The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
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- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Package / Case | Supplier Device Package | Material | Weight | Manufacturer Lifecycle Status | Mfr | Number of I/Os | Package | Product Status | RoHS | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Number of Terminations | Temperature Coefficient | Type | Resistance | Composition | Color | Applications | Power (Watts) | Voltage - Supply | Base Part Number | Output | Failure Rate | Number of Channels | Interface | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Current - Supply | Architecture | Input | Data Rate (Max) | Primary Attributes | Delay Time | Flash Size | Capacitance - Input | Features | Signal Conditioning | Height | Height Seated (Max) | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No XCVE1752-1LSEVSVA2197 | AMD | Datasheet | 771 | - | Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 608 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-2LSENSVF1369 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 424 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-2MLINBVB1024 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1024-BFBGA | 1024-BGA (31x31) | AMD | 316 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-2MLIVFVC1596 | AMD | Datasheet | 478 |
| Min: 1 Mult: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 748 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU57DR-1FSVE1156I | AMD | Datasheet | 496 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | - | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC DR | 500MHz, 1.2GHz | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq® UltraScale+™ RFSoC | - | |||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-1MSIVFVC1596 | AMD | Datasheet | 476 |
| Min: 1 Mult: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 532 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-2MSENSVF1369 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete (Last Updated: 2 years ago) | 1369-BFBGA | 1369-BGA (35x35) | 5.800001 g | OBSOLETE (Last Updated: 2 years ago) | AMD | 424 | Tray | Active | Compliant | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | 8.382 mm | 22.86 mm | 21.082 mm | ||||||||||||||||||||||||||||
| Mfr Part No XCZU42DR-L2FFVE1156I | AMD | Datasheet | 786 | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 366 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | CAN/Serial I2C/SPI/U | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 489K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU1CG-2UBVA494E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 494-WFBGA, FCBGA | 494-FCBGA (14x14) | AMD | 82 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.333GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | Zynq®UltraScale+™ FPGA, 81K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE1752-1LSINSVG1369 | AMD | Datasheet | 662 | - | Min: 1 Mult: 1 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 8-TSSOP | AMD | 500 | Tray | Active | -40°C ~ 85°C | Tape & Reel (TR) | -- | Obsolete | Buffer, ReDriver | I²C - Hotswap | 2.7 V ~ 5.5 V | PCA9510 | 2-Wire Bus | 1 | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 6mA | MPU, FPGA | 2-Wire Bus | 400kHz | Versal™ AI Core FPGA, 1M Logic Cells | -- | - | 1.9pF | -- | |||||||||||||||||||||
| Mfr Part No XCVM1802-1MLIVSVA2197 | AMD | Datasheet | 469 |
| Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | Tray | Active | -40°C ~ 100°C (TJ) | * | Active | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-2MLENSVF1369 | AMD | Datasheet | 740 |
| Min: 1 Mult: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 316 | Tray | Active | 0°C ~ 100°C (TJ) | * | Active | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE1752-2LLEVSVA2197 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Axial, Radial Bend | Panasert | AMD | 608 | Tray | Active | -55°C ~ 155°C | Tape & Reel (TR) | CF | 0.091 Dia x 0.236 L (2.30mm x 6.00mm) | ±5% | Active | 2 | 0/ -400ppm/°C | 100 Ohms | Carbon Film | 0.25W, 1/4W | -- | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | Flame Retardant Coating, Safety | -- | |||||||||||||||||||||||
| Mfr Part No XCVM1302-1LLIVFVC1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Axial, Radial Bend | Panasert | AMD | 532 | Tray | Active | -55°C ~ 155°C | Tape & Reel (TR) | CF | 0.091 Dia x 0.236 L (2.30mm x 6.00mm) | ±5% | Active | 2 | 0/ -400ppm/°C | 16 Ohms | Carbon Film | 0.25W, 1/4W | -- | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | Flame Retardant Coating, Safety | -- | |||||||||||||||||||||||
| Mfr Part No LS1046AMN3T1A-N2 | Teledyne LeCroy | Datasheet | - | - | Min: 1 Mult: 1 | Axial, Radial Bend | Axial | -55°C ~ 155°C | Tape & Reel (TR) | RNF | 0.093 Dia x 0.250 L (2.35mm x 6.35mm) | ±1% | Active | 2 | ±100ppm/°C | 43.2 kOhms | Metal Film | 0.25W, 1/4W | -- | Flame Retardant Coating, Safety | -- | |||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1702-2LSENSVG1369 | AMD | Datasheet | 700 | - | Min: 1 Mult: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 500 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-1LSINSVF1369 | AMD | Datasheet | 477 |
| Min: 1 Mult: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 424 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1802-1MLIVSVD1760 | AMD | Datasheet | 788 |
| Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 726 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-2MSIVSVD1760 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 692 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-1MSIVSVA2197 | AMD | Datasheet | 575 |
| Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | Metal, Steel | AMD | 770 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | Grey | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - |
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XCVE1752-1LSEVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1402-2LSENSVF1369
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1302-2MLINBVB1024
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1402-2MLIVFVC1596
AMD
Package:Embedded - System On Chip (SoC)
9,310.244360
-
XCZU57DR-1FSVE1156I
AMD
Package:Embedded - System On Chip (SoC)
14,834.919703
-
XCVM1302-1MSIVFVC1596
AMD
Package:Embedded - System On Chip (SoC)
3,835.320946
-
XCVM1402-2MSENSVF1369
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU42DR-L2FFVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU1CG-2UBVA494E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVE1752-1LSINSVG1369
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1802-1MLIVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
13,655.735875
-
XCVM1302-2MLENSVF1369
AMD
Package:Embedded - System On Chip (SoC)
5,061.719488
-
XCVE1752-2LLEVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1302-1LLIVFVC1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
LS1046AMN3T1A-N2
Teledyne LeCroy
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1702-2LSENSVG1369
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1402-1LSINSVF1369
AMD
Package:Embedded - System On Chip (SoC)
8,192.450003
-
XCVM1802-1MLIVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
13,184.762955
-
XCVC1902-2MSIVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1902-1MSIVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
29,496.538218