The category is 'Evaluation and Demonstration Boards and Kits'

  • All Manufacturers
  • Category
  • Contact Finish - Post
  • Contact Finish Mating
  • Contact Finish Thickness - Mating
  • Contact Finish Thickness - Post
  • Contact Material - Mating
  • Contact Material - Post
  • Contact Resistance
  • Current Rating
  • Ethernet
  • GPIO
  • Series
  • Series:

    55

Image

Part Number

Manufacturer

Datasheet

Availability

Pricing(USD)

Quantity

RoHS

Mounting Type

Housing Material

Number of Positions or Pins (Grid)

Contact Material - Mating

Contact Material - Post

Category

Contact Finish Mating

Operating Temperature

Packaging

Series

Part Status

Termination

Type

Current Rating

Pitch - Mating

Contact Finish - Post

Contact Resistance

Termination Post Length

Pitch - Post

Ethernet

GPIO

Features

Contact Finish Thickness - Mating

Contact Finish Thickness - Post

Material Flammability Rating

AR0140CS2C00SUCAD3-GEVK

Mfr Part No

AR0140CS2C00SUCAD3-GEVK

ON Semiconductor Datasheet

-

-

Min: 1

Mult: 1

Through Hole

Polyphenylene Sulfide (PPS), Glass Filled

36 (2 x 18)

Beryllium Copper

Beryllium Copper

Sensors and Transducers Tools

Nickel Boron

--

Bulk

55

Active

Solder

DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing

1A

0.100 (2.54mm)

Nickel Boron

--

0.110 (2.78mm)

0.100 (2.54mm)

No

No

Closed Frame

50.0µin (1.27µm)

50.0µin (1.27µm)

UL94 V-0