The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Material | Body Material | Number of Terminals | Mounting Hole Diameter | Package Quantity | Base Product Number | Brand | Country of Origin | Data RAM Size | Device Logic Units | ECCN | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Inside Diameter | Instruction Set Architecture | Interface Type | JTAG Support | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Number of User I/Os | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Method | Mounting Orientation | Mounting Styles | Number of CPU Cores | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shipping Restrictions | Special Features | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Usage Level | Voltage, Rating | Operating Temperature | Packaging | Series | Tolerance | JESD-609 Code | Part Status | Termination | Type | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Color | Applications | HTS Code | Capacitance | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Base Part Number | Pin Count | JESD-30 Code | Function | Number of Outputs | Qualification Status | Operating Supply Voltage | ESR (Equivalent Series Resistance) | Polarity | Power Supplies | Temperature Grade | Interface | Max Supply Voltage | Ripple Current | Life (Hours) | Impedance | Speed | RAM Size | Core Processor | Illumination | Peripherals | Program Memory Size | Connectivity | Current - Supply | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Includes | Screening Level | Overall Height | Speed Grade | Primary Attributes | Number of Registers | Number of Logic Cells | Finish | Number of Cores | Overall Length | Flash Size | Pin Diameter | Product Category | Device Core | Adhesive Type | Diameter | Height | Height Seated (Max) | Length | Width | Panel Thickness | Radiation Hardening | REACH SVHC |
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 | Mfr Part No XCZU48DR-2FSVG1517E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 561 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-VF400I | Microchip | Datasheet | 4 | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S025 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 207 | 27696 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-FGG484 | Microchip | Datasheet | 2119 |
| Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S090 | 64 kB | - | - | 166 MHz | Microchip Technology | 267 | 86316 LE | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 90K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU46DR-1FSVH1760E | AMD | Datasheet | 488 |
| Min: 1 Mult: 1 | Through Hole | 1760-BBGA, FCBGA | 2 | 1760-FCBGA (42.5x42.5) | RISC | Yes | AMD | 574 | Tray | Active | Compliant | 0 to 100 °C | Zynq® UltraScale+™ RFSoC | 120 Ω | 165 °C | -40 °C | 1760 | 30 V | JTAG | 30 V | 500MHz, 1.2GHz | 38 Mb | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Extended | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Arm Cortex A53/Arm Cortex R5 | Unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-L2FFVG1517I | AMD | Datasheet | 498 |
| Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 561 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-1FCSG325I | Microchip | Datasheet | 1684 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Through Hole | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | M2S060 | 64 kB | - | - | 166 MHz | Microchip Technology | 200 | 56520 LE | Tray | Active | Non-Compliant | 13 kV | -40°C ~ 100°C (TJ) | Bulk | SmartFusion®2 | 5 % | 100 °C | -55 °C | 5 nF | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | 45.0088 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FCVG484 | Microchip | Datasheet | 1908 |
| Min: 1 Mult: 1 | 484-BFBGA | 484-FBGA (19x19) | M2S150 | 64 kB | - | - | 166 MHz | Microchip Technology | 273 | 146124 LE | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC6C6U23C8NES | ALTERA | Datasheet | 28 | - | Min: 1 Mult: 1 | Through Hole | 672-FBGA | 672-UBGA (23x23) | MCU - 181, FPGA - 145 | Compliant | 100 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SX | 20 % | Obsolete | Soldering | 105 °C | -40 °C | 330 µF | 5CSXFC6 | 380 mΩ | Polar | 880 mA | 10000 hours | 240 mΩ | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 110K Logic Elements | -- | 18 mm | 30 mm | 32.9946 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4CG-L1SFVC784I | AMD | Datasheet | 10 | - | Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU4 | AMD | 252 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-FGG484 | Microchip | Datasheet | 1884 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S060 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S060T-FGG484 | 166 MHz | Microchip Technology | 3 | 267 | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.81 | Non-Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150-1FC1152 | Microchip | Datasheet | 1958 | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | Stainless Steel | Stainless Steel | 1152 | 6.5 X 12 mm X 2 | 1 | M2S150 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S150-1FC1152 | 166 MHz | Microchip Technology | Screw, Weld | Universal | SMD/SMT | 574 | 146124 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | No | Concealed, Removable | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | Natural | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | Fasteners not included | FPGA - 150K Logic Modules | 146124 | Natural | 1 Core | 60.0 mm | 512KB | 5.0 mm | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-L1FFVE1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Thermoplastic Rubber | 4000 | 12.5 mm | 135 °C | AMD | -40 °C | 366 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | Hole Grommet | Black | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 6.4 mm | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | 1.6 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU46DR-1FFVH1760I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 574 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-L1FFVE1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Corner Holes | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Vinyl | US | EAR99 | AMD | 366 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | Green/Red on White | General Purpose | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | Not Illuminated | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | Gloss | - | Repositionable Acrylic | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU17EG-L2FFVC1760E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | XCZU17 | AMD | 512 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2L | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS095TS-FCVG484I | Microchip | Datasheet | 1885 |
| Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | - | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | - 40 C | SMD/SMT | MCU - 136, FPGA - 276 | 93000 LE | Tray | Active | -40°C ~ 100°C | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z014S-1CLG400I | AMD | Datasheet | 2066 |
| Min: 1 Mult: 1 | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) | XC7Z014 | 65000 | 125 | AMD | Surface Mount | 125 | Tray | Active | WCBGA | 1.0000 V | Industrial grade | -40 to 100 °C | Zynq®-7000 | 400 | 667MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 1 | Artix™-7 FPGA, 65K Logic Cells | 81200 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM63138DKFSBG | Broadcom | Datasheet | - | - | Min: 1 Mult: 1 | - | - | - | Broadcom | 420 | RISC | Ethernet | Broadcom Limited | Broadcom Limited | 2 | Tray | Active | - | - | Ethernet & Communication Modules | - | Ethernet | Ethernet | - | 32 Bit | Gateways | Gateways | ARM Cortex A9 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS032E4F27I3SG | ALTERA | Datasheet | 779 |
| Min: 1 Mult: 1 | FBGA-672 | YES | 672 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS032E4F27I3SG | 1.2 GHz | Yes | SMD/SMT | 240 | 40000 LAB | 320000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA672,26X26,40 | BGA672,26X26,40 | SQUARE | GRID ARRAY | 973484 | Active | NOT SPECIFIED | 5.45 | Details | Yes | FPGA Arriau00ae 10 SX Family 320000 Cells 20nm Technology 0.9V 672-Pin FC-FBGA | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B672 | 240 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | SoC FPGA | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS066K3F35I2LG | ALTERA | Datasheet | 423 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | Intel / Altera | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066K3F35I2LG | 1.2 GHz | Yes | SMD/SMT | 396 | 82500 LAB | 660000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965077 | Active | NOT SPECIFIED | 5.46 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 396 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm |
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XCZU48DR-2FSVG1517E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025T-VF400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090TS-FGG484
Microchip
Package:Embedded - System On Chip (SoC)
404.155100
-
XCZU46DR-1FSVH1760E
AMD
Package:Embedded - System On Chip (SoC)
21,814.741831
-
XCZU43DR-L2FFVG1517I
AMD
Package:Embedded - System On Chip (SoC)
34,383.020845
-
M2S060T-1FCSG325I
Microchip
Package:Embedded - System On Chip (SoC)
202.531146
-
M2S150T-1FCVG484
Microchip
Package:Embedded - System On Chip (SoC)
245.174059
-
5CSXFC6C6U23C8NES
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU4CG-L1SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060T-FGG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150-1FC1152
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU47DR-L1FFVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU46DR-1FFVH1760I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU48DR-L1FFVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU17EG-L2FFVC1760E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MPFS095TS-FCVG484I
Microchip
Package:Embedded - System On Chip (SoC)
203.877321
-
XC7Z014S-1CLG400I
AMD
Package:Embedded - System On Chip (SoC)
117.723297
-
BCM63138DKFSBG
Broadcom
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS032E4F27I3SG
ALTERA
Package:Embedded - System On Chip (SoC)
1,475.221953
-
10AS066K3F35I2LG
ALTERA
Package:Embedded - System On Chip (SoC)
6,998.973794