The category is 'Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Access Time-Max | Base Product Number | Brand | Clock Frequency-Max | Clock Frequency-Max (fCLK) | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/O Lines | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Response Time-Nom | Risk Rank | RoHS | Rohs Code | Samacsys Description | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Supply Voltage-Nom (Vsup) | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Output Type | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Memory Size | Speed | RAM Size | Operating Mode | Core Processor | Peripherals | Program Memory Size | Propagation Delay | Connectivity | Supply Current-Max | Data Rate | Architecture | Amplifier Type | Number of Inputs | Organization | Seated Height-Max | Memory Width | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Average Bias Current-Max (IIB) | Standby Current-Max | Supply Voltage Limit-Max | Memory Density | Total RAM Bits | Number of Gates | Parallel/Serial | Number of Logic Blocks (LABs) | Memory IC Type | Speed Grade | Output Function | Number of Transceivers | Primary Attributes | Combinatorial Delay of a CLB-Max | Write Protection | Number of CLBs | Number of Logic Cells | Number of Dedicated Inputs | Number of Cores | Number of Equivalent Gates | Flash Size | Product Category | Length | Width |
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![]() | Mfr Part No XC5210-5TQ176C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 176 | 176 | 83 MHz | XILINX INC | XC5210-5TQ176C | 3 | 85 °C | PLASTIC/EPOXY | LFQFP | PLASTIC, TQFP-176 | QFP176,1.0SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | 5.84 | Non-Compliant | No | 5.25 V | 4.75 V | 5 V | e0 | Tin/Lead (Sn85Pb15) | MAX AVAILABLE 16000 LOGIC GATES | 8542.39.00.01 | QUAD | GULL WING | 0.5 mm | not_compliant | 176 | S-PQFP-G176 | 196 | Not Qualified | 5 V | OTHER | 196 | 324 CLBS, 10000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 4.6 ns | 324 | 324 | 10000 | 24 mm | 24 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC4VFX140-11FF1760C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1760 | XILINX INC | XC4VFX140-11FF1760C | 4 | 85 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | BGA | 30 | 5.26 | No | 1.26 V | 1.14 V | 1.2 V | e0 | No | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1 mm | not_compliant | 1760 | S-PBGA-B1760 | Not Qualified | OTHER | 15792 CLBS | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | 15792 | 42.5 mm | 42.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC4044XLA-08HQG208C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | 263 MHz | XILINX INC | XC4044XLA-08HQG208C | 3 | 85 °C | PLASTIC/EPOXY | HFQFP | HFQFP, | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Obsolete | QFP | 5.81 | Yes | 3.6 V | 3 V | 3.3 V | e3 | Matte Tin (Sn) | CAN ALSO USE 80000 GATES | 8542.39.00.01 | QUAD | GULL WING | 0.5 mm | compliant | 208 | S-PQFP-G208 | Not Qualified | OTHER | 1600 CLBS, 27000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 ns | 1600 | 27000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCV400-6FGG676C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 676 | 333 MHz | XILINX INC | XCV400-6FGG676C | 3 | 85 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | BGA | 30 | 5.8 | Yes | 2.625 V | 2.375 V | 2.5 V | e1 | Yes | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | 676 | S-PBGA-B676 | Not Qualified | OTHER | 2400 CLBS, 468252 GATES | 2.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 0.6 ns | 2400 | 468252 | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC2VP100-7FFG1696C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1696 | 1350 MHz | XILINX INC | XC2VP100-7FFG1696C | 4 | 85 °C | PLASTIC/EPOXY | BGA | 42.50 X 42.50 MM, 1 MM PITCH, MS-034AAV-1, FCBGA-1696 | SQUARE | GRID ARRAY | Obsolete | BGA | 30 | 5.79 | Yes | 1.575 V | 1.425 V | 1.5 V | e1 | Yes | 3A001.A.7.A | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1 mm | not_compliant | 1696 | S-PBGA-B1696 | Not Qualified | OTHER | 11024 CLBS | 3.45 mm | FIELD PROGRAMMABLE GATE ARRAY | 0.28 ns | 11024 | 42.5 mm | 42.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC4062XLA-09HQG208I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | 227 MHz | XILINX INC | XC4062XLA-09HQG208I | 3 | PLASTIC/EPOXY | HFQFP | HFQFP, | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Obsolete | QFP | 5.79 | Yes | 3.6 V | 3 V | 3.3 V | e3 | Matte Tin (Sn) | CAN ALSO USE 130000 GATES | 8542.39.00.01 | QUAD | GULL WING | 0.5 mm | compliant | 208 | S-PQFP-G208 | Not Qualified | 2304 CLBS, 40000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 1.1 ns | 2304 | 40000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC4062XLA-09HQG304I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 304 | 227 MHz | XILINX INC | XC4062XLA-09HQG304I | PLASTIC/EPOXY | HFQFP | HFQFP, | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Obsolete | QFP | 5.81 | Yes | 3.6 V | 3 V | 3.3 V | CAN ALSO USE 130000 GATES | 8542.39.00.01 | QUAD | GULL WING | 0.5 mm | compliant | 304 | S-PQFP-G304 | Not Qualified | 2304 CLBS, 40000 GATES | 4.5 mm | FIELD PROGRAMMABLE GATE ARRAY | 1.1 ns | 2304 | 40000 | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC4062XLA-08BGG560C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 560 | 263 MHz | XILINX INC | XC4062XLA-08BGG560C | 3 | 85 °C | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | BGA | 40 | 5.81 | Yes | 3.6 V | 3 V | 3.3 V | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | CAN ALSO USE 130000 GATES | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | compliant | 560 | S-PBGA-B560 | Not Qualified | OTHER | 2304 CLBS, 40000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 ns | 2304 | 40000 | 42.5 mm | 42.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AT17LV128-10CC | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 75 ns | 10 MHz | ATMEL CORP | AT17LV128-10CC | 3 | 131072 words | 128000 | 70 °C | UNSPECIFIED | SON | SON, SOLCC8,.25 | SOLCC8,.25 | SQUARE | SMALL OUTLINE | Obsolete | SOIC | 30 | 5.88 | No | 3.3 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | 8542.32.00.51 | DUAL | NO LEAD | 240 | 1 | 1.27 mm | compliant | 8 | S-XDSO-N8 | Not Qualified | 3.6 V | 3.3 V | COMMERCIAL | 3 V | SYNCHRONOUS | 0.005 mA | 128KX1 | 1.14 mm | 1 | 0.00005 A | 131072 bit | SERIAL | CONFIGURATION MEMORY | 5.99 mm | 5.99 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AT17LV010-10SC | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | 15 MHz | ATMEL CORP | AT17LV010-10SC | 1 | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP20,.4 | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | 30 | 5.82 | No | 3.3 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 1.27 mm | compliant | 20 | R-PDSO-G20 | Not Qualified | 3.6 V | 3.3/5 V | COMMERCIAL | 3 V | SYNCHRONOUS | 0.01 mA | 1MX1 | 2.65 mm | 1 | 1048576 bit | SERIAL | CONFIGURATION MEMORY | HARDWARE | 12.8 mm | 7.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No APA600-FG256C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 180 MHz | MICROSEMI CORP | APA600-FG256C | 70 °C | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | 5.9 | No | 2.7 V | 2.3 V | 2.5 V | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B256 | 186 | Not Qualified | 2.5,2.5/3.3 V | COMMERCIAL | 186 | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No LT6700HS6-3 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 6 | ANALOG DEVICES INC | LT6700HS6-3 | 1 | 125 °C | -40 °C | PLASTIC/EPOXY | VSSOP | VSSOP, | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | Active | 29000 ns | 5.09 | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | GULL WING | 235 | 2 | 0.95 mm | not_compliant | 20 | R-PDSO-G6 | Not Qualified | OPEN-COLLECTOR | AUTOMOTIVE | COMPARATOR | 1 mm | 0.05 µA | 18.5 V | 2.9 mm | 1.625 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No LFXP2-17E-7FTN256C8W | Lattice Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 256 | 420 MHz | LATTICE SEMICONDUCTOR CORP | LFXP2-17E-7FTN256C8W | 3 | 201 | 85 °C | PLASTIC/EPOXY | BGA | 17 X 17 MM, LEAD FREE, FTBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Obsolete | BGA | 5.83 | Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | e1 | Yes | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 85 °C | 0 °C | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 mm | unknown | 40 | 256 | S-PBGA-B256 | 201 | Not Qualified | 1.2 V | 1.2,1.2/3.3,3.3 V | OTHER | 38.9 kB | 201 | 2.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 17000 | 2125 | 17000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No EP20K400BC652-3V | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 652 | ROCHESTER ELECTRONICS LLC | EP20K400BC652-3V | 502 | 85 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | BGA | 5.6 | 2.625 V | 2.375 V | 2.5 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 1.27 mm | unknown | 652 | S-PBGA-B652 | COMMERCIAL | OTHER | 3.6 ns | 4 DEDICATED INPUTS, 502 I/O | 3.5 mm | LOADABLE PLD | MACROCELL | 4 | 45 mm | 45 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2GL005-VF256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | VFBGA-256 | YES | 256-FPBGA (14x14) | 256 | M2GL005 | Microchip Technology / Atmel | 119 | MICROSEMI CORP | M2GL005-VF256I | + 100 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 161 I/O | 6060 LE | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 20 | 5.27 | N | No | IC FPGA 161 I/O 256VFBGA | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | 0.321234 oz | -40°C ~ 100°C (TJ) | Tray | M2GL005 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Programmable Logic ICs | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B256 | 1.2 V | - | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | 6060 | FPGA - Field Programmable Gate Array | 719872 | STD | - | FPGA - Field Programmable Gate Array | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3P1000L-FG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | M1A3P1000 | 350 MHz | MICROSEMI CORP | M1A3P1000L-FG256I | 1.26 V | Microchip Technology | 1.14 V | 3 | 177 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | No | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 85 °C | ProASIC3L | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 177 | Not Qualified | 1.5/3.3 V | INDUSTRIAL | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 24576 | 1000000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S090TS-1FG676I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | BGA-676 | YES | 676-FBGA (27x27) | 676 | M2S090 | Microchip Technology / Atmel | 64 kB | 40 | MICROSEMI CORP | - | - | M2S090TS-1FG676I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 425 | 7193 LAB | 86316 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.29 | N | No | 1.26 V | 1.14 V | 1.2 V | 1.071118 oz | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | SoC FPGA | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2GL090TS-FCS325 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2GL090 | MICROSEMI CORP | M2GL090TS-FCS325 | Microchip Technology | 180 | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA325,21X21,20 | BGA325,21X21,20 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B325 | 180 | Not Qualified | 1.2 V | OTHER | 180 | FIELD PROGRAMMABLE GATE ARRAY | 86184 | 2648064 | 86316 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1AFS600-FG256K | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | 256-LBGA | YES | 256 | 256-FPBGA (17x17) | 256 | M1AFS600 | MICROSEMI CORP | M1AFS600-FG256K | Microchip Technology | 3 | 119 | 100 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 20 | 5.3 | Non-Compliant | No | 1.575 V | 1.425 V | 1.5 V | -55°C ~ 100°C (TJ) | Fusion® | e0 | Tin/Lead (Sn/Pb) | 100 °C | -55 °C | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | OTHER | 13.5 kB | 600000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 600000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S090-1FCS325I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x13.5) | 325 | M2S090 | 64 kB | MICROSEMI CORP | - | - | M2S090-1FCS325I | 166 MHz | Microchip Technology | SMD/SMT | 180 | 86316 LE | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.77 | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | R-PBGA-B325 | 180 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.16 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 13.5 mm | 11 mm |
XC5210-5TQ176C
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
XC4VFX140-11FF1760C
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
XC4044XLA-08HQG208C
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
XCV400-6FGG676C
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
XC2VP100-7FFG1696C
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
XC4062XLA-09HQG208I
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
XC4062XLA-09HQG304I
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
XC4062XLA-08BGG560C
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
AT17LV128-10CC
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
AT17LV010-10SC
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
APA600-FG256C
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
LT6700HS6-3
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
LFXP2-17E-7FTN256C8W
Lattice Semiconductor
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
EP20K400BC652-3V
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
M2GL005-VF256I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
M1A3P1000L-FG256I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
M2S090TS-1FG676I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
M2GL090TS-FCS325
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
M1AFS600-FG256K
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
M2S090-1FCS325I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
