

60

MICROSEMI CORP

-

-

M2S050T-1FGG484I

166 MHz

Microchip Technology

Yes

3

SMD/SMT

267

4695 LAB

56340 LE

Tray

PLASTIC/EPOXY

BGA

FBGA-484

BGA484,22X22,40

SQUARE

GRID ARRAY

Active

Active

5.76

Details

Yes

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

40

S-PBGA-B484

267

Not Qualified

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

267

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

1

FPGA - 50K Logic Modules

56340

1 Core

256KB

23 mm

23 mm

XC7Z030-3FFG676E

Mfr Part No

XC7Z030-3FFG676E

Xilinx Inc. Datasheet

1638
In Stock

  • 1: $306.699808
  • 10: $289.339442
  • 100: $272.961737
  • 500: $257.511072
  • View all price

Min: 1

Mult: 1

10 Weeks

Copper, Silver, Tin

676-BBGA, FCBGA

YES

676

130

0°C~100°C TJ

Tray

2009

Zynq®-7000

e1

Active

4 (72 Hours)

676

3A991.D

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

245

1V

1mm

1GHz

30

XC7Z030

1V

1.05V

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32b

ARM

YES

-3

256000

Kintex™-7 FPGA, 125K Logic Cells

CAN; ETHERNET; I2C; SPI; UART; USB

3.24mm

27mm

No

ROHS3 Compliant

XCZU2EG-1SFVC784E

Mfr Part No

XCZU2EG-1SFVC784E

Xilinx Inc. Datasheet

1940
In Stock

-

Min: 1

Mult: 1

11 Weeks

784-BFBGA, FCBGA

252

0°C~100°C TJ

Tray

2013

Zynq® UltraScale+™ MPSoC EG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

ROHS3 Compliant

5CSEBA2U23C8N

Mfr Part No

5CSEBA2U23C8N

Intel Datasheet

8000
In Stock

-

Min: 1

Mult: 1

8 Weeks

672-FBGA

YES

MCU - 181, FPGA - 145

0°C~85°C TJ

Tray

2018

Cyclone® V SE

Active

3 (168 Hours)

672

8542.39.00.01

BOTTOM

BALL

NOT SPECIFIED

1.1V

0.8mm

NOT SPECIFIED

S-PBGA-B672

145

Not Qualified

1.13V

1.11.2/3.32.5V

1.07V

600MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

145

FIELD PROGRAMMABLE GATE ARRAY

FPGA - 25K Logic Elements

25000

1.85mm

23mm

23mm

RoHS Compliant

5CSEBA6U23C7N

Mfr Part No

5CSEBA6U23C7N

Intel Datasheet

-

-

Min: 1

Mult: 1

8 Weeks

672-FBGA

YES

MCU - 181, FPGA - 145

0°C~85°C TJ

Tray

2018

Cyclone® V SE

Active

3 (168 Hours)

672

8542.39.00.01

BOTTOM

BALL

NOT SPECIFIED

1.1V

0.8mm

NOT SPECIFIED

5CSEBA6

S-PBGA-B672

145

Not Qualified

1.13V

1.11.2/3.32.5V

1.07V

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

145

FIELD PROGRAMMABLE GATE ARRAY

FPGA - 110K Logic Elements

110000

1.85mm

23mm

23mm

RoHS Compliant

M2S050T-FGG896

Mfr Part No

M2S050T-FGG896

Microchip Technology Datasheet

2400
In Stock

  • 1: $151.925238
  • 10: $143.325697
  • 100: $135.212921
  • 500: $127.559359
  • View all price

Min: 1

Mult: 1

FPBGA-896

YES

896-FBGA (31x31)

