The category is 'Sockets for ICs, Transistors'

  • All Manufacturers
  • Number of Contacts
  • Contact Finish Mating
  • Contact Materials
  • Manufacturer
  • ECCN Code
  • HTS Code
  • Housing Material
  • Device Socket Type
  • Device Type Used On
  • Ihs Manufacturer
  • Manufacturer Part Number
  • Part Life Cycle Code

Image

Part Number

Manufacturer

Datasheet

Availability

Pricing(USD)

Quantity

RoHS

Contact Plating

Mount

Number of Pins

Housing Material

Body Material

Approvals

Base/Housing Material

Body Orientation

Brand

Card & Socket Accessory Typeu2009

Centerline (Pitch)u2009

Compatible With IC Socket Typeu2009

Connector & Contact Terminates Tou2009

Connector Systemu2009

Contact Current Rating (Max)u2009(A)

Contact Materials

Contact Mating Area Plating Material Thicknessu2009(µin)

Contact Resistance Max

Device Typeu2009

DRAM Typeu2009

Factory Pack QuantityFactory Pack Quantity

Fin Styleu2009

Grid Size

IC Socket Typeu2009

Insulation Materials

Leg Styleu2009

Manufacturer

Maximum Operating Temperature

Mfr

Minimum Operating Temperature

Module Orientationu2009

Mounting

Mounting Styles

Number of Contact Rows

Number of Finsu2009

Number of Positionsu2009

Operating Temp Range

Operating Temperature Rangeu2009

Operating Temperature Rangeu2009(°C)

Package

PCB Hole Diameteru2009

PCB Mounting Styleu2009

Pitch (mm)

Power Ratingu2009(W)

Product Depth (mm)

Product Status

Qualification

Rad Hardened

RoHS

Row Spacing (mm)

Socket Lengthu2009

Socket Sleeve Styleu2009

Stack Heightu2009

TE Internal #

TE Internal Description

Termination Method

Unit Weight

Wire Size

Wire Sizeu2009(AWG)

Wire Sizeu2009(mm²)

Operating Temperature

Packaging

Series

Termination

Temperature Coefficient

Connector Type

Type

Resistance

Number of Positions

Max Operating Temperature

Color

Number of Rows

Gender

Subcategory

Power Rating

Pitch

Orientation

Depth

Resistor Type

Current Rating

Termination Style

Number of Contacts

Housing Color

Lead Length

Contact Resistance

Insulation Resistance

Row Spacing

ELV

Product Type

Resistance Tolerance

Insertion Force

Product

Product Category

Product Length

Product Width

Product Length (mm)

Length

Product Height (mm)

Radiation Hardening

REACH SVHC

Flammability Rating

Lead Free

1825094-6

Mfr Part No

1825094-6

TE Connectivity Datasheet

-

-

Min: 1

Mult: 1

Gold Over Nickel

Vertical

20

Thermoplastic

PO (Polyolefin)

CSA, UL

Thermoplastic

Straight

Phosphor Bronze

30(mohm)

Not Required

Thermoplastic

Through Hole

Through Hole

2

2.54(mm)

10(mm)

No

Compliant

7.87(mm)

Solder

-55 to 135 °C

Tube

Through Hole

DIP, Socket

DIP Socket

20

125 °C

White

2

SKT

2.5400 mm

Straight

10 mm

20(POS)

3.25 mm

30 mΩ

10000(Mohm)

7.87 mm

Compliant

25.27 mm

25.27(mm)

25.27 mm

5.35(mm)

No

Unknown

UL94 V-0

Lead Free

2-1571550-9

Mfr Part No

2-1571550-9

TE Connectivity Datasheet

4
In Stock

  • 1: $14.912488
  • 10: $14.068385
  • 100: $13.272061
  • 500: $12.520812
  • View all price

Min: 1

Mult: 1

Gold

Polyester

Polyester

Straight

TE Connectivity / AMP

Beryllium Copper

10(mohm)

17

Not Required

Polyester

TE Connectivity

+ 105 C

- 55 C

Through Hole

Through Hole

2

-55C to 105C

2.54(mm)

17.78(mm)

No

Details

15.24(mm)

Solder

0.480008 oz

-55 to 105 °C

Tube

100.0000 ppm/°C

DIP Socket

316 Ohm

28 Position

2 Row

Receptacle

IC & Component Sockets

0.5 W

2.5400 mm

High Reliability, MIL-PRF-39017

3/Contact(A)

Through Hole

28(POS)

5000(Mohm)

15.24 mm

IC & Component Sockets

1

1.31N

DIP / SIP Sockets

IC & Component Sockets

11.43

35.56(mm)

UL 94V-0

1-2308107-5

Mfr Part No

1-2308107-5

TE Connectivity Datasheet

-

-

Min: 1

Mult: 1

Board-to-Bus Bar

Double Data Rate (DDR) 4

Vertical

288

Through Hole - Solder

AEC-Q200

1-2308107-5

DDR4 DIMM 288 PIN TH TYPE

100 ppm/K

15.4 Ohm

0.25 W

General Purpose

1

3.2 mm

1.6 mm

1-2308107-3

Mfr Part No

1-2308107-3

TE Connectivity Datasheet

-

-

Min: 1

Mult: 1

Board-to-Bus Bar

Double Data Rate (DDR) 4

Vertical

288

Through Hole - Solder

1-2308107-3

DDR4 DIMM 288 PIN TH TYPE

100.0000 ppm/°C

62 Ohm

0.125 W

High Reliability, MIL-PRF-39017

2

4.75

2310927-1

Mfr Part No

2310927-1

TE Connectivity Datasheet

-

-

Min: 1

Mult: 1

Carrier

LGA 3647, Metric PQFP

-25 – 100u2009°Cu2009[u2009-13 – 212u2009°Fu2009]

2310927-1

CARRIER, NARROW FABRIC, SOCKET P

50.0000 ppm/°C

232 Ohm

0.125 W

High Reliability, MIL-PRF-55182

1

7.62

2309409-2

Mfr Part No

2309409-2

TE Connectivity Datasheet

2240
In Stock

-

Min: 1

Mult: 1

Cable-to-Board

Small Outline (SO)

Right Angle

260

5.2u2009mmu2009[u2009.205u2009inu2009]

2309409-2

DDR4 SODIMM 260P 5.2H STD

100 ppm/K

301 Ohm

0.25 W

General Purpose

1

21764-9332-90-2431

Mfr Part No

21764-9332-90-2431

3M Datasheet

-

-

Min: 1

Mult: 1

3M

Bulk

Obsolete

*

292407-4

Mfr Part No

292407-4

TE Connectivity Datasheet

-

-

Min: 1

Mult: 1

Cable-to-Board

Double Data Rate (DDR) 2

Right Angle

200

4u2009mmu2009[u2009.157u2009inu2009]

292407-4

EMBOSS DDR2 SODIMM 200P 4H RVS

1-2324271-1

Mfr Part No

1-2324271-1

TE Connectivity Datasheet

-

-

Min: 1

Mult: 1

Tin

Thermoplastic

Straight

Board-to-Board

Phosphor Bronze

30

LGA 4189

Cable Mount

2092

Surface Mount Solder Ball

1-2324271-1

RIGHT SEGMENT LGA4189-4 SOCKETP4 FOR ODM

Screw

28 to 16, 28 AWG

-40 to 115 °C

Terminal Block

1

Receptacle

3.5000 mm

Green

7 mm

1-2199154-1

Mfr Part No

1-2199154-1

TE Connectivity Datasheet

-

-

Min: 1

Mult: 1

Board-to-Board

Double Data Rate (DDR) 4

Vertical

288

Through Hole - Solder

1-2199154-1

DDR4 DIMM 288 Pin TH type

1-2199154-4

Mfr Part No

1-2199154-4

TE Connectivity Datasheet

-

-

Min: 1

Mult: 1

Board-to-Board

Double Data Rate (DDR) 4

Vertical

288

Through Hole - Solder

1-2199154-4

DDR4 DIMM 288 Pin TH type

2-2330551-2

Mfr Part No

2-2330551-2

TE Connectivity Datasheet

-

-

Min: 1

Mult: 1

Backplate

-25 – 100

2-2330551-2

SOCKET P4/P5 BACKPLATE ASSY,STUD 7.12MM

5645508-1

Mfr Part No

5645508-1

TE Connectivity Datasheet

-

-

Min: 1

Mult: 1

1.83u2009mmu2009[u2009.072u2009inu2009]

5.23u2009mmu2009[u2009.206u2009inu2009]

Closed Bottom

5645508-1

SKT, M.S.S. SER 4, SPL

19

.653

1-5331677-3

Mfr Part No

1-5331677-3

TE Connectivity Datasheet

6300
In Stock

-

Min: 1

Mult: 1

1.57u2009mmu2009[u2009.062u2009inu2009]

3.51u2009mmu2009[u2009.138u2009inu2009]

Closed Bottom

1-5331677-3

SOCKET,MIN-SPR SN SER-3U SER-3

20 – 21

.41 – .518

1814655-5

Mfr Part No

1814655-5

TE Connectivity Datasheet

8
In Stock

Min: 1

Mult: 1

2.54u2009mmu2009[u2009.1u2009inu2009]

Printed Circuit Board

1

Standard

10

1814655-5

SIP IC Skt 10 SSR Sn/Au 0.75 RoHS

1542993-2

Mfr Part No

1542993-2

TE Connectivity Datasheet

-

-

Min: 1

Mult: 1

SFP

Pin Fin

50

5, 10, 15

1542993-2

SFP HEATSINK 13.5MM TALL

50865

Mfr Part No

50865

TE Connectivity Datasheet

16
In Stock

Min: 1

Mult: 1

1.83u2009mmu2009[u2009.072u2009inu2009]

6.6u2009mmu2009[u2009.26u2009inu2009]

Closed Bottom

50865

SOCKET,MIN-SPR AU SER-4

20 – 18

.518 – .823

50871-4

Mfr Part No

50871-4

TE Connectivity Datasheet

-

-

Min: 1

Mult: 1

2.56u2009mmu2009[u2009.101u2009inu2009]

7.32u2009mmu2009[u2009.288u2009inu2009]

Closed Bottom

50871-4

SOCKET,MIN-SPR AU SER-5

18 – 17

.823 – 1.04

1-2324271-4

Mfr Part No

1-2324271-4

TE Connectivity Datasheet

134
In Stock

-

Min: 1

Mult: 1

Board-to-Board

15

LGA 4189

2097

Surface Mount Solder Ball

1-2324271-4

LEFT SEGMENT LGA4189-4 SOCKET-P4 FOR ODM

2-2330552-2

Mfr Part No

2-2330552-2

TE Connectivity Datasheet

3072
In Stock

-

Min: 1

Mult: 1

Gold Over Nickel

PPS (Polyphenylene Sulfide)

Right Angle

Carrier

Metric PQFP

Phosphor Bronze

Through Hole

-25 – 100u2009°Cu2009[u2009-13 – 212u2009°Fu2009]

2-2330552-2

ICX POINT PHM CARRIER ASSY, P4

Solder

-65 to 125 °C

RCP

2.5400 mm

Natural

150.88 mm