The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Antenna Connector Type | Base Product Number | Brand | Cable Types | Case Code - in | Case Code - mm | Center Frequency | Data Converters | Data RAM Size | Dissipation Factor DF | Duty Cycle - Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mechanical Style | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Protocol - Sub GHz | Protocol - WiFi - 802.11 | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Voltage Rating DC | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Number of Terminations | Termination | Temperature Coefficient | Type | Resistance | Composition | Applications | Power (Watts) | HTS Code | Capacitance | Subcategory | Power Rating | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Style | Reach Compliance Code | Current Rating | Frequency | Frequency Stability | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Failure Rate | Lead Spacing | Power Supplies | Temperature Grade | Ripple Current | Test Frequency | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | Core Processor | Peripherals | Program Memory Type | Core Size | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | ESR | Gain | EEPROM Size | Output Format | Primary Attributes | Number of Bands | Number of Logic Cells | Number of Cores | Flash Size | Product | Features | Product Category | Diameter | Height | Height Seated (Max) | Length | Width | