The category is 'Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | MSL | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Propagation Delay | Turn On Delay Time | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Product Category | Height | Length | Width | Radiation Hardening | Lead Free |
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 | Mfr Part No A3PE3000L-FG896M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 896-BGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | A3PE3000 | 250 MHz | MICROSEMI CORP | A3PE3000L-FG896M | Microchip Technology | 3 | 620 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 1 MM PITCH, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.29 | Compliant | No | 1.575 V | 1.14 V | 1.2 V | -55°C ~ 125°C (TJ) | ProASIC3L | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 1.575 V | 1.14 V | 63 kB | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3e+06 | 75264 | 75264 | 75264 | 3000000 | 31 mm | 31 mm | No | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL1000V2-CS281I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 281-TFBGA, CSBGA | YES | 281-CSP (10x10) | 281 | AGL1000 | 108 MHz | MICROSEMI CORP | AGL1000V2-CS281I | Microchip Technology | 215 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.25 | No | 1.575 V | 1.14 V | 1.2 V | 1.2, 1.5 V | -40 to 85 °C | IGLOO | e0 | 3A001.A.7.A | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | unknown | 281 | S-PBGA-B281 | Not Qualified | INDUSTRIAL | 24576 CLBS, 1000000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | STD | 24576 | 1000000 | 10 mm | 10 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL1000V2-FGG144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | AGL1000 | 108 MHz | MICROSEMI CORP | AGL1000V2-FGG144 | Microchip Technology | 3 | 97 | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 1.54 | Yes | 1.575 V | 1.14 V | 1.2 V | 0°C ~ 70°C (TA) | IGLOO | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | OTHER | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | STD | 24576 | 1000000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX32A-2FGG484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484-FPBGA (27X27) | 484 | A54SX32 | 313 MHz | MICROSEMI CORP | A54SX32A-2FGG484 | 2.75 V | Microchip Technology | 2.25 V | 3 | 249 | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,26X26,40 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.29 | Yes | 2.75 V | 2.25 V | 2.5 V | 2.5000 V | 0 to 70 °C | SX-A | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | 2.25V ~ 5.25V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 249 | Not Qualified | 2.5,2.5/5 V | COMMERCIAL | 249 | 2880 CLBS, 48000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 48000 | 2880 | 2 | 0.9 ns | 2880 | 2880 | 48000 | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE600-FGG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | A3PE600 | 350 MHz | MICROSEMI CORP | A3PE600-FGG256I | Microchip Technology | 3 | 165 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 1.6 | Yes | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | ProASIC3E | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 165 | Not Qualified | 1.5/3.3 V | INDUSTRIAL | 165 | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | STD | 13824 | 13824 | 600000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL400V5-FG144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 144 | MICROSEMI CORP | AGL400V5-FG144I | 3 | 100 °C | -40 °C | PLASTIC/EPOXY | LBGA | 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | 30 | 7.96 | No | 1.575 V | 1.425 V | 1.5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B144 | Not Qualified | INDUSTRIAL | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 9216 | 400000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P600L-FGG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 484-BGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3P600 | 350 MHz | MICROSEMI CORP | A3P600L-FGG484I | Microchip Technology | 3 | 235 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 1.37 | Compliant | Yes | 8542310000/8542310000/8542310000/8542310000/8542310000 | 1.575 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 235 | Not Qualified | 1.2 V | 1.5/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 5 mA | 13.5 kB | 235 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 781.25 MHz | 13824 | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||||||||||||||||
| Mfr Part No AGL400V2-FG256T | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256 | MICROSEMI CORP | AGL400V2-FG256T | 3 | 55296 | Active | 20 | 5.82 | Non-Compliant | No | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | 225 | unknown | 6.8 kB | FIELD PROGRAMMABLE GATE ARRAY | 9216 | 400000 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLP060V2-CS201 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 201-VFBGA, CSBGA | YES | 201-CSP (8x8) | 201 | AGLP060 | 160 MHz | MICROSEMI CORP | AGLP060V2-CS201 | 1.575 V | Microchip Technology | 1.14 V | 157 | 70 °C | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, BGA201,15X15,20 | BGA201,15X15,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.26 | No | 1.575 V | 1.425 V | 1.5 V | 1.2, 1.5 V | 0 to 70 °C | IGLOO PLUS | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | unknown | 201 | S-PBGA-B201 | 157 | Not Qualified | 1.2/1.5 V | COMMERCIAL | 157 | 1584 CLBS, 60000 GATES | 0.99 mm | FIELD PROGRAMMABLE GATE ARRAY | 1584 | 18432 | 60000 | STD | 1584 | 1584 | 60000 | 8 mm | 8 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-FGG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | A3P1000 | Microchip Technology / Atmel | 350 MHz | 90 | MICROSEMI CORP | A3P1000-FGG256I | 350 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | MSL 3 - 168 hours | 177 I/O | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 40 | 1.3 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | 147456 bit | ProASIC3 | 1.5000 V | 0.210427 oz | -40 to 85 °C | Tray | A3P1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Programmable Logic ICs | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 75 mA | - | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - Field Programmable Gate Array | 144Kbit | 1000000 | STD | - | 24576 | 1000000 | FPGA - Field Programmable Gate Array | 1.6 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||
| Mfr Part No AFS1500-FGG676I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 676-BGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | AFS1500 | MICROSEMI CORP | AFS1500-FGG676I | 1.575 V | Microchip Technology | 1.425 V | 3 | 252 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Compliant | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -40 to 85 °C | Fusion® | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 1.0989 GHz | S-PBGA-B676 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 33.8 kB | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 1.0989 GHz | STD | 38400 | 38400 | 1500000 | 1.73 mm | 25 mm | 25 mm | No | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P600L-FGG484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 484-BGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3P600 | 350 MHz | MICROSEMI CORP | A3P600L-FGG484 | 1.26 V | Microchip Technology | 1.14 V | 3 | 235 | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Compliant | Yes | 1.575 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 70 °C | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 235 | Not Qualified | 1.2 V | 1.5/3.3 V | COMMERCIAL | 1.26 V | 1.14 V | 13.5 kB | 235 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 781.25 MHz | STD | 13824 | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | No | Lead Free | |||||||||||||||||||||||||||||||||
| Mfr Part No AFS090-2FG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete (Last Updated: 2 months ago) | Surface Mount | YES | 256 | 400.011771 mg | 256 | MICROSEMI CORP | AFS090-2FG256 | 3 | 75 | 85 °C | PLASTIC/EPOXY | LBGA | FBGA-256 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | 30 | 5.89 | Compliant | No | 1.575 V | 1.425 V | 1.5 V | TIN LEAD/TIN LEAD SILVER | 70 °C | 0 °C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | Not Qualified | 1.5 V | OTHER | 1.575 V | 1.425 V | 3.4 kB | 2304 CLBS, 90000 GATES | 1.68 mm | FIELD PROGRAMMABLE GATE ARRAY | 90000 | 1.47059 GHz | 2 | 2304 | 2304 | 90000 | 1.2 mm | 17 mm | 17 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX250-1FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | 484 | AX250 | 763 MHz | MICROSEMI CORP | AX250-1FG484I | Microchip Technology | 3 | 248 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 1.57 | No | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 85°C (TA) | Axcelerator | e0 | TIN LEAD | 250000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B484 | 248 | Not Qualified | 1.5,1.5/3.3,2.5/3.3 V | INDUSTRIAL | 248 | 2816 CLBS, 250000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 250000 | 4224 | 1 | 0.84 ns | 2816 | 4224 | 250000 | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A1020B-1PLG84C | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 84 | 53 MHz | ACTEL CORP | A1020B-1PLG84C | 3 | 70 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, MS-007-AE, LCC-84 | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | Transferred | 40 | 5.77 | Yes | 5.25 V | 4.75 V | 5 V | e3 | MATTE TIN | MAX 69 I/OS | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J84 | 69 | Not Qualified | 5 V | COMMERCIAL | 69 | 547 CLBS, 2000 GATES | 4.45 mm | FIELD PROGRAMMABLE GATE ARRAY | 3.8 ns | 547 | 547 | 2000 | 29.21 mm | 29.21 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A1020B-1PL84C | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 84 | 84 | 53 MHz | ACTEL CORP | A1020B-1PL84C | 3 | 69 | 70 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, MS-007-AE, LCC-84 | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | Transferred | 30 | 5.83 | Compliant | No | 5.25 V | 4.75 V | 5 V | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | MAX 69 I/OS | QUAD | J BEND | 225 | 1.27 mm | compliant | 57 MHz | S-PQCC-J84 | 69 | Not Qualified | 5 V | 5 V | COMMERCIAL | 5.25 V | 4.75 V | 3.8 ns | 3.8 ns | 69 | 547 CLBS, 2000 GATES | 4.45 mm | FIELD PROGRAMMABLE GATE ARRAY | 547 | 2000 | 547 | 1 | 273 | 3.8 ns | 547 | 547 | 2000 | 29.21 mm | 29.21 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A1425A-PQ160C | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 160 | 125 MHz | MICROSEMI CORP | A1425A-PQ160C | 3 | 70 °C | PLASTIC/EPOXY | QFP | PLASTIC, QFP-160 | SQUARE | FLATPACK | Obsolete | 30 | 8.78 | No | 5.25 V | 4.75 V | 5 V | e0 | TIN LEAD | MAX 100 I/OS | QUAD | GULL WING | 225 | 0.65 mm | compliant | S-PQFP-G160 | Not Qualified | COMMERCIAL | 310 CLBS, 2500 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 3 ns | 310 | 2500 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A1010B-1PL68I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 68 | 47.7 MHz | MICROSEMI CORP | A1010B-1PL68I | 85 °C | -40 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-68 | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | 5.84 | No | 5.5 V | 4.5 V | 5 V | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | unknown | 68 | S-PQCC-J68 | 57 | Not Qualified | 5 V | INDUSTRIAL | 57 | 547 CLBS, 2000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 547 | 295 | 2000 | 24.2316 mm | 24.2316 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A1010B-VQ80C | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 80 | 80 | 45 MHz | MICROSEMI CORP | A1010B-VQ80C | 57 | 70 °C | PLASTIC/EPOXY | TQFP | 1 MM, VQFP-80 | TQFP80,.6SQ | SQUARE | FLATPACK, THIN PROFILE | Obsolete | QFP | 8.76 | Non-Compliant | No | 8542390000/8542390000/8542390000/8542390000/8542390000 | 5.25 V | 4.75 V | 5 V | 70 °C | 0 °C | 8542.39.00.01 | QUAD | GULL WING | 0.65 mm | unknown | 48 MHz | 80 | S-PQFP-G80 | 57 | Not Qualified | 5 V | 5 V | COMMERCIAL | 5.25 V | 4.75 V | 4.5 ns | 57 | 547 CLBS, 2000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 295 | 1200 | 295 | 147 | 4.5 ns | 547 | 295 | 2000 | 14 mm | 14 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLN030V5-ZCSG81I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 81-WFBGA, CSBGA | YES | 81-CSP (5x5) | 81 | AGLN030 | 250 MHz | ACTEL CORP | AGLN030V5-ZCSG81I | Microchip Technology | 66 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | VFBGA | 5 X 5 MM, 0.8 MM HEIGHT, 0.5 MM PITCH, GREEN, CSP-81 | BGA81,9X9,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Transferred | Obsolete | NOT SPECIFIED | 5.78 | Yes | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | IGLOO nano | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.4 mm | compliant | S-PBGA-B81 | 66 | Not Qualified | 1.5 V | INDUSTRIAL | 66 | 768 CLBS, 30000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 768 | 30000 | 768 | 768 | 30000 | 5 mm | 5 mm |
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A3PE3000L-FG896M
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AGL1000V2-CS281I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AGL1000V2-FGG144
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A54SX32A-2FGG484
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A3PE600-FGG256I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AGL400V5-FG144I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A3P600L-FGG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AGL400V2-FG256T
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AGLP060V2-CS201
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A3P1000-FGG256I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AFS1500-FGG676I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A3P600L-FGG484
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AFS090-2FG256
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AX250-1FG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A1020B-1PLG84C
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A1020B-1PL84C
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A1425A-PQ160C
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A1010B-1PL68I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A1010B-VQ80C
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AGLN030V5-ZCSG81I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire