The category is 'Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Brand | Cache Memory | Clock Frequency-Max | Data RAM Size | Dimensions | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Installed RAM | Interface Type | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Maximum RAM Capacity | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | On-Board Storage Size | On-Board Storage Type | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Processor Brand | Processor Series | Processor Type | Product Status | Qualification | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | Size / Dimension | JESD-609 Code | Pbfree Code | ECCN Code | Temperature Coefficient | Connector Type | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Subcategory | Power Rating | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Resistor Type | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Data Rate | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Number of Gates | Speed Grade | Number of Transceivers | Resistance Tolerance | Primary Attributes | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Form Factor | Number of Cores | Module/Board Type | Number of Equivalent Gates | Flash Size | Co-Processor | Product Category | Product Length | Product Width | Height | Length | Width |
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 | Mfr Part No M1A3P1000L-FGG484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 484 | 350 MHz | MICROSEMI CORP | M1A3P1000L-FGG484 | 3 | 70 °C | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Obsolete | 40 | 5.27 | Yes | 1.575 V | 1.14 V | 1.2 V | e1 | TIN SILVER COPPER | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 300 | Not Qualified | 1.5/3.3 V | COMMERCIAL | 300 | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 24576 | 1000000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AGL600V2-FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete (Last Updated: 2 months ago) | Surface Mount | YES | 484 | 400.011771 mg | 484 | 108 MHz | MICROSEMI CORP | M1AGL600V2-FG484I | 3 | 235 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | SQUARE | GRID ARRAY | Obsolete | 30 | 5.86 | Non-Compliant | No | 1.575 V | 1.14 V | 1.2 V | e0 | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.14 V | 13.5 kB | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 600000 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL090TS-1FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | FBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2GL090 | Microchip Technology / Atmel | 60 | MICROSEMI CORP | M2GL090TS-1FG484I | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 267 I/O | 86316 | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | 0.627572 oz | -40°C ~ 100°C (TJ) | Tray | M2GL090TS | 100 °C | -40 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 1.2 V | 323.3 kB | 667 Mb/s | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86316 | FPGA - Field Programmable Gate Array | 2648064 | 4 Transceiver | 86316 | FPGA - Field Programmable Gate Array | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010TS-1VF400I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S010 | 64 kB | MICROSEMI CORP | - | - | M2S010TS-1VF400I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | SMD/SMT | 195 | 12084 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.86 | No | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 10K Logic Modules | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL150TS-FCS536 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | M2GL150 | MICROSEMI CORP | M2GL150TS-FCS536 | Microchip Technology | 293 | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B536 | OTHER | FIELD PROGRAMMABLE GATE ARRAY | 146124 | 5120000 | STD | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P400-1FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 484 | MICROSEMI CORP | M1A3P400-1FG484I | 3 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | 30 | 5.25 | No | 1.575 V | 1.425 V | 1.5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | INDUSTRIAL | 9216 CLBS, 400000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 9216 | 400000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL150TS-FC1152 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | M2GL150 | MICROSEMI CORP | M2GL150TS-FC1152 | 1.26 V | Microchip Technology | 1.14 V | 574 | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | OTHER | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 146124 | 5120000 | STD | 146124 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150-1FCSG536 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | M2S150 | 64 kB | MICROSEMI CORP | - | - | M2S150-1FCSG536 | 166 MHz | Microchip Technology | 3 | 293 | 146124 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-536 | BGA536,30X30,20 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.77 | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | compliant | S-PBGA-B536 | 293 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 293 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL050T-FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2GL050 | MICROSEMI CORP | M2GL050T-FG484I | Microchip Technology | 3 | 267 | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | IGLOO2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 1869824 | STD | 56340 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL050-1FCS325 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2GL050 | MICROSEMI CORP | M2GL050-1FCS325 | Microchip Technology | 200 | 85 °C | Tray | PLASTIC/EPOXY | BGA | 11 X 11 MM, 0.50 MM PITCH, FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | OTHER | 200 | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 1869824 | 56340 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL025TS-VF400 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2GL025 | MICROSEMI CORP | M2GL025TS-VF400 | + 85 C | Microchip Technology | 0 C | SMD/SMT | 207 | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 20 | 5.27 | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | 1.2 V | OTHER | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 27696 | 1130496 | 4 Transceiver | 27696 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC2VP20-5FF1152CES | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1152 | 1050 MHz | XILINX INC | XC2VP20-5FF1152CES | 4 | 85 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | BGA | 30 | 5.83 | No | 1.575 V | 1.425 V | 1.5 V | e0 | No | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | compliant | 1152 | S-PBGA-B1152 | Not Qualified | OTHER | 2320 CLBS | 3.4 mm | FIELD PROGRAMMABLE GATE ARRAY | 0.36 ns | 2320 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7K325T-2FBV676C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 676 | XILINX INC | XC7K325T-2FBV676C | 85 °C | PLASTIC/EPOXY | BGA | FBGA-676 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 5.78 | Yes | 1.03 V | 0.97 V | 1 V | e1 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B676 | OTHER | 25475 CLBS | 2.54 mm | FIELD PROGRAMMABLE GATE ARRAY | 0.61 ns | 25475 | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XA7S50-2FTGB196I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | XILINX INC | XA7S50-2FTGB196I | , | Active | 5.81 | Yes | compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LMS-SOM-VISION | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | AEC-Q200 | Details | 100 ppm/K | 169 kOhm | Computing | 0.1 W | General Purpose | System-On-Modules - SOM | 1 | System-On-Modules - SOM | 1.55 mm | 0.85 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CC-WMX-FS7D-NN | Digi | Datasheet | - | - | Min: 1 Mult: 1 | 32 kB | 40 mm x 45 mm x 3.5 mm | 50 | 1 GB | Bluetooth, Ethernet, I2C, PCIe, SPI, UART, USB, WiFi | + 85 C | 1 GB | LPDDR4 | Digi | - 40 C | 8 GB | eMMC | Bulk | NXP | NXP i.MX8 Nano | i.MX 8M Nano | Active | -40°C ~ 85°C | ConnectCore® 8M | 1.770 L x 1.570 W (45.00mm x 40.00mm) | USB | 1.4 GHz | - | 1 GB | 600MHz, 1.4GHz | 1GB | ARM® Cortex®-A53 | Digi SMTplus | MCU Core | - | ARM® Cortex®-M7 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CC-MX-FR6D-ZN | Digi | Datasheet | - | - | Min: 1 Mult: 1 | 32 kB | 45 mm x 40 mm x 3.5 mm | 50 | 512 MB | Ethernet, I2C, PCIe, SPI, UART, USB | + 85 C | 1 GB | LPDDR4 | Digi | - 40 C | Yes | 8 GB | eMMC | Bulk | NXP | NXP i.MX8 Nano | i.MX 8M Nano | Active | -40°C ~ 85°C | ConnectCore® 8M | 1.770 L x 1.570 W (45.00mm x 40.00mm) | USB | 1.4 GHz | 512 MB | 600MHz, 1.4GHz | 512MB | ARM® Cortex®-A53 | Digi SMTplus | MCU Core | - | ARM® Cortex®-M7 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TE0715-04-71I33-A | Trenz Electronic | Datasheet | - | - | Min: 1 Mult: 1 | 1 | 1 GB | Ethernet, I2C, SPI, USB 2.0 | + 85 C | 1 GB | Trenz Electronic GmbH | - 40 C | Bulk | Xilinx | XC7Z030-1SBG485I | Discontinued at Digi-Key | Details | -40°C ~ 85°C | TE0715 | 1.970 L x 1.570 W (50.00mm x 40.00mm) | Samtec LSHM | - | 3.3 V | 125MHz | 1GB | ARM Cortex-A9 | 4 cm x 5 cm | MCU, FPGA | 32MB | Zynq-7000 (Z-7030) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TE0712-02-71I36-A | Trenz Electronic | Datasheet | - | - | Min: 1 Mult: 1 | 1 | 1 GB | Ethernet, JTAG | + 85 C | 1 GB | Trenz Electronic GmbH | - 40 C | Bulk | Xilinx | XC7A100T-1FGG484I | Discontinued at Digi-Key | Details | -40°C ~ 85°C | TE0712 | 1.970 L x 1.570 W (50.00mm x 40.00mm) | Samtec LSHM | - | 2.4 V to 5.5 V | 200MHz | 1GB | Artix-7 A100T | 4 cm x 5 cm | FPGA Core | 32MB | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TE0745-02-71I31-A | Trenz Electronic | Datasheet | - | - | Min: 1 Mult: 1 | 76 mm x 52 mm | 1 | 1 GB | Ethernet, I2C, QSPI, USB 2.0 | + 85 C | 1 GB | Trenz Electronic GmbH | - 40 C | Bulk | Xilinx | XC7Z030-1FBG676I | Active | Details | -40°C ~ 85°C | TE0745 | 2.050 L x 2.990 W (52.00mm x 76.00mm) | Board-to-Board (BTB) Socket - 160 | - | 12 V | - | 1GB | ARM Cortex-A9 | 5.2 cm x 7.6 cm | MCU, FPGA | 64MB | Zynq-7000 (Z-7030) |
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M1A3P1000L-FGG484
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M1AGL600V2-FG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL090TS-1FG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2S010TS-1VF400I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL150TS-FCS536
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M1A3P400-1FG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL150TS-FC1152
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2S150-1FCSG536
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL050T-FG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL050-1FCS325
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL025TS-VF400
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XC2VP20-5FF1152CES
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XC7K325T-2FBV676C
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XA7S50-2FTGB196I
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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LMS-SOM-VISION
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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CC-WMX-FS7D-NN
Digi
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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CC-MX-FR6D-ZN
Digi
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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TE0715-04-71I33-A
Trenz Electronic
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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TE0712-02-71I36-A
Trenz Electronic
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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TE0745-02-71I31-A
Trenz Electronic
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire