The category is 'Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)'
- All Manufacturers
- Manufacturer Part Number
- Ihs Manufacturer
- Part Life Cycle Code
- Reach Compliance Code
- Risk Rank
- Package Description
- Number of Terminals
- Surface Mount
- Package Body Material
- Package Style
- Terminal Form
- Terminal Position
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | # I/Os (Max) | # Registers | Access Time-Max | Base Product Number | Brand | Clock Frequency-Max | Clock Frequency-Max (fCLK) | Device System Gates | Factory Pack QuantityFactory Pack Quantity | Family Name | For Use With/Related Products | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | MSL | Number of I/Os | Number of Logic Elements | Number of Usable Gates | Number of Words | Number of Words Code | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Part Package Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Supply Voltage-Nom (Vsup) | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Note | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Operating Mode | Propagation Delay | Supply Current-Max | Turn On Delay Time | Data Rate | Number of Inputs | Organization | Seated Height-Max | Memory Width | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Standby Current-Max | Memory Density | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Contents | Parallel/Serial | Number of Logic Blocks (LABs) | Memory IC Type | Speed Grade | Number of Transceivers | Endurance | Number of Registers | Combinatorial Delay of a CLB-Max | Data Retention Time-Min | Write Protection | Platform | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Interconnect System | Suggested Programming Environment | Product Category | Height | Length | Width | Radiation Hardening |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No A54SX08-1FGG144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 144-LBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | A54SX08 | 280 MHz | MICROSEMI CORP | A54SX08-1FGG144 | 3.63, 5.25 V | Microchip Technology | 2.97, 4.75 V | 3 | 111 | 70 °C | Tray | PLASTIC/EPOXY | LBGA | 1 MM PITCH, ROHS COMPLIANT, FBGA-144 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Compliant | Yes | 3.6 V | 3 V | 3.3 V | 3.3, 5 V | 0 to 70 °C | SX | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | CAN ALSO BE OPERATED AT 5V; 12000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | 3V ~ 3.6V, 4.75V ~ 5.25V | BOTTOM | BALL | 260 | 1 mm | compliant | 280 MHz | S-PBGA-B144 | 111 | Not Qualified | 5 V | 3.3,5 V | COMMERCIAL | 5.25 V | 4.75 V | 800 ps | 800 ps | 111 | 768 CLBS, 8000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 768 | 12000 | 280 MHz | 768 | 768 | 1 | 256 | 0.8 ns | 768 | 768 | 8000 | 1.05 mm | 13 mm | 13 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-FGG144T | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | A3P1000 | 350 MHz | MICROSEMI CORP | A3P1000-FGG144T | Microchip Technology | 3 | 97 | 125 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.23 | Yes | 1.575 V | 1.425 V | 1.5 V | Automotive grade | -40°C ~ 125°C (TA) | Automotive, AEC-Q100, ProASIC3 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.5/3.3 V | AUTOMOTIVE | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | AEC-Q100 | STD | 24576 | 24576 | 1000000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P600L-1FG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete (Last Updated: 2 months ago) | Surface Mount | YES | 256 | 400.011771 mg | 256 | 350 MHz | MICROSEMI CORP | A3P600L-1FG256I | 3 | 177 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Obsolete | 30 | 5.27 | Compliant | No | 1.575 V | 1.14 V | 1.2 V | TIN LEAD/TIN LEAD SILVER | 85 °C | -40 °C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 177 | Not Qualified | 1.2 V | 1.5/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 5 mA | 13.5 kB | 177 | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 600000 | 892.86 MHz | 1 | 13824 | 13824 | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL400V2-FG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | AGL400 | MICROSEMI CORP | AGL400V2-FG256I | 1.575 V | Microchip Technology | 1.14 V | 3 | 178 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.28 | No | 1.575 V | 1.14 V | 1.2 V | 1.2, 1.5 V | -40 to 85 °C | IGLOO | e0 | 3A001.A.7.A | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B256 | Not Qualified | INDUSTRIAL | 9216 CLBS, 400000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 9216 | 55296 | 400000 | STD | 9216 | 400000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX32A-1FG144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 144 | 278 MHz | MICROSEMI CORP | A54SX32A-1FG144 | 3 | 70 °C | PLASTIC/EPOXY | LBGA | 1 MM PITCH, FBGA-144 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | 30 | 5.32 | No | 2.75 V | 2.25 V | 2.5 V | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B144 | 111 | Not Qualified | 2.5,2.5/5 V | COMMERCIAL | 111 | 2880 CLBS, 48000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 1.1 ns | 2880 | 2880 | 48000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P250-FGG144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA-144 | YES | 144-FPBGA (13x13) | 144 | A3P250 | Microchip Technology / Atmel | 350 MHz | 160 | MICROSEMI CORP | A3P250-FGG144I | 350 MHz | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | MSL 3 - 168 hours | 97 I/O | 3000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 1.3 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | 36864 bit | ProASIC3 | 0.108878 oz | -40°C ~ 100°C (TJ) | Tray | A3P250 | e1 | 3A001.A.7.B | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Programmable Logic ICs | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 30 mA | - | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - Field Programmable Gate Array | 36Kbit | 250000 | STD | - | 6144 | 250000 | FPGA - Field Programmable Gate Array | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL400V2-FG144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 144 | MICROSEMI CORP | AGL400V2-FG144 | 3 | 85 °C | PLASTIC/EPOXY | LBGA | 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | 30 | 5.9 | No | 1.575 V | 1.14 V | 1.2 V | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B144 | Not Qualified | OTHER | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 9216 | 400000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL600V5-FG484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 484 | 108 MHz | ACTEL CORP | AGL600V5-FG484 | 3 | 70 °C | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Transferred | 30 | 5.84 | No | 1.575 V | 1.425 V | 1.5 V | e0 | TIN LEAD SILVER | BOTTOM | BALL | 230 | 1 mm | compliant | S-PBGA-B484 | 235 | Not Qualified | 1.5 V | COMMERCIAL | 235 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 13824 | 600000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX250-1FGG256M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | AX250 | 763 MHz | MICROSEMI CORP | AX250-1FGG256M | Microchip Technology | 3 | 138 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.3 | Yes | 1.575 V | 1.425 V | 1.5 V | Military grade | -55°C ~ 125°C (TA) | Axcelerator | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 248 | Not Qualified | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 248 | 2816 CLBS, 250000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 250000 | 4224 | MIL-STD-883 Class B | 0.84 ns | 2816 | 4224 | 250000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P400-FGG484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 484 | 194 | 9216 | 350 MHz | 400000 | ProASIC®3 | MICROSEMI CORP | A3P400-FGG484 | 3 | Surface Mount | 400000 | 1.575(V) | 1.425(V) | 1.5(V) | 0C to 85C | 85C | 0C | Commercial | 85 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | FBGA | Obsolete | 130NM | Yes | No | 40 | 7.56 | Yes | 1.575 V | 1.425 V | 1.5 V | Tray | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | 231(MHz) | 484 | S-PBGA-B484 | Not Qualified | COMMERCIAL | 9216 CLBS, 400000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 9216 | 400000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A14V100A-RQ208C | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | 75 MHz | MICROSEMI CORP | A14V100A-RQ208C | 4 | 70 °C | PLASTIC/EPOXY | HFQFP | PLASTIC, RQFP-208 | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Obsolete | 20 | 5.88 | No | 3.6 V | 3 V | 3.3 V | e0 | TIN LEAD | MAX 175 I/OS | 8542.39.00.01 | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G208 | Not Qualified | COMMERCIAL | 1377 CLBS, 10000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 3.9 ns | 1377 | 10000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A1020B-1CQ84C | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 84 | 84 | 53 MHz | MICROSEMI CORP | A1020B-1CQ84C | 69 | 70 °C | CERAMIC | GQFF | TPAK84,1.63SQ,25 | SQUARE | FLATPACK, GUARD RING | Obsolete | 5.81 | Non-Compliant | No | 8542390000/8542390000/8542390000/8542390000/8542390000 | 5 V | 70 °C | 0 °C | 8542.39.00.01 | QUAD | FLAT | 0.635 mm | unknown | 57 MHz | S-XQFP-F84 | 69 | Not Qualified | 5 V | 5 V | COMMERCIAL | 5.25 V | 4.75 V | 3.8 ns | 69 | FIELD PROGRAMMABLE GATE ARRAY | 547 | 2000 | 547 | 1 | 273 | 547 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A1280A-CQ172M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 172 | 41 MHz | ACTEL CORP | A1280A-CQ172M | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | GQFF | CERAMIC, CQFP-172 | TPAK172,2.5SQ,25 | SQUARE | FLATPACK | Transferred | 30 | 5.84 | No | 5.5 V | 4.5 V | 5 V | e0 | Tin/Lead (Sn/Pb) | MAX 140 I/OS | QUAD | FLAT | 225 | 0.635 mm | compliant | S-CQFP-F172 | 140 | Not Qualified | 5 V | MILITARY | 140 | 1232 CLBS, 8000 GATES | 2.9464 mm | FIELD PROGRAMMABLE GATE ARRAY | 5 ns | 1232 | 1232 | 8000 | 29.972 mm | 29.972 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A1280A-PL84I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 84 | MICROSEMI CORP | A1280A-PL84I | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, MS-007-AE, LCC-84 | SQUARE | CHIP CARRIER | Obsolete | 30 | 8.19 | No | 5.5 V | 4.5 V | 5 V | e0 | EAR99 | TIN LEAD | MAX 72 I/OS | 8542.39.00.01 | QUAD | J BEND | 225 | 1.27 mm | unknown | S-PQCC-J84 | Not Qualified | INDUSTRIAL | 1232 CLBS, 8000 GATES | 4.45 mm | FIELD PROGRAMMABLE GATE ARRAY | 5 ns | 1232 | 8000 | 29.21 mm | 29.21 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CEFA4F17C6N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | INTEL CORP | 5CEFA4F17C6N | 85 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | NOT SPECIFIED | 5.58 | Yes | 1.13 V | 1.07 V | 1.1 V | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B256 | 144 | Not Qualified | 1.1,1.2/3.3,2.5 V | OTHER | 144 | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 48000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AT17N512-10CI | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 10 MHz | ATMEL CORP | AT17N512-10CI | 3 | 524288 words | 512000 | 85 °C | -40 °C | UNSPECIFIED | SON | SON, SOLCC8,.25 | SOLCC8,.25 | SQUARE | SMALL OUTLINE | Obsolete | SOIC | 30 | 5.92 | No | 3.3 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | NO LEAD | 240 | 1 | 1.27 mm | compliant | 8 | S-XDSO-N8 | Not Qualified | 3.6 V | 3.3 V | INDUSTRIAL | 3 V | SYNCHRONOUS | 0.005 mA | 512KX1 | 1.14 mm | 1 | 0.0001 A | 524288 bit | SERIAL | CONFIGURATION MEMORY | 10 Write/Erase Cycles | 20 | 5.99 mm | 5.99 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AT17LV128-10CC | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 75 ns | 10 MHz | ATMEL CORP | AT17LV128-10CC | 3 | 131072 words | 128000 | 70 °C | UNSPECIFIED | SON | SON, SOLCC8,.25 | SOLCC8,.25 | SQUARE | SMALL OUTLINE | Obsolete | SOIC | 30 | 5.88 | No | 3.3 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | 8542.32.00.51 | DUAL | NO LEAD | 240 | 1 | 1.27 mm | compliant | 8 | S-XDSO-N8 | Not Qualified | 3.6 V | 3.3 V | COMMERCIAL | 3 V | SYNCHRONOUS | 0.005 mA | 128KX1 | 1.14 mm | 1 | 0.00005 A | 131072 bit | SERIAL | CONFIGURATION MEMORY | 5.99 mm | 5.99 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AT17LV010-10SC | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | 15 MHz | ATMEL CORP | AT17LV010-10SC | 1 | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP20,.4 | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | 30 | 5.82 | No | 3.3 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 1.27 mm | compliant | 20 | R-PDSO-G20 | Not Qualified | 3.6 V | 3.3/5 V | COMMERCIAL | 3 V | SYNCHRONOUS | 0.01 mA | 1MX1 | 2.65 mm | 1 | 1048576 bit | SERIAL | CONFIGURATION MEMORY | HARDWARE | 12.8 mm | 7.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No APA600-FG256C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 180 MHz | MICROSEMI CORP | APA600-FG256C | 70 °C | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | 5.9 | No | 2.7 V | 2.3 V | 2.5 V | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B256 | 186 | Not Qualified | 2.5,2.5/3.3 V | COMMERCIAL | 186 | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No DK-DEV-1SGX-L-0ES | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 1SG280 | 1SG280L | Intel | Bulk | Obsolete | Stratix® 10 GX | FPGA | - | Board(s) | Stratix 10 GX FPGA PCIe Card | - | Quartus Prime |
-
A54SX08-1FGG144
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
A3P1000-FGG144T
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
A3P600L-1FG256I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
AGL400V2-FG256I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
A54SX32A-1FG144
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
A3P250-FGG144I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
AGL400V2-FG144
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
AGL600V5-FG484
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
AX250-1FGG256M
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
A3P400-FGG484
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
A14V100A-RQ208C
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
A1020B-1CQ84C
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
A1280A-CQ172M
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
A1280A-PL84I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
5CEFA4F17C6N
Intel
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
AT17N512-10CI
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
AT17LV128-10CC
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
AT17LV010-10SC
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
APA600-FG256C
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
-
DK-DEV-1SGX-L-0ES
Intel
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire