The category is 'Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/O Lines | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Propagation Delay | Connectivity | Supply Current-Max | Data Rate | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Screening Level | Telecom IC Type | Speed Grade | Output Function | Number of Transceivers | Number of Macro Cells | Primary Attributes | Combinatorial Delay of a CLB-Max | Number of CLBs | JTAG BST | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | In-System Programmable | Flash Size | Product Category | Length | Width |
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 | Mfr Part No XC2C256-5PQG208C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | XILINX INC | XC2C256-5PQG208C | 3 | 173 | 70 °C | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | 40 | 5.67 | Yes | 1.9 V | 1.7 V | 1.8 V | e3 | Matte Tin (Sn) | REAL DIGITAL DESIGN TECHNOLOGY | 8542.39.00.01 | QUAD | GULL WING | 245 | 0.5 mm | compliant | 208 | S-PQFP-G208 | Not Qualified | 1.5/3.3,1.8 V | COMMERCIAL | 5 ns | 0 DEDICATED INPUTS, 173 I/O | 4.1 mm | FLASH PLD | MACROCELL | 256 | YES | YES | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XQV1000-4CG560M | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 560 | XILINX INC | XQV1000-4CG560M | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | HCGA | HCGA, CGA560,33X33,50 | CGA560,33X33,50 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Obsolete | CGA | NOT SPECIFIED | 5.61 | No | 2.625 V | 2.375 V | 2.5 V | Military grade | e0 | 3A001.A.2.C | TIN LEAD | 8542.39.00.01 | BOTTOM | UNSPECIFIED | NOT SPECIFIED | 1.27 mm | compliant | 560 | S-CBGA-X560 | 404 | Not Qualified | 1.2/3.6,2.5 V | MILITARY | 404 | 6144 CLBS, 1124022 GATES | 4.9 mm | FIELD PROGRAMMABLE GATE ARRAY | MIL-PRF-38535 | 0.8 ns | 6144 | 27648 | 1124022 | 42.5 mm | 42.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC2V4000-6BF957I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 957 | 820 MHz | XILINX INC | XC2V4000-6BF957I | 4 | PLASTIC/EPOXY | BGA | 40 X 40 MM, 1.27 MM PITCH, MS-034BAU-1, FLIP CHIP, BGA-957 | BGA957,31X31,50 | SQUARE | GRID ARRAY | Obsolete | BGA | 30 | 5.82 | No | 1.575 V | 1.425 V | 1.5 V | e0 | No | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1.27 mm | not_compliant | 957 | S-PBGA-B957 | 684 | Not Qualified | 1.5,1.5/3.3,3.3 V | 684 | 5760 CLBS, 4000000 GATES | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | 0.35 ns | 5760 | 51840 | 4000000 | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC4044XL-1BGG432I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 432 | 200 MHz | XILINX INC | XC4044XL-1BGG432I | 3 | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | BGA | 30 | 5.81 | Yes | 3.6 V | 3 V | 3.3 V | e1 | Yes | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | MAX USABLE 44000 LOGIC GATES | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.27 mm | compliant | 432 | S-PBGA-B432 | Not Qualified | 1600 CLBS, 27000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 1.3 ns | 1600 | 27000 | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC4052XLA-9BG352C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 352 | 227 MHz | XILINX INC | XC4052XLA-9BG352C | 3 | 85 °C | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | BGA | 30 | 5.86 | No | 3.6 V | 3 V | 3.3 V | e0 | TIN LEAD | 8542.39.00.01 | BOTTOM | BALL | 225 | 1.27 mm | compliant | 352 | S-PBGA-B352 | Not Qualified | OTHER | 1936 CLBS, 33000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 1.1 ns | 1936 | 33000 | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC4044XL-1HQG208C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | 200 MHz | XILINX INC | XC4044XL-1HQG208C | 3 | 85 °C | PLASTIC/EPOXY | HFQFP | HFQFP, | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Obsolete | QFP | 30 | 5.81 | Yes | 3.6 V | 3 V | 3.3 V | e3 | Yes | Matte Tin (Sn) | MAX USABLE 44000 LOGIC GATES | 8542.39.00.01 | QUAD | GULL WING | 245 | 0.5 mm | compliant | 208 | S-PQFP-G208 | Not Qualified | OTHER | 1600 CLBS, 27000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 1.3 ns | 1600 | 27000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCS10-3VQG100I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 125 MHz | XILINX INC | XCS10-3VQG100I | 3 | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | QFP | 40 | 5.8 | Yes | 5.5 V | 4.5 V | 5 V | e3 | Matte Tin (Sn) | MAXIMUM USABLE GATES 10000 | QUAD | GULL WING | 260 | 0.5 mm | compliant | 100 | S-PQFP-G100 | Not Qualified | 196 CLBS, 3000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 1.6 ns | 196 | 3000 | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CS203-P | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | CRYSTAL SEMICONDUCTOR CORP | CS203-P | 70 °C | PLASTIC/EPOXY | DIP | 0.300 INCH, PLASTIC, DIP-18 | DIP18,.3 | RECTANGULAR | IN-LINE | Obsolete | NOT SPECIFIED | 5.8 | No | 5 V | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | unknown | R-PDIP-T18 | Not Qualified | 5 V | COMMERCIAL | 0.012 mA | DTMF SIGNALING CIRCUIT | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL150T-1FCG1152I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | M2GL150 | MICROSEMI CORP | M2GL150T-1FCG1152I | Microchip Technology | 4 | 574 | Tray | PLASTIC/EPOXY | BGA | 35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 146124 | 5120000 | 1 | 146124 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL010T-1FGG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | FBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2GL010 | Microchip Technology / Atmel | 60 | MICROSEMI CORP | M2GL010T-1FGG484I | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 233 | 12084 LE | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | 0.892167 oz | -40°C ~ 100°C (TJ) | Tray | M2GL010T | 100 °C | -40 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | 1.2 V | 114 kB | 667 Mb/s | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | FPGA - Field Programmable Gate Array | 933888 | 1 | 4 Transceiver | 12084 | FPGA - Field Programmable Gate Array | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL050TS-FGG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2GL050 | MICROSEMI CORP | M2GL050TS-FGG484I | Microchip Technology | 3 | 267 | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.27 | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 1869824 | 56340 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FCG1152I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | M2S150 | 64 kB | MICROSEMI CORP | - | - | M2S150T-1FCG1152I | 166 MHz | Microchip Technology | 4 | SMD/SMT | 574 | 146124 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.77 | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL010T-1VFG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LFBGA | YES | 256-FPBGA (14x14) | 256 | M2GL010 | MICROSEMI CORP | M2GL010T-1VFG256 | + 85 C | Microchip Technology | 0 C | 3 | SMD/SMT | 138 | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.27 | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | S-PBGA-B256 | 1.2 V | OTHER | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | 933888 | 2 Transceiver | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LFXP2-17E-7FT256C8W | Lattice Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 420 MHz | LATTICE SEMICONDUCTOR CORP | LFXP2-17E-7FT256C8W | 3 | 85 °C | PLASTIC/EPOXY | BGA | 17 X 17 MM, FTBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Obsolete | BGA | 30 | 5.91 | No | 1.26 V | 1.14 V | 1.2 V | e0 | No | EAR99 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | compliant | 256 | S-PBGA-B256 | 201 | Not Qualified | 1.2,1.2/3.3,3.3 V | OTHER | 201 | 2.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 17000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LFXP2-17E-5FT256C8W | Lattice Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 311 MHz | LATTICE SEMICONDUCTOR CORP | LFXP2-17E-5FT256C8W | 3 | 85 °C | PLASTIC/EPOXY | BGA | 17 X 17 MM, FTBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Obsolete | BGA | 30 | 5.91 | No | 1.26 V | 1.14 V | 1.2 V | e0 | No | EAR99 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | compliant | 256 | S-PBGA-B256 | 201 | Not Qualified | 1.2,1.2/3.3,3.3 V | OTHER | 201 | 2.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 17000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL050TS-FG896I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 896-BGA | YES | 896-FBGA (31x31) | 896 | M2GL050 | MICROSEMI CORP | M2GL050TS-FG896I | Microchip Technology | 3 | 377 | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B896 | 377 | Not Qualified | 1.2 V | 377 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 1869824 | 56340 | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-1FG676I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S060 | 64 kB | MICROSEMI CORP | - | - | M2S060T-1FG676I | 166 MHz | Microchip Technology | 3 | 387 | 56520 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.88 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B676 | 387 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 387 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P400-FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 484 | MICROSEMI CORP | M1A3P400-FG484I | 3 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | 30 | 5.25 | No | 1.575 V | 1.425 V | 1.5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | INDUSTRIAL | 9216 CLBS, 400000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 9216 | 400000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL025-1FCS325 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2GL025 | MICROSEMI CORP | M2GL025-1FCS325 | + 85 C | Microchip Technology | 0 C | SMD/SMT | 180 | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA325,21X21,20 | BGA325,21X21,20 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B325 | 180 | Not Qualified | 1.2 V | 1.2 V | OTHER | 180 | FIELD PROGRAMMABLE GATE ARRAY | 27696 | 1130496 | 27696 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P600L-FG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 350 MHz | MICROSEMI CORP | M1A3P600L-FG256 | 3 | 70 °C | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Obsolete | 30 | 5.26 | No | 1.575 V | 1.14 V | 1.2 V | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | 177 | Not Qualified | 1.5/3.3 V | COMMERCIAL | 177 | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 13824 | 600000 | 17 mm | 17 mm |
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XC2C256-5PQG208C
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XQV1000-4CG560M
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XC2V4000-6BF957I
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XC4044XL-1BGG432I
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XC4052XLA-9BG352C
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XC4044XL-1HQG208C
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XCS10-3VQG100I
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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CS203-P
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL150T-1FCG1152I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL010T-1FGG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL050TS-FGG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2S150T-1FCG1152I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL010T-1VFG256
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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LFXP2-17E-7FT256C8W
Lattice Semiconductor
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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LFXP2-17E-5FT256C8W
Lattice Semiconductor
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL050TS-FG896I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2S060T-1FG676I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M1A3P400-FG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL025-1FCS325
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M1A3P600L-FG256
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire