The category is 'Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Data Rate | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Number of Gates | Speed Grade | Number of Transceivers | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Product Category | Length | Width |
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 | Mfr Part No M2GL005-1VFG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | VFBGA-256 | YES | 256-FPBGA (14x14) | 256 | M2GL005 | Microchip Technology / Atmel | 119 | MICROSEMI CORP | M2GL005-1VFG256 | + 85 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 161 I/O | 6060 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.28 | Details | Yes | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL005 | Programmable Logic ICs | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | S-PBGA-B256 | 1.2 V | OTHER | - | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | 6060 | FPGA - Field Programmable Gate Array | 719872 | - | FPGA - Field Programmable Gate Array | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL060-VFG400I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2GL060 | Microchip Technology / Atmel | 90 | MICROSEMI CORP | M2GL060-VFG400I | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 207 | 56520 LE | Tray | PLASTIC/EPOXY | LFBGA | 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.25 | Details | Yes | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | 0.299386 oz | -40°C ~ 100°C (TJ) | Tray | IGLOO2 | 8542.39.00.01 | Programmable Logic ICs | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | S-PBGA-B400 | 1.2 V | 667 Mb/s | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 56520 | FPGA - Field Programmable Gate Array | 1869824 | STD | 4 Transceiver | FPGA - Field Programmable Gate Array | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL005-VF256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | VFBGA-256 | YES | 256-FPBGA (14x14) | 256 | M2GL005 | Microchip Technology / Atmel | 119 | MICROSEMI CORP | M2GL005-VF256I | + 100 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 161 I/O | 6060 LE | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 20 | 5.27 | N | No | IC FPGA 161 I/O 256VFBGA | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | 0.321234 oz | -40°C ~ 100°C (TJ) | Tray | M2GL005 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Programmable Logic ICs | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B256 | 1.2 V | - | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | 6060 | FPGA - Field Programmable Gate Array | 719872 | STD | - | FPGA - Field Programmable Gate Array | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P1000L-FG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | M1A3P1000 | 350 MHz | MICROSEMI CORP | M1A3P1000L-FG256I | 1.26 V | Microchip Technology | 1.14 V | 3 | 177 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | No | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 85 °C | ProASIC3L | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 177 | Not Qualified | 1.5/3.3 V | INDUSTRIAL | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 24576 | 1000000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-1FG676I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | BGA-676 | YES | 676-FBGA (27x27) | 676 | M2S090 | Microchip Technology / Atmel | 64 kB | 40 | MICROSEMI CORP | - | - | M2S090TS-1FG676I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 425 | 7193 LAB | 86316 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.29 | N | No | 1.26 V | 1.14 V | 1.2 V | 1.071118 oz | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | SoC FPGA | 27 mm | 27 mm | |||||||||||||||||||||||||||||||
| Mfr Part No M2GL090TS-FCS325 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2GL090 | MICROSEMI CORP | M2GL090TS-FCS325 | Microchip Technology | 180 | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA325,21X21,20 | BGA325,21X21,20 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B325 | 180 | Not Qualified | 1.2 V | OTHER | 180 | FIELD PROGRAMMABLE GATE ARRAY | 86184 | 2648064 | 86316 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AFS600-FG256K | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | 256-LBGA | YES | 256 | 256-FPBGA (17x17) | 256 | M1AFS600 | MICROSEMI CORP | M1AFS600-FG256K | Microchip Technology | 3 | 119 | 100 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 20 | 5.3 | Non-Compliant | No | 1.575 V | 1.425 V | 1.5 V | -55°C ~ 100°C (TJ) | Fusion® | e0 | Tin/Lead (Sn/Pb) | 100 °C | -55 °C | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | OTHER | 13.5 kB | 600000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 600000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090-1FCS325I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x13.5) | 325 | M2S090 | 64 kB | MICROSEMI CORP | - | - | M2S090-1FCS325I | 166 MHz | Microchip Technology | SMD/SMT | 180 | 86316 LE | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.77 | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | R-PBGA-B325 | 180 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.16 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 13.5 mm | 11 mm | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150-1FCS536I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | M2S150 | 64 kB | MICROSEMI CORP | - | - | M2S150-1FCS536I | 166 MHz | Microchip Technology | 293 | 146124 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA536,30X30,20 | BGA536,30X30,20 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | No | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | not_compliant | S-PBGA-B536 | 293 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 293 | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-1FG484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S060 | 64 kB | MICROSEMI CORP | - | - | M2S060TS-1FG484 | 166 MHz | Microchip Technology | 3 | 267 | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL060T-FG676I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2GL060 | MICROSEMI CORP | M2GL060T-FG676I | + 100 C | Microchip Technology | - 40 C | 3 | SMD/SMT | 387 | 56520 LE | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 20 | 5.26 | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B676 | 1.2 V | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56520 | 1869824 | 4 Transceiver | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL060TS-VF400 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2GL060 | MICROSEMI CORP | M2GL060TS-VF400 | + 85 C | Microchip Technology | 0 C | SMD/SMT | 207 | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | 17 X 17 MM, 0.80 MM PITCH, VFBGA-400 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 20 | 5.26 | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B400 | 1.2 V | OTHER | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 56520 | 1869824 | 4 Transceiver | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL150-FC1152I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | M2GL150 | MICROSEMI CORP | M2GL150-FC1152I | 1.26 V | Microchip Technology | 1.14 V | 574 | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | No | FPGA - Field Programmable Gate Array IGLOO 2 | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 146124 | 5120000 | STD | 146124 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL025T-VF400 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | 400 | M2GL025 | MICROSEMI CORP | M2GL025T-VF400 | + 85 C | Microchip Technology | 0 C | SMD/SMT | 207 | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 20 | 5.3 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 85 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | 1.2 V | OTHER | 138 kB | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 27696 | 1130496 | 4 Transceiver | 27696 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-1FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S005 | 64 kB | MICROSEMI CORP | - | - | M2S005-1FG484I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 3 | SMD/SMT | 209 | 6060 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.86 | No | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 217 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 217 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 5K Logic Modules | 4956 | 1 Core | 128KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL010-1VF400 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | 400 | M2GL010 | MICROSEMI CORP | M2GL010-1VF400 | + 85 C | Microchip Technology | 0 C | SMD/SMT | 195 | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 20 | 5.3 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 85 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B400 | 195 | Not Qualified | 1.2 V | 1.2 V | OTHER | 114 kB | 195 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | 933888 | 1 | 12084 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL060-FG676I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2GL060 | MICROSEMI CORP | M2GL060-FG676I | + 100 C | Microchip Technology | - 40 C | 3 | SMD/SMT | 387 | 56520 LE | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 20 | 5.26 | No | FPGA - Field Programmable Gate Array IGLOO 2 | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | IGLOO2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B676 | 1.2 V | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56520 | 1869824 | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010T-FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S010 | 64 kB | MICROSEMI CORP | - | - | M2S010T-FG484I | 166 MHz | Microchip Technology | 3 | SMD/SMT | 233 | 12084 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL025S-1VFG400I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 400 | 400 | MICROSEMI CORP | M2GL025S-1VFG400I | 3 | 207 | PLASTIC/EPOXY | FBGA | BGA400,20X20,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | 5.82 | Compliant | Yes | 1.2 V | 100 °C | -40 °C | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | 138 kB | 207 | FIELD PROGRAMMABLE GATE ARRAY | 27696 | 27696 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S100T-1FC1152I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1152 | MICROSEMI CORP | M2S100T-1FC1152I | PLASTIC/EPOXY | BGA | 35 X 35 MM, 1 MM PITCH, FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | NOT SPECIFIED | 5.86 | No | 1.26 V | 1.14 V | 1.2 V | e0 | TIN LEAD | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 99512 | 35 mm | 35 mm |
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M2GL005-1VFG256
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL060-VFG400I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL005-VF256I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M1A3P1000L-FG256I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2S090TS-1FG676I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL090TS-FCS325
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M1AFS600-FG256K
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2S090-1FCS325I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2S150-1FCS536I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2S060TS-1FG484
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL060T-FG676I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL060TS-VF400
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL150-FC1152I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL025T-VF400
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2S005-1FG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL010-1VF400
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL060-FG676I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2S010T-FG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL025S-1VFG400I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2S100T-1FC1152I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire