The category is 'Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Cache Memory | Clock Frequency-Max | Description/Function | Dimensions | Factory Pack QuantityFactory Pack Quantity | Flash | Ihs Manufacturer | Installed RAM | Interface Type | Manufacturer Part Number | Maximum Operating Temperature | Maximum RAM Capacity | Memory Types | Mfr | Minimum Operating Temperature | Moisture Sensitivity Levels | Number of I/O Lines | Number of I/Os | On-Board Storage Size | On-Board Storage Type | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Part Package Code | Processor Brand | Processor Series | Processor Type | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Operating Temperature | Packaging | Series | Size / Dimension | JESD-609 Code | Pbfree Code | ECCN Code | Connector Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Memory Size | Speed | RAM Size | Core Processor | Propagation Delay | Supply Current-Max | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Telecom IC Type | Number of Logic Blocks (LABs) | Output Function | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Form Factor | Number of Dedicated Inputs | Number of Cores | Module/Board Type | Number of Equivalent Gates | Flash Size | Co-Processor | Length | Width |
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 | Mfr Part No LFX200EB-05FH516C | Lattice Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 516 | 320 MHz | LATTICE SEMICONDUCTOR CORP | LFX200EB-05FH516C | 3 | 70 °C | PLASTIC/EPOXY | BGA | BGA, BGA516,30X30,40 | BGA516,30X30,40 | SQUARE | GRID ARRAY | Obsolete | BGA | 5.86 | No | 2.7 V | 2.3 V | 2.5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | ALSO OPERATES WITH 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | not_compliant | 30 | 516 | S-PBGA-B516 | 208 | Not Qualified | 2.5/3.3 V | COMMERCIAL | 208 | 676 CLBS, 210000 GATES | 2.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 0.86 ns | 676 | 2704 | 210000 | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LFXP2-17E-7QN208C8W | Lattice Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | 420 MHz | LATTICE SEMICONDUCTOR CORP | LFXP2-17E-7QN208C8W | 3 | 85 °C | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | 5.83 | Yes | 1.26 V | 1.14 V | 1.2 V | e3 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | QUAD | GULL WING | 0.5 mm | compliant | 208 | S-PQFP-G208 | 146 | Not Qualified | 1.2,1.2/3.3,3.3 V | OTHER | 146 | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 17000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LFXP2-17E-7FN484C8W | Lattice Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 484 | 420 MHz | LATTICE SEMICONDUCTOR CORP | LFXP2-17E-7FN484C8W | 3 | 85 °C | PLASTIC/EPOXY | BGA | 23 X 23 MM, LEAD FREE, FPBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Obsolete | BGA | 5.83 | Yes | 1.26 V | 1.14 V | 1.2 V | e1 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 1 mm | unknown | 484 | S-PBGA-B484 | 358 | Not Qualified | 1.2,1.2/3.3,3.3 V | OTHER | 358 | 2.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 17000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LFXP2-17E-6QN208C8W | Lattice Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | 357 MHz | LATTICE SEMICONDUCTOR CORP | LFXP2-17E-6QN208C8W | 3 | 146 | 85 °C | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | 5.83 | Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | e3 | EAR99 | Matte Tin (Sn) | 85 °C | 0 °C | 8542.39.00.01 | QUAD | GULL WING | 0.5 mm | compliant | 208 | S-PQFP-G208 | 146 | Not Qualified | 1.2 V | 1.2,1.2/3.3,3.3 V | OTHER | 38.9 kB | 146 | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 17000 | 2125 | 17000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LFXP2-17E-5F484C8W | Lattice Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 484 | 311 MHz | LATTICE SEMICONDUCTOR CORP | LFXP2-17E-5F484C8W | 3 | 85 °C | PLASTIC/EPOXY | BGA | 23 X 23 MM, FPBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Obsolete | BGA | 5.91 | No | 1.26 V | 1.14 V | 1.2 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | 484 | S-PBGA-B484 | 358 | Not Qualified | 1.2,1.2/3.3,3.3 V | OTHER | 358 | 2.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 17000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LCMXO640C-4F256C | Lattice Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 388 MHz | LATTICE SEMICONDUCTOR CORP | LCMXO640C-4F256C | 3 | 159 | 85 °C | PLASTIC/EPOXY | BGA | 17 X 17 MM, FPBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Obsolete | BGA | 5.67 | No | 3.465 V | 1.71 V | 1.8 V | e0 | No | EAR99 | Tin/Lead (Sn63Pb37) | IT CAN ALSO OPERATE AT 2.5V AND 3.3V | 8542.39.00.01 | BOTTOM | BALL | 225 | 1 mm | compliant | 30 | 256 | S-PBGA-B256 | 159 | Not Qualified | 1.8/3.3 V | OTHER | 4.2 ns | 159 | 7 DEDICATED INPUTS, 159 I/O | 2.1 mm | FLASH PLD | MACROCELL | 640 | 7 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CS203-P | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | NO | 18 | CRYSTAL SEMICONDUCTOR CORP | CS203-P | 70 °C | PLASTIC/EPOXY | DIP | 0.300 INCH, PLASTIC, DIP-18 | DIP18,.3 | RECTANGULAR | IN-LINE | Obsolete | NOT SPECIFIED | 5.8 | No | 5 V | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | unknown | R-PDIP-T18 | Not Qualified | 5 V | COMMERCIAL | 0.012 mA | DTMF SIGNALING CIRCUIT | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BKCM11EBI38W | Intel | Datasheet | 1780 | - | Min: 1 Mult: 1 | 95 mm x 65 mm x 6 mm | 5 | 8 GB | Audio, DP, Ethernet, I2C, PCle, Serial, USB | + 100 C | 8 GB | LPDDR4x | 0 C | 99A8FV | Intel | Intel Core i3-1115G4 | Core i3-1115G4 | Details | NUC | Bulk | NUC 11 | 4.1 GHz | 5.7 VDC to 20 VDC | 8 GB | U-Series | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No QC-DB-Q00004 | Lantronix | Datasheet | - | - | Min: 1 Mult: 1 | 1 | Details | Open-Q | 0.440925 oz | Bulk | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SOM-7569BC0X-S3B1 | Advantech | Datasheet | - | - | Min: 1 Mult: 1 | 2 MB | 84 mm x 55 mm | 1 | 4 GB | Audio, Ethernet, GPIO, PCIe, SDIO, SPI, USB | + 85 C | 8 GB | DDR3L | - 40 C | Intel | X5-E3930 | Atom | Details | SOM-7569 | 1.3 GHz | 4.75 V to 20 V | 4 GB | COM Express 2.1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SOM-6867RCB-U0A1 | Advantech | Datasheet | - | - | Min: 1 Mult: 1 | 2 MB | 95 mm x 95 mm | 1 | COM Express Compact Module | Audio, Ethernet, GPIO, I2C, SATA, Serial, USB | + 60 C | 8 GB | DDR3L-1333 | 0 C | Intel | J1900 | Celeron | Details | SOM-6867 | 2 GHz | 4.75 V to 20 V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SOM-3567BS0XB-S5A1 | Advantech | Datasheet | - | - | Min: 1 Mult: 1 | 70 mm x 70 mm | 1 | 2 GB | Ethernet, GPIO, I2C, PCIe, SATA, Serial, USB | + 85 C | 8 GB | DDR3L | - 40 C | Intel | E3815 | Atom | Details | SOM-3567 | 1.46 GHz | 5 V | 2 GB | Qseven | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BKCM11EBC4W | Intel | Datasheet | 96 | - | Min: 1 Mult: 1 | 95 mm x 65 mm x 6 mm | 5 | 4 GB | Audio, DP, Ethernet, I2C, PCle, Serial, USB | + 100 C | 4 GB | LPDDR4x | 0 C | 99A8FW | Intel | Intel Celeron 6305 | Celeron 6305 | Details | NUC | Bulk | NUC 11 | 1.8 GHz | 5.7 VDC to 20 VDC | 4 GB | U-Series | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No QC-DB-P10004A | Lantronix | Datasheet | - | - | Min: 1 Mult: 1 | 1 | Audio, Bluetooth, GPIO, I2C, MIPI-CSI, MIPI-DSI, PCIe, SPI, UART, USB 3.1, WiFi, Video | + 85 C | 6 GB | LPDDR4 | - 25 C | 32 GB | Qualcomm | SDA845 | Details | Open-Q | 0.253973 oz | Bulk | 1.766 GHz, 2.649 GHz | 3.5 V to 4.7 V | 50 mm x 25 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No QC-DB-U10004 | Lantronix | Datasheet | - | - | Min: 1 Mult: 1 | 1 | 6 GB | GPIO, I2C, SPI, UART, USB | 6 GB | LPDDR5 | 64 GB | Flash | Qualcomm | SXR2130P | Details | Open-Q | 1.650 lbs | Bulk | 2.84 GHz | 3.7 V | 50 mm x 29 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TE0813-01-2BE11-A | Trenz Electronic | Datasheet | - | - | Min: 1 Mult: 1 | MPSoC Module | 52 mm x 76 mm | 1 | 128 MB | + 85 C | DDR4 | 0 C | Xilinx | Zynq UltraScale+ | XCZU2EG-1SFVC784E | 3.3 V, 5 V | 2 GB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TE0821-01-3BE21MA | Trenz Electronic | Datasheet | - | - | Min: 1 Mult: 1 | 40 mm x 50 mm | 1 | 128 MB | PCIe, SATA, USB | + 85 C | DDR4 | 0 C | 8 GB | eMMC | Xilinx | Zynq UltraScale+ | XCZU3EG-1SFVC784E | 2 GB | 4 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TE0813-01-2AE11-A | Trenz Electronic | Datasheet | 1697 |
| Min: 1 Mult: 1 | MPSoC Module | 52 mm x 76 mm | 1 | 128 MB | + 85 C | DDR4 | Trenz Electronic GmbH | 0 C | Box | Xilinx | Zynq UltraScale+ | XCZU2CG-1SFVC784E | Active | 0°C ~ 85°C | - | 2.050 L x 2.990 W (52.00mm x 76.00mm) | Board-to-Board (BTB) Socket | 3.3 V, 5 V | 2 GB | - | 2GB | Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E | FPGA Core | 128MB | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TE0821-01-3BI21MA | Trenz Electronic | Datasheet | - | - | Min: 1 Mult: 1 | 40 mm x 50 mm | 1 | 128 MB | PCIe, SATA, USB | + 85 C | DDR4 | - 40 C | 8 GB | eMMC | Xilinx | Zynq UltraScale+ | XCZU3EG-1SFVC784I | 2 GB | 4 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No TE0823-01-3PIU1ML | Trenz Electronic | Datasheet | 606 |
| Min: 1 Mult: 1 | 5 cm x 4 cm | 1 | 1 GB | Ethernet, UART, USB | + 85 C | 1 GB | DDR4 | Trenz Electronic GmbH | - 40 C | 8 GB | eMMC | Xilinx | Zynq UltraScale+ | XCZU3CG-L1SFVC784I | Active | -40°C ~ 85°C | 1.970 L x 1.570 W (50.00mm x 40.00mm) | USB | 3.3 V to 5 V | 1 GB | - | 1GB | ARM Cortex-A53, ARM® Cortex®-R5 | 4 cm x 5 cm | 2 | MCU, FPGA | 128MB | Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I |
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LFX200EB-05FH516C
Lattice Semiconductor
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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LFXP2-17E-7QN208C8W
Lattice Semiconductor
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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LFXP2-17E-7FN484C8W
Lattice Semiconductor
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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LFXP2-17E-6QN208C8W
Lattice Semiconductor
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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LFXP2-17E-5F484C8W
Lattice Semiconductor
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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LCMXO640C-4F256C
Lattice Semiconductor
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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CS203-P
Xilinx
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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BKCM11EBI38W
Intel
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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QC-DB-Q00004
Lantronix
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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SOM-7569BC0X-S3B1
Advantech
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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SOM-6867RCB-U0A1
Advantech
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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SOM-3567BS0XB-S5A1
Advantech
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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BKCM11EBC4W
Intel
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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QC-DB-P10004A
Lantronix
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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QC-DB-U10004
Lantronix
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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TE0813-01-2BE11-A
Trenz Electronic
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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TE0821-01-3BE21MA
Trenz Electronic
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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TE0813-01-2AE11-A
Trenz Electronic
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
247.654042
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TE0821-01-3BI21MA
Trenz Electronic
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
Price: please inquire
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TE0823-01-3PIU1ML
Trenz Electronic
Package:Evaluation Boards - Embedded - Complex Logic (FPGA, CPLD)
691.937926