The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Supplier Device Package | Material Type | Approvals | Base Product Number | Insulation Class | Manufacturer | Manufacturer Part Number | Mfr | Mounting | Number of I/Os | Package | Product Status | Supplier Package | Operating Temperature | Series | Size / Dimension | Part Status | Type | Applications | Voltage - Supply | Frequency | Frequency Stability | Output | Pin Count | Function | Base Resonator | Current - Supply (Max) | Speed | RAM Size | Core Processor | Peripherals | Spread Spectrum Bandwidth | Connectivity | Architecture | Adhesive | Legend | Absolute Pull Range (APR) | Primary Attributes | Quantity | Background Color | VA Rating | Flash Size | Text Color | Language | Phase | Height Seated (Max) | Ratings |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No AGFA022R25A2I2V | Intel | Datasheet | 508 |
| Min: 1 Mult: 1 | - | - | Intel | 624 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z030-1FBG676I | AMD | Datasheet | 2111 |
| Min: 1 Mult: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | XC7Z030 | AMD | 130 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq®-7000 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - | |||||||||||||||||||||||||||||||||
| Mfr Part No BCM3384GUIFSBGB0T | Broadcom | Datasheet | - | - | Min: 1 Mult: 1 | BCM3384 | Broadcom Limited | Tray | Active | * | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA014R24B1I1V | Intel | Datasheet | 475 |
| Min: 1 Mult: 1 | - | - | Brady | 101980 | Intel | 768 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||
| Mfr Part No SC1201UFH-266B | AMD | Datasheet | 38 | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 481-BGA (40x40) | SiTime | Surface Mount | 27 | Strip | Active | BGA | -40°C ~ 85°C | SiT1602B | 0.098 L x 0.079 W (2.50mm x 2.00mm) | XO (Standard) | 2.25V ~ 3.63V | 31.25 MHz | ±50ppm | HCMOS, LVCMOS | 481 | Enable/Disable | MEMS | 4.5mA | 266MHz | - | X86 | AC97/AMC97, DMA, PCI, SmartCard, WDT | - | Access.bus, GPIO, PC/AT, UART | MPU | - | - | - | 0.031 (0.80mm) | - | |||||||||||||||||
| Mfr Part No AGFA014R24C2E2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS460TS-1FCG1152IPP | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | Microchip Technology | MCU - 136, FPGA - 468 | Tray | Active | -40°C ~ 100°C | * | Active | - | 3.95MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 461K Logic Modules | 128kB | |||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3CG-2SFVC784I | AMD | Datasheet | 475 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU3 | AMD | 252 | Bulk | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EG-1SFVC784E | AMD | Datasheet | 657 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU4 | AMD | 252 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | |||||||||||||||||||||||||||||||||
| Mfr Part No AGFA014R24C2E3VAA | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB006R24C2I2V | Intel | Datasheet | 540 |
| Min: 1 Mult: 1 | - | - | Intel | 576 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | ||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EV-1FBVB900E | AMD | Datasheet | 596 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU7 | AMD | 204 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||
| Mfr Part No AGFA019R25A2E4F | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Murrelektronik | 4627151 | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | ||||||||||||||||||||||||||||||||
| Mfr Part No AGFA006R24C2E4X | Intel | Datasheet | 656 |
| Min: 1 Mult: 1 | - | - | CSA, UL | Class H | Hammond Power Solutions | C1F007WES | Intel | Wall | 576 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | Distribution | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | 7,500 VA | - | 1 | ||||||||||||||||||||||||||
| Mfr Part No AGFB008R24C3E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 576 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | ||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1502-2MLINSVG1369 | AMD | Datasheet | 412 |
| Min: 1 Mult: 1 | AMD | 478 | Tray | Active | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 800k Logic Cells | - | |||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-2LSEVSVA2197 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | Miscellaneous | AMD | 770 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5EG-L2FBVB900E | AMD | Datasheet | 515 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | Plastic | XCZU5 | Brady | 41700 | AMD | 204 | Tray | Not For New Designs | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | Pipe & Valve Marking | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | No | Air | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | 0 | Green | - | White | English | |||||||||||||||||||||||
| Mfr Part No XCZU17EG-3FFVE1924E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1924-BBGA, FCBGA | 1924-FCBGA (45x45) | XCZU17 | AMD | 668 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | |||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1802-1MLIVSVD1760 | AMD | Datasheet | 788 |
| Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 726 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - |
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AGFA022R25A2I2V
Intel
Package:Embedded - System On Chip (SoC)
22,937.686930
-
XC7Z030-1FBG676I
AMD
Package:Embedded - System On Chip (SoC)
371.207897
-
BCM3384GUIFSBGB0T
Broadcom
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA014R24B1I1V
Intel
Package:Embedded - System On Chip (SoC)
16,612.387600
-
SC1201UFH-266B
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA014R24C2E2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MPFS460TS-1FCG1152IPP
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU3CG-2SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
683.556015
-
XCZU4EG-1SFVC784E
AMD
Package:Embedded - System On Chip (SoC)
970.325211
-
AGFA014R24C2E3VAA
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB006R24C2I2V
Intel
Package:Embedded - System On Chip (SoC)
9,785.772523
-
XCZU7EV-1FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
2,600.788377
-
AGFA019R25A2E4F
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA006R24C2E4X
Intel
Package:Embedded - System On Chip (SoC)
10,156.141135
-
AGFB008R24C3E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1502-2MLINSVG1369
AMD
Package:Embedded - System On Chip (SoC)
22,933.998494
-
XCVC1802-2LSEVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU5EG-L2FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
3,260.740224
-
XCZU17EG-3FFVE1924E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1802-1MLIVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
13,184.762955