The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Supplier Device Package | Material | Angle | Approvals | Base Product Number | Cable Style | Enclosure | Grip Type | Manufacturer | Manufacturer Part Number | Maximum Cable Diameter (mm) | Maximum Operating Supply Voltage | Mfr | Minimum Cable Diameter (mm) | Minimum Operating Supply Voltage | Mounting | Mounting Styles | Number of I/Os | Package | Product Status | RoHS | Shaft Type | Typical Operating Supply Voltage | Operating Temperature | Series | Size / Dimension | Part Status | Termination | Type | Composition | Voltage - Supply | Frequency | Frequency Stability | Output | Function | Base Resonator | Current - Supply (Max) | Output Voltage | Output Type | Current - Supply (Disable) (Max) | Interface | Speed | RAM Size | Core Processor | Peripherals | Spread Spectrum Bandwidth | Connectivity | Architecture | Max Frequency | Speed Grade | Absolute Pull Range (APR) | Primary Attributes | Flash Size | Input Voltage | Bearings | IP Rating | Height Seated (Max) | Ratings |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No XCVM1802-1MSEVFVC1760 | AMD | Datasheet | 782 | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 500 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-1MSIVSVD1760 | AMD | Datasheet | 752 |
| Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 692 | Tray | Active | -40°C ~ 100°C (TJ) | * | Obsolete | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU1CG-2SFVA625E | AMD | Datasheet | 1943 | - | Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | - | Tray | Active | 0°C ~ 100°C (TJ) | * | Active | CAN/Serial I2C/SPI/U | 533MHz, 1.333GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | - | - | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-1MSEVFVC1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 532 | Tray | Active | 0°C ~ 100°C (TJ) | * | Active | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1502-1LSIVSVA2197 | AMD | Datasheet | 641 | - | Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 586 | Tray | Active | -40°C ~ 100°C (TJ) | * | Active | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 80k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-1MLIVFVC1596 | AMD | Datasheet | 400 |
| Min: 1 Mult: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 748 | Tray | Active | -40°C ~ 100°C (TJ) | * | Active | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-PQG208 | Microchip | Datasheet | 1761 |
| Min: 1 Mult: 1 | 208-BFQFP | 208-PQFP (28x28) | A2F500 | 2XR8I+2XR8I | ABB | ACS880-17-1110A-5+B4+C+H-ABBI | Microchip Technology | Panel | MCU - 22, FPGA - 66 | ACS8802XR8I+2XR8IIP42 | Active | 0°C ~ 85°C (TJ) | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 500 Hz | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | IP42 | |||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFC023R25A1E1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA008R24C3E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 576 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB008R16A3E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Nickel Plated Brass | Straight | CSA, UL | Round | Bushing Grip | Pepperl Fuchs | 291378 | 11.94 mm | Intel | 4.06 mm | 384 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | Metallic | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | IP66, IP68 | ||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4CG-2SFVC784I | AMD | Datasheet | 430 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU4 | Miscellaneous | AMD | 252 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU49DR-2FFVF1760I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 622 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFD019R25A2I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA027R24C2E1VR2 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA008R16A2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 384 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU46DR-L2FFVH1760I | AMD | Datasheet | 641 |
| Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 574 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EV-1FBVB900E | AMD | Datasheet | 484 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | CE | XCZU4 | Dynapar | HS35R05009141 | AMD | Hollowshaft | 204 | Tray | Active | Yes | Hollow | -40 to 85 Degrees C | Zynq® UltraScale+™ MPSoC EV | 7 Pin Connector | 5~26 VDC | Differential | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | 5~26 VDC | Yes | IP67 | |||||||||||||||||||||||||||||||
| Mfr Part No 1SX065HH3F35I2LG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Hubbell | IN430FS1 | Intel | 392 | Tray | Active | -40°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 650K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No UPD63F810GM(A)-8EV-A | Renesas | Datasheet | 501 |
| Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | SG-8101 | EPSON | Tape & Reel (TR) | Active | -40°C ~ 105°C | SG-8101 | 0.276 L x 0.197 W (7.00mm x 5.00mm) | XO (Standard) | 1.8V ~ 3.3V | 74.25 MHz | ±20ppm | CMOS | Enable/Disable | Crystal | 6.8mA (Typ) | 3.5mA | - | - | 0.055 (1.40mm) | - | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU9CG-2FFVC900E | AMD | Datasheet | 34 | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU9 | 0.892 V | AMD | 0.808 V | 204 | Tray | Active | 0.8500 V | 0 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - |
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XCVM1802-1MSEVFVC1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1902-1MSIVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
25,336.999168
-
XCZU1CG-2SFVA625E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1302-1MSEVFVC1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1502-1LSIVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1402-1MLIVFVC1596
AMD
Package:Embedded - System On Chip (SoC)
7,448.416608
-
A2F500M3G-PQG208
Microchip
Package:Embedded - System On Chip (SoC)
116.341936
-
AGFC023R25A1E1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA008R24C3E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB008R16A3E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU4CG-2SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
1,375.169198
-
XCZU49DR-2FFVF1760I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFD019R25A2I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA027R24C2E1VR2
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA008R16A2E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU46DR-L2FFVH1760I
AMD
Package:Embedded - System On Chip (SoC)
41,327.691828
-
XCZU4EV-1FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
1,672.343413
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1SX065HH3F35I2LG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
UPD63F810GM(A)-8EV-A
Renesas
Package:Embedded - System On Chip (SoC)
41.282234
-
XCZU9CG-2FFVC900E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire