The category is 'Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)'
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- Operating Temperature:
-40°C ~ 100°C (TJ)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Battery Backup Switching | Brand | Cache Memory | Chipsets | Clock Frequency-Max | Data RAM Size | Description/Function | Factory Pack QuantityFactory Pack Quantity | Flash | Ihs Manufacturer | Installed RAM | Interface Type | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Maximum RAM Capacity | Memory Types | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | On-Board Storage Size | On-Board Storage Type | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Processor Brand | Processor Type | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Operating Temperature | Packaging | Series | Size / Dimension | JESD-609 Code | Connector Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Data Rate | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Power Consumption | Number of Gates | Max Frequency | Speed Grade | Number of Transceivers | Primary Attributes | Number of Registers | Number of CLBs | Number of Logic Cells | Form Factor | Number of Cores | Module/Board Type | Number of Equivalent Gates | Flash Size | Co-Processor | Product Category | Height | Length | Width | Radiation Hardening |
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 | Mfr Part No AGLP030V5-CSG201I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 201-VFBGA, CSBGA | YES | 201-CSP (8x8) | 201 | AGLP030 | 250 MHz | MICROSEMI CORP | AGLP030V5-CSG201I | Microchip Technology | 3 | 120 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, BGA201,15X15,20 | BGA201,15X15,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 1.43 | Yes | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | IGLOO PLUS | e3 | Matte Tin (Sn) | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | S-PBGA-B201 | 120 | Not Qualified | 1.5 V | INDUSTRIAL | 120 | 792 CLBS, 30000 GATES | 0.99 mm | FIELD PROGRAMMABLE GATE ARRAY | 792 | 30000 | STD | 792 | 792 | 30000 | 8 mm | 8 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLN060V5-CSG81I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 81-WFBGA, CSBGA | YES | 81-CSP (5x5) | 81 | AGLN060 | MICROSEMI CORP | AGLN060V5-CSG81I | Microchip Technology | 3 | 60 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 2.07 | Yes | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | IGLOO nano | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | S-PBGA-B81 | Not Qualified | INDUSTRIAL | 1536 CLBS, 60000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 18432 | 60000 | STD | 1536 | 60000 | 5 mm | 5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P600-2FG144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LBGA | YES | 144-FPBGA (13x13) | 144 | A3P600 | 350 MHz | MICROSEMI CORP | A3P600-2FG144I | Microchip Technology | 3 | 97 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.25 | No | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | ProASIC3 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | INDUSTRIAL | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 2 | 13824 | 600000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL090TS-1FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | FBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2GL090 | Microchip Technology / Atmel | 60 | MICROSEMI CORP | M2GL090TS-1FG484I | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 267 I/O | 86316 | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | 0.627572 oz | -40°C ~ 100°C (TJ) | Tray | M2GL090TS | 100 °C | -40 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 1.2 V | 323.3 kB | 667 Mb/s | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86316 | FPGA - Field Programmable Gate Array | 2648064 | 4 Transceiver | 86316 | FPGA - Field Programmable Gate Array | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL050T-FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2GL050 | MICROSEMI CORP | M2GL050T-FG484I | Microchip Technology | 3 | 267 | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | IGLOO2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 1869824 | STD | 56340 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLN060V2-ZCSG81I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 81-WFBGA, CSBGA | YES | 81-CSP (5x5) | 81 | AGLN060 | MICROSEMI CORP | AGLN060V2-ZCSG81I | Microchip Technology | 60 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | VFBGA | 5 X 5 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, CSP-81 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | Obsolete | NOT SPECIFIED | 5.81 | Yes | 1.575 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | IGLOO nano | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | S-PBGA-B81 | Not Qualified | INDUSTRIAL | 1536 CLBS, 60000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 18432 | 60000 | 1536 | 60000 | 5 mm | 5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL010T-1FGG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | FBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2GL010 | Microchip Technology / Atmel | 60 | MICROSEMI CORP | M2GL010T-1FGG484I | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 233 | 12084 LE | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | 0.892167 oz | -40°C ~ 100°C (TJ) | Tray | M2GL010T | 100 °C | -40 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | 1.2 V | 114 kB | 667 Mb/s | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | FPGA - Field Programmable Gate Array | 933888 | 1 | 4 Transceiver | 12084 | FPGA - Field Programmable Gate Array | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL050TS-FGG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2GL050 | MICROSEMI CORP | M2GL050TS-FGG484I | Microchip Technology | 3 | 267 | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.27 | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 1869824 | 56340 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FCG1152I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | M2S150 | 64 kB | MICROSEMI CORP | - | - | M2S150T-1FCG1152I | 166 MHz | Microchip Technology | 4 | SMD/SMT | 574 | 146124 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.77 | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL050TS-FG896I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 896-BGA | YES | 896-FBGA (31x31) | 896 | M2GL050 | MICROSEMI CORP | M2GL050TS-FG896I | Microchip Technology | 3 | 377 | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | IGLOO2 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B896 | 377 | Not Qualified | 1.2 V | 377 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 1869824 | 56340 | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-1FG676I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S060 | 64 kB | MICROSEMI CORP | - | - | M2S060T-1FG676I | 166 MHz | Microchip Technology | 3 | 387 | 56520 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.88 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B676 | 387 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 387 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL010-1VF400I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | 400 | M2GL010 | MICROSEMI CORP | M2GL010-1VF400I | + 100 C | Microchip Technology | - 40 C | SMD/SMT | 195 | 12084 LE | Tray | PLASTIC/EPOXY | LFBGA | 17 X 17 MM, 0.80 MM PITCH, VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 20 | 5.3 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | IGLOO2 | 100 °C | -40 °C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B400 | 195 | Not Qualified | 1.2 V | 1.2 V | 1.26 V | 1.14 V | 114 kB | 195 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | 933888 | 1 | 12084 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPF300TLS-FCVG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BBGA, FCBGA | YES | 484-FCBGA (19x19) | 484 | MPF300 | MICROSEMI CORP | MPF300TLS-FCVG484I | + 100 C | Microchip Technology | - 40 C | SMD/SMT | 284 | 300000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | FBGA | FCBGA-484 | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | 5.79 | 1.03 V | 0.97 V | 1 V | -40°C ~ 100°C (TJ) | PolarFire™ | CAN ALSO BE OPERATED AT 1.05 VDD NOMINAL | 0.97V ~ 1.08V | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B484 | 1.05 V | INDUSTRIAL | 12.7 Gb/s | 3.32 mm | FIELD PROGRAMMABLE GATE ARRAY | 300000 | 21094400 | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLN125V5-CSG81I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 81-WFBGA, CSBGA | YES | 81-CSP (5x5) | 81 | AGLN125 | MICROSEMI CORP | AGLN125V5-CSG81I | Microchip Technology | 3 | 60 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | VFBGA | VFBGA, | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.59 | Yes | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | IGLOO nano | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | S-PBGA-B81 | Not Qualified | INDUSTRIAL | 3072 CLBS, 125000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 3072 | 36864 | 125000 | STD | 3072 | 125000 | 5 mm | 5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE600-FGG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | A3PE600 | 350 MHz | MICROSEMI CORP | A3PE600-FGG256I | Microchip Technology | 3 | 165 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 1.6 | Yes | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | ProASIC3E | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 165 | Not Qualified | 1.5/3.3 V | INDUSTRIAL | 165 | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | STD | 13824 | 13824 | 600000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P600L-FGG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 484-BGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3P600 | 350 MHz | MICROSEMI CORP | A3P600L-FGG484I | Microchip Technology | 3 | 235 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 1.37 | Compliant | Yes | 8542310000/8542310000/8542310000/8542310000/8542310000 | 1.575 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | ProASIC3L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | 1.14V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 235 | Not Qualified | 1.2 V | 1.5/3.3 V | INDUSTRIAL | 1.26 V | 1.14 V | 5 mA | 13.5 kB | 235 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 781.25 MHz | 13824 | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLN030V5-ZCSG81I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 81-WFBGA, CSBGA | YES | 81-CSP (5x5) | 81 | AGLN030 | 250 MHz | ACTEL CORP | AGLN030V5-ZCSG81I | Microchip Technology | 66 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | VFBGA | 5 X 5 MM, 0.8 MM HEIGHT, 0.5 MM PITCH, GREEN, CSP-81 | BGA81,9X9,20 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Transferred | Obsolete | NOT SPECIFIED | 5.78 | Yes | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | IGLOO nano | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.4 mm | compliant | S-PBGA-B81 | 66 | Not Qualified | 1.5 V | INDUSTRIAL | 66 | 768 CLBS, 30000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 768 | 30000 | 768 | 768 | 30000 | 5 mm | 5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGLN060V5-ZCSG81I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 81-WFBGA, CSBGA | YES | 81-CSP (5x5) | 81 | AGLN060 | MICROSEMI CORP | AGLN060V5-ZCSG81I | Microchip Technology | 60 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | VFBGA | 5 X 5 MM, 0.80 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, CSP-81 | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | Obsolete | NOT SPECIFIED | 5.81 | Yes | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | IGLOO nano | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | S-PBGA-B81 | Not Qualified | INDUSTRIAL | 1536 CLBS, 60000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 18432 | 60000 | 1536 | 60000 | 5 mm | 5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SM-K26-XCL2GI-ED | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Backup Battery | L2 | K26I | Adaptive System On Module | 1 | 64 MB, 16 GB | 4 GB | CAN, GPIO, I2C, SDIO, SPI, UART, USB | + 100 C | 4 GB | DDR4 | AMD Xilinx | - 40 C | 16 GB | eMMC | Box | Xilinx | XCK26-SFVC784-2LV-I | Active | Details | Kria | -40°C ~ 100°C (TJ) | K26 | 3.030 L x 2.360 W (77.00mm x 60.00mm) | 2 x 240 Pin | 533 MHz, 1.33 GHz | 5 V | 4 GB | 533MHz, 1.333GHz | 4GB | ARM® Cortex®-A53 | 15 W | - | FPGA Core | 16GB eMMC, 64MB QSPI | Arm® Cortex®-R5F | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PN125-ZVQ100I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 100-TQFP | YES | 100-VQFP (14x14) | 100 | A3PN125 | MICROSEMI CORP | A3PN125-ZVQ100I | Microchip Technology | 3 | 71 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | TFQFP | TFQFP, TQFP100,.63SQ | TQFP100,.63SQ | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Obsolete | Obsolete | 30 | 5.32 | No | 1.575 V | 1.425 V | 1.5 V | -40°C ~ 100°C (TJ) | ProASIC3 nano | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V ~ 1.575V | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G100 | 71 | Not Qualified | 1.5,1.5/3.3 V | INDUSTRIAL | 71 | 3072 CLBS, 125000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 125000 | 3072 | 3072 | 125000 | 14 mm | 14 mm |
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AGLP030V5-CSG201I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AGLN060V5-CSG81I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A3P600-2FG144I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL090TS-1FG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL050T-FG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AGLN060V2-ZCSG81I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL010T-1FGG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL050TS-FGG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2S150T-1FCG1152I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL050TS-FG896I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2S060T-1FG676I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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M2GL010-1VF400I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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MPF300TLS-FCVG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AGLN125V5-CSG81I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A3PE600-FGG256I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A3P600L-FGG484I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AGLN030V5-ZCSG81I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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AGLN060V5-ZCSG81I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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SM-K26-XCL2GI-ED
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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A3PN125-ZVQ100I
Microchip
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire