The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Data RAM Size | I/O Voltage | Ihs Manufacturer | Instruction Set Architecture | Interface Type | JTAG Support | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Mfr | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Processing Unit | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Operating Temperature | Series | Size / Dimension | Tolerance | JESD-609 Code | Number of Terminations | Temperature Coefficient | Resistance | Terminal Finish | Composition | Power (Watts) | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Number of Outputs | Qualification Status | Failure Rate | Power Supplies | Interface | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Features | Device Core | Height Seated (Max) | Length | Width | Ratings |
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 | Mfr Part No AGIB027R31B3I3E | Intel | Datasheet | 543 |
| Min: 1 Mult: 1 | - | - | PEI-Genesis | 720 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA008R24C2I2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 0805 (2012 Metric) | 0805 | RN73R2A | KOA Speer Electronics, Inc. | 576 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Active | -55°C ~ 155°C | RN73R | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±0.5% | 2 | ±50ppm/°C | 59 Ohms | Thin Film | 0.125W, 1/8W | - | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | Automotive AEC-Q200, Moisture Resistant | 0.024 (0.60mm) | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFC023R25A1E1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA008R24C3E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 576 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU49DR-2FFVF1760I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 622 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFD019R25A2I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA027R24C2E1VR2 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS048 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | PEI-Genesis | Bulk | Active | * | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-FGG676I | Microchip | Datasheet | 1629 | - | Min: 1 Mult: 1 | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S060 | MICROSEMI CORP | Microsemi Corporation | M2S060TS-FGG676I | Microchip Technology | 3 | 387 | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.81 | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 387 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 387 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 27 mm | 27 mm | |||||||||||||||||||||||||||||||
| Mfr Part No M2S010-1VFG256I | Microchip | Datasheet | 35 |
| Min: 1 Mult: 1 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | M2S010 | MICROSEMI CORP | Microsemi Corporation | M2S010-1VFG256I | Microchip Technology | 3 | 138 | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.77 | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B256 | 138 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | 14 mm | 14 mm | ||||||||||||||||||||||||||||||
| Mfr Part No M2S060-1FG676I | Microchip | Datasheet | 1904 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | 676-FBGA (27x27) | M2S060 | Microchip Technology | 387 | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-1VF256I | Microchip | Datasheet | 21 |
| Min: 1 Mult: 1 | 256-LFBGA | 256-FPBGA (14x14) | M2S005 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 161 | 6060 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-1VF256 | Microchip | Datasheet | 1760 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 256-LFBGA | 256-FPBGA (14x14) | M2S025 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 138 | 27696 LE | Tray | Active | Non-Compliant | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU1EG-L2SFVA625E | AMD | Datasheet | 1745 |
| Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | - | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ | CAN/Serial I2C/SPI/U | 533MHz, 600MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU67DR-L1FFVE1156I | AMD | Datasheet | 655 |
| Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU42DR-1FSVE1156E | AMD | Datasheet | 506 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 366 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 489K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU42DR-2FFVE1156E | AMD | Datasheet | 416 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | 1.8/2.5/3.3 V | RISC | CAN/Serial I2C/SPI/UART/USB | Yes | AMD | 366 | Tray | FPGA/Microcontroller | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | CAN/Serial I2C/SPI/U | 533MHz, 1.333GHz | 256 KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 64 Bit | Zynq®UltraScale+™ FPGA, 489K+ Logic Cells | - | ARM Cortex-A53/ARM Cortex-R5F | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-1LSEVSVD1760 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 726 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE1752-2LSENSVG1369 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 500 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU57DR-2FFVE1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | - | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC DR | 533MHz, 1.3GHz | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq® UltraScale+™ RFSoC | - |
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AGIB027R31B3I3E
Intel
Package:Embedded - System On Chip (SoC)
25,059.542132
-
AGFA008R24C2I2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFC023R25A1E1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA008R24C3E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU49DR-2FFVF1760I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFD019R25A2I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA027R24C2E1VR2
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS048
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-FGG676I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-1VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
76.879992
-
M2S060-1FG676I
Microchip
Package:Embedded - System On Chip (SoC)
269.786104
-
M2S005S-1VF256I
Microchip
Package:Embedded - System On Chip (SoC)
46.558785
-
M2S025-1VF256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU1EG-L2SFVA625E
AMD
Package:Embedded - System On Chip (SoC)
495.319620
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XCZU67DR-L1FFVE1156I
AMD
Package:Embedded - System On Chip (SoC)
20,454.691025
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XCZU42DR-1FSVE1156E
AMD
Package:Embedded - System On Chip (SoC)
9,381.013076
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XCZU42DR-2FFVE1156E
AMD
Package:Embedded - System On Chip (SoC)
14,722.055264
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XCVM1402-1LSEVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVE1752-2LSENSVG1369
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU57DR-2FFVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire