The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Supplier Device Package | Base Product Number | L1 Cache Data Memory | L1 Cache Instruction Memory | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Mounting Styles | Number of I/Os | Package | Product Status | Operating Temperature | Series | Operating Supply Voltage | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Data Bus Width | Primary Attributes | Number of Cores | Flash Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No XAZU2EG-1SFVC784Q | AMD | Datasheet | 587 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XAZU2 | AMD | 128 | Tray | Active | -40°C ~ 125°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 1.2GHz | 1.2MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||
| Mfr Part No AGFB027R31C3I3E | Intel | Datasheet | 575 |
| Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||
| Mfr Part No XC7Z030-3SBG485E | AMD | Datasheet | 1808 |
| Min: 1 Mult: 1 | 484-FBGA, FCBGA | 484-FCBGA (19x19) | XC7Z030 | AMD | 130 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq®-7000 | 1GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - | ||||||||||
| Mfr Part No AGFB022R24C3E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||
| Mfr Part No XCVC1802-2LLEVSVA2197 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD Xilinx | 770 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||
| Mfr Part No XCVM1802-1MSEVSVD1760 | Xilinx | Datasheet | 2400 | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD Xilinx | 726 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||
| Mfr Part No AGIB022R31B1E1V | Intel | Datasheet | 673 |
| Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||
| Mfr Part No AGFA022R25A2I3E | Intel | Datasheet | 768 |
| Min: 1 Mult: 1 | - | - | Intel | 624 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||
| Mfr Part No XCVM1802-2MLEVFVC1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | + 110 C | AMD Xilinx | 0 C | 500 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 800 mV | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||
| Mfr Part No XCZU4CG-L1FBVB900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU4 | AMD | 204 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | ||||||||||
| Mfr Part No XCVM1502-2MSEVSVA2197 | AMD | Datasheet | 659 |
| Min: 1 Mult: 1 | AMD | Tray | Active | * | |||||||||||||||||||||||
| Mfr Part No XCVP1502-2LSEVSVA3340 | AMD | Datasheet | 640 | - | Min: 1 Mult: 1 | 3340-BFBGA | 3340-BGA (55x55) | AMD | 486 | Tray | Active | 0°C ~ 100°C (TJ) | Versal® Premium | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Premium FPGA, 3.7M Logic Cells | - | |||||||||||
| Mfr Part No 1SX040HH1F35E1VG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 374 | Tray | Active | 0°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 400K Logic Elements | - | |||||||||||
| Mfr Part No XCVC1702-2MLENSVG1369 | AMD | Datasheet | 406 |
| Min: 1 Mult: 1 | AMD | Tray | Active | * | |||||||||||||||||||||||
| Mfr Part No 1SX040HH1F35I2VG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 374 | Tray | Active | -40°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 400K Logic Elements | - | |||||||||||
| Mfr Part No MPFS095T-FCSG325T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 325-TFBGA | 325-BGA (11x11) | Microchip Technology | MCU - 102, FPGA - 80 | Tray | Active | -40°C ~ 125°C (TJ) | - | - | 857.6KB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 128KB | |||||||||||
| Mfr Part No XCVP1502-2LSEVSVA2785 | AMD | Datasheet | 762 |
| Min: 1 Mult: 1 | 2785-BFBGA | 2785-BGA (50x50) | AMD | 702 | Tray | Active | 0°C ~ 100°C (TJ) | Versal® Premium | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Premium FPGA, 3.7M Logic Cells | - | |||||||||||
| Mfr Part No TDA4VE88TGAALZRQ1 | Texas Instruments | Datasheet | 2160 |
| Min: 1 Mult: 1 | 770-BFBGA, FCBGA | 770-FCBGA (23x23) | 32 kB | 48 kB | 12.5 MHz | + 125 C | Texas Instruments | - 40 C | SMD/SMT | 155 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Active | -40°C ~ 125°C (TJ) | Automotive, AEC-Q100 | 1.71 V to 1.89 V | 2GHz, 1GHz, 1GHz | 2MB | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | DMA, PWM, WDT | MCAN, MMC/SD/SDIO, I²C, SPI, UART, USB | DSP, MCU, MPU | 64 bit | - | 3 Core | - | ||
| Mfr Part No 1SX040HH2F35I2VG | Intel | Datasheet | 472 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 374 | Tray | Active | -40°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 400K Logic Elements | - | |||||||||||
| Mfr Part No XC7Z035-2FFV676E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | AMD | 130 | Bulk | Obsolete | 0°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 275K Logic Cells | - |
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XAZU2EG-1SFVC784Q
AMD
Package:Embedded - System On Chip (SoC)
768.794083
-
AGFB027R31C3I3E
Intel
Package:Embedded - System On Chip (SoC)
26,165.458344
-
XC7Z030-3SBG485E
AMD
Package:Embedded - System On Chip (SoC)
494.365770
-
AGFB022R24C3E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1802-2LLEVSVA2197
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1802-1MSEVSVD1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGIB022R31B1E1V
Intel
Package:Embedded - System On Chip (SoC)
36,307.691572
-
AGFA022R25A2I3E
Intel
Package:Embedded - System On Chip (SoC)
23,001.907196
-
XCVM1802-2MLEVFVC1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU4CG-L1FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1502-2MSEVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
7,876.351459
-
XCVP1502-2LSEVSVA3340
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
1SX040HH1F35E1VG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1702-2MLENSVG1369
AMD
Package:Embedded - System On Chip (SoC)
22,340.096368
-
1SX040HH1F35I2VG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MPFS095T-FCSG325T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVP1502-2LSEVSVA2785
AMD
Package:Embedded - System On Chip (SoC)
31,820.048093
-
TDA4VE88TGAALZRQ1
Texas Instruments
Package:Embedded - System On Chip (SoC)
135.263434
-
1SX040HH2F35I2VG
Intel
Package:Embedded - System On Chip (SoC)
3,054.170413
-
XC7Z035-2FFV676E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire