The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Contact Shape | Shell Material | Supplier Device Package | Insert Material | Number of Terminals | Backshell Material, Plating | Base Product Number | Brand | Clock Frequency-Max | Contact Finish Mating | Contact Materials | Contact Sizes | Data RAM Size | Data RAM Type | Factory Pack QuantityFactory Pack Quantity | I/O Voltage | Ihs Manufacturer | Impedance (Max) (Zzt) | Instruction Set Architecture | Interface Type | JTAG Support | L1 Cache Data Memory | L1 Cache Instruction Memory | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Data Rate | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Mounting | Mounting Styles | Number of CPU Cores | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Primary Material | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Current Receiving | Supply Current Transmitting | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Termination | Connector Type | Type | Number of Positions | Color | Applications | HTS Code | Fastening Type | Subcategory | Contact Type | Current Rating (Amps) | Technology | Voltage - Supply | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Frequency | Frequency Stability | Output | Shell Finish | Pin Count | Shell Size - Insert | JESD-30 Code | Function | Base Resonator | Current - Supply (Max) | Number of Outputs | Qualification Status | Operating Frequency | Housing Color | Operating Supply Voltage | ESR (Equivalent Series Resistance) | Power Supplies | Temperature Grade | Current - Supply (Disable) (Max) | Note | Interface | Memory Size | Load Capacitance | Speed | RAM Size | Current - Reverse Leakage @ Vr | Operating Mode | Shell Size, MIL | Voltage - Forward (Vf) (Max) @ If | uPs/uCs/Peripheral ICs Type | Core Processor | Frequency Tolerance | Peripherals | Program Memory Type | Power Line Protection | Program Memory Size | Spread Spectrum Bandwidth | Connectivity | Output Power | Voltage - Breakdown (Min) | Power - Max | Cable Opening | Power - Peak Pulse | Current - Peak Pulse (10/1000μs) | Voltage - Clamping (Max) @ Ipp | Architecture | Data Bus Width | Voltage - Reverse Standoff (Typ) | Number of Inputs | Seated Height-Max | Unidirectional Channels | Programmable Logic Type | Voltage - Zener (Nom) (Vz) | Product Type | Protocol | Includes | Capacitance @ Frequency | Screening Level | Power - Output | Speed Grade | RF Family/Standard | Absolute Pull Range (APR) | Sensitivity | Data Rate (Max) | Primary Attributes | Serial Interfaces | Current - Receiving | Current - Transmitting | Number of Logic Cells | Modulation | Number of Cores | GPIO | Flash Size | Features | Product Category | Device Core | Height | Height Seated (Max) | Length | Width | Contact Finish Thickness - Mating | Material Flammability Rating | Ratings |
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 | Mfr Part No XCZU48DR-1FSVG1517E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | 1.8/2.5/3.3 V | RISC | Yes | AMD | Surface Mount | 6 | 561 | Tray | Active | 0 to 100 °C | Zynq® UltraScale+™ RFSoC | 1517 | 110, 230 V | CAN/Serial I2C/SPI/U | 500MHz, 1.2GHz | 256 KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 64 Bit | Extended | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ARM Cortex-A53/ARM Cortex-R5 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS250T-FCSG536EES | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | 536-LFBGA | Microchip Technology | MCU - 136, FPGA - 372 | Tray | Active | 0°C ~ 100°C | PolarFire™ | - | 2.2MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-FGG484 | Microchip | Datasheet | 85 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | M2S060 | Microchip Technology / Atmel | 64 kB | 60 | - | - | Microchip | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | 267 | 4710 LAB | 56520 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | SmartFusion2 | 1.2 V | 0 to 85 °C | Tray | SmartFusion2 | SOC - Systems on a Chip | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | STD | FPGA - 60K Logic Modules | 1 Core | 256KB | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-FG484 | Microchip | Datasheet | 2393 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | M2S060 | 64 kB | - | - | 166 MHz | Microchip Technology | 267 | 56520 LE | Tray | Active | Non-Compliant | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No ATWINC1500B-MU-Y042 | Microchip | Datasheet | 640 | - | Min: 1 Mult: 1 | Surface Mount | QFN-40 | YES | 40-QFN (5x5) | 40 | ATWINC1500 | Microchip Technology / Atmel | 48 MHz | 64 kB, 128 kB | RAM | 490 | MICROCHIP TECHNOLOGY INC | I2C, SPI, UART | Microchip | ATWINC1500B-MU-Y042 | 48 MHz | 72.2 Mbps | + 85 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | HQCCN | VQFN-40 | LCC40,.2SQ,16 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | Active | 5.06 | 61 mA | 268 mA | 4.2 V | 2.7 V | 3.3 V | -40°C ~ 85°C | Tray | - | Wi-Fi | Wireless & RF Integrated Circuits | Si | 2.7V ~ 3.6V | QUAD | NO LEAD | 0.4 mm | compliant | 2.4GHz | S-PQCC-N40 | 2.4 GHz | INDUSTRIAL | 4MB Flash, 128kB ROM, 224kB RAM | NETWORK CONTROLLER | Flash | 4 MB | 18.5 dBm | 32 bit | 1 mm | RF System on a Chip - SoC | 802.11b/g/n | 20.5dBm | WiFi | - 74 dBm | 72.2Mbps | I²C, SDIO, SPI, UART | 22mA ~ 58.5mA | 22mA ~ 294mA | CCK, DSSS, OFDM | 9 | RF System on a Chip - SoC | 0.85 mm | 5 mm | 5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 71M6512-IM/F | Maxim Integrated | Datasheet | - | - | Min: 1 Mult: 1 | TERIDIAN SEMICONDUCTOR CORP | 71M6512-IM/F | Transferred | 5.6 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA014R24C2I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | DO-218AC | DO-218AC | -- | Intel | 744 | Tray | Active | -55°C ~ 175°C (TJ) | Automotive, AEC-Q101, PAR® | Active | Zener | Automotive | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | No | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 16.7V | 3600W (3.6kW) | 148A | 24.4V | MPU, FPGA | 15V | 1 | -- | FPGA - 1.4M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No NRF5340-QKAA-AB0-R | Nordic | Datasheet | - | - | Min: 1 Mult: 1 | PEI-Genesis | Bulk | Active | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPF050-1FG896M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | - | Circular | Aluminum | - | D38999/26WF | 20 | Amphenol Aerospace Operations | Bulk | Active | -65°C ~ 175°C | Military, MIL-DTL-38999 Series III, Tri-Start™ TV | Plug Housing | For Female Sockets | 32 | Threaded | Crimp | A | Shielded | Environment Resistant | Cadmium | 19-32 | Olive Drab | Contacts Not Included | F | - | Coupling Nut, Self Locking | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-L1FFVB1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU11 | Knowles Syfer | 488 | Tape & Reel (TR) | Active | -40°C ~ 100°C (TJ) | * | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LS1046AAE3T1A | Teledyne LeCroy | Datasheet | - | - | Min: 1 Mult: 1 | Glenair | Retail Package | Active | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z007S-1CLG400C | AMD | Datasheet | 119 | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | 400-LFBGA, CSPBGA | - | Thermoplastic | 400-CSPBGA (17x17) | Thermoplastic | Thermoplastic | XC7Z007 | Gold | Copper Alloy | Conxall/Switchcraft | 100 | Bulk | Plastic | Active | 600VAC/DC | -40°C ~ 85°C | Multi-Con-X®, Insta-Click™ | Solder Cup | Plug, Male Pins | 4 | Black | - | Bayonet Lock | Varies by Wire Gauge | Keyed | Unshielded | IP67 - Dust Tight, Waterproof | - | - | 667MHz | 256KB | - | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 0.280 ~ 0.290 (7.11mm ~ 7.37mm) | MCU, FPGA | Artix™-7 FPGA, 23K Logic Cells | - | Backshell, UV Resistant | - | UL94 HB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU15EG-2FFVB1156I | AMD | Datasheet | 792 |
| Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 1156-FCBGA (35x35) | XCZU15 | SiTime | 328 | Tape & Reel (TR) | Active | -40°C ~ 85°C | SiT8208 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | XO (Standard) | 2.5V | 66.666 MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 33mA | 31mA | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | 0.031 (0.80mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-L2FFVC1760E | AMD | Datasheet | 649 |
| Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | XCZU19 | PEI-Genesis | 512 | Bulk | Active | 0°C ~ 100°C (TJ) | * | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA022R24C2E1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | Non-Compliant | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS066H1F34I1HG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel / Altera | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066H1F34I1HG | 1.2 GHz | + 100 C | KYOCERA AVX | - 40 C | Yes | SMD/SMT | 492 | 82500 LAB | 660000 LE | Bulk | 973529 | Active | Active | 5.66 | Details | Yes | This product may require additional documentation to export from the United States. | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | * | Active | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 660K Logic Elements | 2 Core | -- | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS066K2F40E1HG | ALTERA | Datasheet | 543 |
| Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FBGA (40x40) | KJB0T | Intel / Altera | - | 21 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066K2F40E1HG | 1.2 GHz | + 100 C | ITT Cannon, LLC | 0 C | Yes | SMD/SMT | 696 | 82500 LAB | 660000 LE | Bulk | 965026 | Active | Active | 5.66 | Details | Yes | This product may require additional documentation to export from the United States. | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | * | Active | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 660K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS066H2F34I2SG | ALTERA | Datasheet | 658 |
| Min: 1 Mult: 1 | Surface Mount | 1206 (3216 Metric) | YES | 1206 | 1152 | LZ52C | Intel / Altera | - | 1 | INTEL CORP | 55 Ohms | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066H2F34I2SG | 1.2 GHz | Diodes Incorporated | Yes | SMD/SMT | 492 | 82500 LAB | 660000 LE | 100 °C | -40 °C | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 973532 | Active | Last Time Buy | NOT SPECIFIED | 5.46 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -65°C ~ 175°C (TJ) | Tray | - | ±2% | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 492 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | 100 nA @ 15 V | 1.5 V @ 200 mA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500 mW | MCU, FPGA | 492 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | 20 V | SoC FPGA | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS048H4F34I3LG | ALTERA | Datasheet | 795 |
| Min: 1 Mult: 1 | Surface Mount | HC-49/US | YES | 1152 | INTEL CORP | Intel Corporation | 10AS048H4F34I3LG | Suntsu Electronics, Inc. | 492 | 100 °C | -40 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | NOT SPECIFIED | 5.47 | Yes | 0.93 V | 0.87 V | 0.9 V | -20°C ~ 70°C | Tray | SXTHM2 | 0.524 L x 0.197 W (13.30mm x 5.00mm) | Active | MHz Crystal | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 30 MHz | ±50ppm | S-PBGA-B1152 | 492 | Not Qualified | 30 Ohms | 0.9 V | INDUSTRIAL | 18pF | 1.5GHz | 256KB | Fundamental | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | ±20ppm | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 480K Logic Elements | 480000 | -- | 0.177 (4.50mm) | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX250LU2F50E2VG | ALTERA | Datasheet | 709 |
| Min: 1 Mult: 1 | PEI-Genesis | 704 | Bulk | Active | 0°C ~ 100°C (TJ) | Tray | * | Active | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2500K Logic Elements | -- |
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XCZU48DR-1FSVG1517E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MPFS250T-FCSG536EES
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060-FGG484
Microchip
Package:Embedded - System On Chip (SoC)
109.127498
-
M2S060-FG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
ATWINC1500B-MU-Y042
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
71M6512-IM/F
Maxim Integrated
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA014R24C2I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
NRF5340-QKAA-AB0-R
Nordic
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MPF050-1FG896M
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU11EG-L1FFVB1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
LS1046AAE3T1A
Teledyne LeCroy
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z007S-1CLG400C
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU15EG-2FFVB1156I
AMD
Package:Embedded - System On Chip (SoC)
7,535.837432
-
XCZU19EG-L2FFVC1760E
AMD
Package:Embedded - System On Chip (SoC)
10,250.932985
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AGFA022R24C2E1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS066H1F34I1HG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS066K2F40E1HG
ALTERA
Package:Embedded - System On Chip (SoC)
5,855.707847
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10AS066H2F34I2SG
ALTERA
Package:Embedded - System On Chip (SoC)
4,530.274549
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10AS048H4F34I3LG
ALTERA
Package:Embedded - System On Chip (SoC)
3,142.639453
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1SX250LU2F50E2VG
ALTERA
Package:Embedded - System On Chip (SoC)
16,434.281024