The category is 'Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)'
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- ECCN Code:
3A001.A.7.A
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | RAM Size | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Number of Gates | Max Frequency | Screening Level | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Product Category | Height | Length | Width | Radiation Hardening | Lead Free |
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 | Mfr Part No XCV1600E-8FGG1156C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1156 | 416 MHz | XILINX INC | XCV1600E-8FGG1156C | 3 | 85 °C | PLASTIC/EPOXY | BGA | BGA, BGA1156,34X34,40 | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Obsolete | BGA | 40 | 5.79 | Compliant | Yes | 1.89 V | 1.71 V | 1.8 V | e1 | Yes | 3A001.A.7.A | TIN SILVER COPPER | 85 °C | 0 °C | 8542.39.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 1156 | S-PBGA-B1156 | 724 | Not Qualified | 1.8 V | 1.2/3.6,1.8 V | OTHER | 72 kB | 724 | 7776 CLBS, 419904 GATES | 2.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 8 | 0.4 ns | 7776 | 34992 | 419904 | 35 mm | 35 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCV1600E-7FGG860I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 860 | 400 MHz | XILINX INC | XCV1600E-7FGG860I | 3 | PLASTIC/EPOXY | BGA | BGA, BGA860,42X42,40 | BGA860,42X42,40 | SQUARE | GRID ARRAY | Obsolete | BGA | 30 | 5.8 | Yes | 1.89 V | 1.71 V | 1.8 V | e1 | Yes | 3A001.A.7.A | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 860 | S-PBGA-B860 | 660 | Not Qualified | 1.2/3.6,1.8 V | 660 | 7776 CLBS, 419904 GATES | 2.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 0.42 ns | 7776 | 34992 | 419904 | 42.5 mm | 42.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCV1000E-7FGG860I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 860 | 400 MHz | XILINX INC | XCV1000E-7FGG860I | 3 | PLASTIC/EPOXY | BGA | BGA, BGA860,42X42,40 | BGA860,42X42,40 | SQUARE | GRID ARRAY | Obsolete | BGA | 30 | 5.79 | Yes | 1.89 V | 1.71 V | 1.8 V | e1 | Yes | 3A001.A.7.A | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 860 | S-PBGA-B860 | 660 | Not Qualified | 1.2/3.6,1.8 V | 660 | 6144 CLBS, 331776 GATES | 2.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 0.42 ns | 6144 | 27648 | 331776 | 42.5 mm | 42.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL1000V2-CSG281 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 281-TFBGA, CSBGA | YES | 281-CSP (10x10) | 281 | AGL1000 | 108 MHz | MICROSEMI CORP | AGL1000V2-CSG281 | 1.575 V | Microchip Technology | 1.14 V | 3 | 215 | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 0.86 | Yes | 1.575 V | 1.14 V | 1.2 V | 1.2, 1.5 V | 0 to 70 °C | IGLOO | 3A001.A.7.A | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | 281 | S-PBGA-B281 | Not Qualified | OTHER | 24576 CLBS, 1000000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | STD | 24576 | 1000000 | 10 mm | 10 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL1000V2-CS281I | Microchip | Datasheet | 2047 |
| Min: 1 Mult: 1 | Surface Mount | 281-TFBGA, CSBGA | YES | 281-CSP (10x10) | 281 | AGL1000 | 108 MHz | MICROSEMI CORP | AGL1000V2-CS281I | Microchip Technology | 215 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.25 | No | 1.575 V | 1.14 V | 1.2 V | 1.2, 1.5 V | -40 to 85 °C | IGLOO | e0 | 3A001.A.7.A | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | unknown | 281 | S-PBGA-B281 | Not Qualified | INDUSTRIAL | 24576 CLBS, 1000000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | STD | 24576 | 1000000 | 10 mm | 10 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCV1000-5FGG680C | Xilinx | Datasheet | 218 | - | Min: 1 Mult: 1 | YES | 680 | 294 MHz | XILINX INC | XCV1000-5FGG680C | 3 | 85 °C | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | BGA | 30 | 5.8 | Yes | 2.625 V | 2.375 V | 2.5 V | e1 | Yes | 3A001.A.7.A | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 mm | compliant | 680 | S-PBGA-B680 | Not Qualified | OTHER | 6144 CLBS, 1124022 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 0.7 ns | 6144 | 1124022 | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7VX690T-3FFG1927C | Xilinx | Datasheet | 6944 | - | Min: 1 Mult: 1 | XILINX INC | XC7VX690T-3FFG1927C | 4 | Active | 30 | 5.76 | Yes | e1 | 3A001.A.7.A | TIN SILVER COPPER | 8542.39.00.01 | 245 | not_compliant | FIELD PROGRAMMABLE GATE ARRAY | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE1500-FGG484I | Microchip | Datasheet | 2031 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA-484 | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE1500 | Microchip Technology / Atmel | 350 MHz | 60 | MICROSEMI CORP | A3PE1500-FGG484I | 350 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 280 | 16000 LE | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.29 | Compliant | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3PE1500 | e1 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 231 MHz | S-PBGA-B484 | 280 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | 1.575 V | 1.425 V | 33.8 kB | - | 280 | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - Field Programmable Gate Array | 276480 | 1.5e+06 | 231 MHz | STD | - | 38400 | 38400 | 38400 | 1500000 | FPGA - Field Programmable Gate Array | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||
| Mfr Part No XC2VPX20-6FFG896C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 896 | 1200 MHz | XILINX INC | XC2VPX20-6FFG896C | 4 | 85 °C | PLASTIC/EPOXY | BGA | 31 X 31 MM, 1 MM PITCH, MS-034AAN-1, FCBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Obsolete | BGA | 30 | 5.78 | Non-Compliant | Yes | 1.575 V | 1.425 V | 1.5 V | e1 | 3A001.A.7.A | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1 mm | not_compliant | 896 | S-PBGA-B896 | 552 | Not Qualified | 1.5,1.5/3.3,2/2.5,2.5 V | OTHER | 552 | 2448 CLBS | 3.4 mm | FIELD PROGRAMMABLE GATE ARRAY | 0.32 ns | 2448 | 22032 | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC6VSX475T-2FF1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1156 | 1286 MHz | XILINX INC | XC6VSX475T-2FF1156I | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA1156,34X34,40 | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Active | BGA | NOT SPECIFIED | 5.22 | No | 1.05 V | 0.95 V | 1 V | e0 | No | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 1156 | S-PBGA-B1156 | 600 | Not Qualified | 1,1.2/2.5 V | INDUSTRIAL | 600 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | 4.29 ns | 476160 | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XQ6VSX475T-1RF1759I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | XILINX INC | XQ6VSX475T-1RF1759I | Active | NOT SPECIFIED | 5.27 | No | e0 | 3A001.A.7.A | TIN LEAD | 8542.39.00.01 | NOT SPECIFIED | compliant | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XQ6VLX240T-2RF1759I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | XILINX INC | XQ6VLX240T-2RF1759I | Active | NOT SPECIFIED | 5.27 | No | e0 | 3A001.A.7.A | TIN LEAD | 8542.39.00.01 | NOT SPECIFIED | compliant | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC4VLX25-10FF676C | Xilinx | Datasheet | 580 | - | Min: 1 Mult: 1 | YES | 676 | 1028 MHz | XILINX INC | XC4VLX25-10FF676C | 4 | 85 °C | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Obsolete | BGA | NOT APPLICABLE | 8.75 | No | 1.26 V | 1.14 V | 1.2 V | e0 | 3A001.A.7.A | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | BOTTOM | BALL | NOT APPLICABLE | 1 mm | not_compliant | 676 | S-PBGA-B676 | 448 | Not Qualified | OTHER | 448 | 2688 CLBS | 3 mm | FIELD PROGRAMMABLE GATE ARRAY | 2688 | 24192 | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC8103-1PC84C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 84 | 144 MHz | XILINX INC | XC8103-1PC84C | 3 | 70 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-84 | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | 5.88 | No | 5.25 V | 4.75 V | 5 V | e0 | 3A001.A.7.A | Tin/Lead (Sn85Pb15) | 512 FLIP-FLOPS; 3.3V OPERATION; OTP BASED | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | unknown | 84 | S-PQCC-J84 | 128 | Not Qualified | 3.3/5 V | COMMERCIAL | 128 | 1024 CLBS, 3000 GATES | 5.08 mm | FIELD PROGRAMMABLE GATE ARRAY | 5.4 ns | 1024 | 1024 | 3000 | 29.3116 mm | 29.3116 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC2VP20-5FF1152CES | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1152 | 1050 MHz | XILINX INC | XC2VP20-5FF1152CES | 4 | 85 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Obsolete | BGA | 30 | 5.83 | No | 1.575 V | 1.425 V | 1.5 V | e0 | No | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | compliant | 1152 | S-PBGA-B1152 | Not Qualified | OTHER | 2320 CLBS | 3.4 mm | FIELD PROGRAMMABLE GATE ARRAY | 0.36 ns | 2320 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-2FG256I | Microchip | Datasheet | 1905 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | A3P1000 | Microchip Technology / Atmel | 350 MHz | 90 | MICROSEMI CORP | A3P1000-2FG256I | 350 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P1000 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Programmable Logic ICs | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | - | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - Field Programmable Gate Array | 147456 | 1000000 | 2 | - | 24576 | 1000000 | FPGA - Field Programmable Gate Array | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-FG256I | Microchip | Datasheet | 2052 |
| Min: 1 Mult: 1 | Surface Mount | FBGA-256 | YES | 256-FPBGA (17x17) | 256 | A3P1000 | Microchip Technology / Atmel | 350 MHz | 90 | MICROSEMI CORP | A3P1000-FG256I | 350 MHz | 1.575 V | + 100 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 11000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 1.5 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | A3P1000 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Programmable Logic ICs | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | not_compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | - | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - Field Programmable Gate Array | 147456 | 1000000 | STD | - | 24576 | 1000000 | FPGA - Field Programmable Gate Array | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-FG484T | Microchip | Datasheet | 1866 | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | 484 | A3P1000 | 350 MHz | MICROSEMI CORP | A3P1000-FG484T | 1.575 V | Microchip Technology | 1.425 V | 300 | 125 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 1 MM PITCH, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 5.23 | No | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | Automotive grade | -40°C ~ 125°C (TA) | Automotive, AEC-Q100, ProASIC3 | 3A001.A.7.A | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B484 | 300 | Not Qualified | 1.5/3.3 V | AUTOMOTIVE | 300 | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | AEC-Q100 | STD | 24576 | 24576 | 1000000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P600-FGG144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | 144-LBGA | YES | 144 | 144-FPBGA (13x13) | 144 | A3P600 | 350 MHz | MICROSEMI CORP | A3P600-FGG144 | Microchip Technology | 3 | 97 | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 0.76 | Compliant | Yes | 8542310000/8542310000/8542310000/8542310000/8542310000 | 1.575 V | 1.425 V | 1.5 V | 0°C ~ 85°C (TJ) | ProASIC3 | e1 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | 231 MHz | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 13.5 kB | 5 mA | 13.5 kB | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 6500 | 110592 | 600000 | 231 MHz | STD | 13824 | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | No | Lead Free | |||||||||||||||||||||||||||||||||||
| Mfr Part No AFS250-FG256I | Microchip | Datasheet | 2075 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 256-LBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | AFS250 | MICROSEMI CORP | AFS250-FG256I | Microchip Technology | 3 | 114 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 1.8 | Compliant | No | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -40 to 85 °C | Fusion® | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 1.0989 GHz | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 4.5 kB | 6144 CLBS, 250000 GATES | 1.68 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 1.0989 GHz | STD | 6144 | 6144 | 250000 | 1.2 mm | 17 mm | 17 mm | No |
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XCV1600E-8FGG1156C
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XCV1600E-7FGG860I
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XCV1000E-7FGG860I
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AGL1000V2-CSG281
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AGL1000V2-CS281I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
226.996112
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XCV1000-5FGG680C
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XC7VX690T-3FFG1927C
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A3PE1500-FGG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XC2VPX20-6FFG896C
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XC6VSX475T-2FF1156I
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XQ6VSX475T-1RF1759I
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XQ6VLX240T-2RF1759I
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XC4VLX25-10FF676C
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XC8103-1PC84C
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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XC2VP20-5FF1152CES
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
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A3P1000-2FG256I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A3P1000-FG256I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
124.647451
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A3P1000-FG484T
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A3P600-FGG144
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AFS250-FG256I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
291.113733