896

M2S050

ARM Cortex M3

64 kB

27

MICROSEMI CORP

-

-

M2S050T-FGG896

166 MHz

+ 85 C

Microchip Technology

0 C

Yes

SMD/SMT

377 I/O

4695 LAB

56340 LE

85 °C

Tray

PLASTIC/EPOXY

BGA

FBGA-896

BGA896,30X30,40

SQUARE

GRID ARRAY

Active

Active

40

2.31

Details

Yes

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

1.2000 V

0 to 85 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

1 mm

compliant

S-PBGA-B896

377

Not Qualified

1.2 V

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

377

2.44 mm

FIELD PROGRAMMABLE GATE ARRAY

STD

FPGA - 50K Logic Modules

56340

1 Core

256KB

31 mm

31 mm

10AS066H3F34E2SG

Mfr Part No

10AS066H3F34E2SG

Intel Datasheet

4499
In Stock

-

Min: 1

Mult: 1

8 Weeks

1152-BBGA, FCBGA

YES

492

0°C~100°C TJ

Tray

Arria 10 SX

Active

3 (168 Hours)

8542.39.00.01

BOTTOM

BALL

NOT SPECIFIED

0.9V

1mm

NOT SPECIFIED

S-PBGA-B1152

492

Not Qualified

0.93V

0.9V

0.87V

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

492

FIELD PROGRAMMABLE GATE ARRAY

FPGA - 660K Logic Elements

660000

3.65mm

35mm

35mm

RoHS Compliant

5CSEBA2U23C6N

Mfr Part No

5CSEBA2U23C6N

Intel Datasheet

33
In Stock

-

Min: 1

Mult: 1

8 Weeks

672-FBGA

YES

MCU - 181, FPGA - 145

0°C~85°C TJ

Tray

2018

Cyclone® V SE

Active

3 (168 Hours)

672

BOTTOM

BALL

NOT SPECIFIED

1.1V

0.8mm

NOT SPECIFIED

S-PBGA-B672

145

Not Qualified

1.13V

1.11.2/3.32.5V

1.07V

925MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

145

FIELD PROGRAMMABLE GATE ARRAY

FPGA - 25K Logic Elements

25000

1.85mm

23mm

23mm

RoHS Compliant

XCZU3EG-1SFVC784I

Mfr Part No

XCZU3EG-1SFVC784I

Xilinx Inc. Datasheet

574
In Stock

  • 1: $702.067339
  • 10: $662.327678
  • 100: $624.837432
  • 500: $589.469275
  • View all price

Min: 1

Mult: 1

11 Weeks

784-BFBGA, FCBGA

252

-40°C~100°C TJ

Tray

2016

Zynq® UltraScale+™ MPSoC EG

Active

4 (72 Hours)

8542.31.00.01

NOT SPECIFIED

NOT SPECIFIED

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

ROHS3 Compliant

10AS048H3F34E2SG

Mfr Part No

10AS048H3F34E2SG

Intel Datasheet

1242
In Stock

-

Min: 1

Mult: 1

11 Weeks

1152-BBGA, FCBGA

YES

492

0°C~100°C TJ

Tray

Arria 10 SX

Active

3 (168 Hours)

8542.39.00.01

BOTTOM

BALL

NOT SPECIFIED

0.9V

1mm

NOT SPECIFIED

S-PBGA-B1152

492

Not Qualified

0.93V

0.9V

0.87V

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

492

FIELD PROGRAMMABLE GATE ARRAY

FPGA - 480K Logic Elements

480000

3.65mm

35mm

35mm

RoHS Compliant

XC7Z030-3SBG485E

Mfr Part No

XC7Z030-3SBG485E

Xilinx Inc. Datasheet

792
In Stock

  • 1: $633.356464
  • 10: $612.530429
  • 25: $608.272521
  • 50: $604.044212
  • View all price

Min: 1

Mult: 1

10 Weeks

Copper, Silver, Tin

Surface Mount

484-FBGA, FCBGA

485

130

0°C~100°C TJ

Tray

2009

Zynq®-7000

e1

Active

4 (72 Hours)

485

EAR99

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY

8542.39.00.01

BOTTOM

BALL

NOT SPECIFIED

1V

0.8mm

1GHz

NOT SPECIFIED

Not Qualified

1.05V

11.8V

0.95V

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

256KB

MICROPROCESSOR CIRCUIT

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32b

ARM

YES

256000

Kintex™-7 FPGA, 125K Logic Cells

CAN; ETHERNET; I2C; SPI; UART; USB

N

2.44mm

19mm

ROHS3 Compliant