The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Core | Data Converters | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Part Status | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Memory Size | Operating Supply Current | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | Core Processor | Peripherals | Program Memory Type | Core Size | Program Memory Size | Connectivity | Data Rate | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | EEPROM Size | Number of Gates | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Product Category | Length | Width |
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 | Mfr Part No CY8C4126LQS-S453T | Infineon | Datasheet | 5 |
| Min: 1 Mult: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | Infineon Technologies | A/D 16x10b, 20x12b SAR | 2500 | Infineon | Infineon Technologies | Yes | 34 | Tape & Reel (TR) | Active | Details | -40°C ~ 105°C (TA) | Reel | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | Internal | 24MHz | 8K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT | FLASH | 32-Bit | 64KB (64K x 8) | I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No CY8C4147LQE-S263 | Infineon | Datasheet | 32 |
| Min: 1 Mult: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | CY8C4147 | Infineon Technologies | A/D 16x10b, 20x12b SAR | 4900 | Infineon | Infineon Technologies | Yes | 34 | Tray | Active | Details | -40°C ~ 125°C (TA) | Tray | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | External, Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, DMA, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 128KB (128K x 8) | FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS066K3F40E2SG | ALTERA | Datasheet | 571 | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066K3F40E2SG | 1.2 GHz | Yes | SMD/SMT | 696 | 82500 LAB | 660000 LE | 100 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | 973542 | Active | 5.46 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0.176370 oz | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 660K Logic Elements | 2 Core | -- | SoC FPGA | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS048E3F29E2LG | ALTERA | Datasheet | 625 |
| Min: 1 Mult: 1 | FBGA-780 | Intel / Altera | - | 2 x 32 kB | 2 x 32 kB | Intel | 1.2 GHz | SMD/SMT | 360 | 60000 LAB | 480000 LE | 973488 | Arria 10 SoC | 0.176370 oz | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | SOC - Systems on a Chip | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 480K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX065HH3F35E3VG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 392 | Tray | Active | 0°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 650K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA014R24C3I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA027R24C3I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB022R25A3E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 624 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA012R24B2E3V | Intel | Datasheet | 563 |
| Min: 1 Mult: 1 | - | - | Intel | 768 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC5C6U23C6N | ALTERA | Datasheet | 2154 |
| Min: 1 Mult: 1 | 672-FBGA | YES | 672 | 672-UBGA (23x23) | 672 | INTEL CORP | Intel Corporation | 5CSXFC5C6U23C6N | MCU - 181, FPGA - 145 | 85 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 2.07 | Compliant | Yes | FPGA - Field Programmable Gate Array Cyclone V SX dual -core ARM Cortex-A9 | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SX | Active | 85 °C | 0 °C | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 5CSXFC5 | S-PBGA-B672 | 145 | Not Qualified | 1.13 V | 1.1,1.2/3.3,2.5 V | OTHER | 556.3 kB | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3.125 Gbps | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | 85000 | 800 MHz | 32075 | 6 | 6 | FPGA - 85K Logic Elements | 85000 | -- | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA027R31C2I2V | Intel | Datasheet | 515 |
| Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM2202-1LSEVSVC2197 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 100 C | 0 C | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-1LSINBVB1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | Xilinx | 1 | Xilinx | + 110 C | AMD Xilinx | - 40 C | 424 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | SOC - Systems on a Chip | 700 mV | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | System-On-Modules - SOM | Versal™ Prime FPGA, 1.2M Logic Cells | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-2MSENBVB1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | Xilinx | 1 | Xilinx | + 110 C | AMD Xilinx | 0 C | 424 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | SOC - Systems on a Chip | 800 mV | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | System-On-Modules - SOM | Versal™ Prime FPGA, 1.2M Logic Cells | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-2HSINBVB1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | Xilinx | 1 | Xilinx | + 110 C | AMD Xilinx | - 40 C | 424 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | SOC - Systems on a Chip | 880 mV | 800MHz, 1.65GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | System-On-Modules - SOM | Versal™ Prime FPGA, 1.2M Logic Cells | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1FG484 | Microchip Technology | Datasheet | 1948 |
| Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | A2F200 | ARM Cortex M3 | 64 kB | 60 | - | - | 100 MHz | + 85 C | Microchip Technology | 0 C | Yes | SMD/SMT | 161 I/O | - | 2000 LE | Tray | Active | N | SmartFusion | 0°C ~ 85°C (TJ) | Tray | A2F200 | 1 mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 256 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 200000 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1CSG288 | Microchip Technology | Datasheet | 21 | - | Min: 1 Mult: 1 | 288-TFBGA, CSPBGA | YES | 288-CSP (11x11) | 288 | A2F200 | 100 MHz | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | A2F200M3F-1CSG288 | 100 MHz | Microchip Technology | Yes | 3 | MCU - 31, FPGA - 78 | - | 2000 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA288,21X21,20 | BGA288,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.24 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 0°C ~ 85°C (TJ) | Tray | A2F200 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | S-PBGA-B288 | 78 | Not Qualified | 1.5,1.8,2.5,3.3 V | OTHER | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 256 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 78 | 4608 CLBS, 200000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 1 Core | 200000 | 256KB | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090-FG676 | Microchip Technology | Datasheet | 2180 |
| Min: 1 Mult: 1 | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S090 | ARM Cortex M3 | 64 kB | 40 | MICROSEMI CORP | - | - | M2S090-FG676 | 166 MHz | Microchip Technology | Yes | 3 | 425 | 7193 LAB | 86316 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.83 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-1FG484I | Microchip Technology | Datasheet | 1723 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | M2S060 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | 267 | 4710 LAB | 56520 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion2 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150TS-FCS536I | Microchip Technology | Datasheet | 2359 | - | Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | M2S150 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S150TS-FCS536I | 166 MHz | Microchip Technology | Yes | 293 | 12177 LAB | 146124 LE | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | e0 | No | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | not_compliant | 536 | S-PBGA-B536 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 150K Logic Modules | 1 Core | 512KB |
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CY8C4126LQS-S453T
Infineon
Package:Embedded - System On Chip (SoC)
6.508261
-
CY8C4147LQE-S263
Infineon
Package:Embedded - System On Chip (SoC)
6.358230
-
10AS066K3F40E2SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS048E3F29E2LG
ALTERA
Package:Embedded - System On Chip (SoC)
3,317.347428
-
1SX065HH3F35E3VG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA014R24C3I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA027R24C3I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB022R25A3E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA012R24B2E3V
Intel
Package:Embedded - System On Chip (SoC)
8,020.532645
-
5CSXFC5C6U23C6N
ALTERA
Package:Embedded - System On Chip (SoC)
330.879956
-
AGFA027R31C2I2V
Intel
Package:Embedded - System On Chip (SoC)
32,530.552896
-
XCVM2202-1LSEVSVC2197
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1402-1LSINBVB1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1402-2MSENBVB1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1402-2HSINBVB1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F200M3F-1FG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
109.460227
-
A2F200M3F-1CSG288
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090-FG676
Microchip Technology
Package:Embedded - System On Chip (SoC)
328.881545
-
M2S060-1FG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150TS-FCS536I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire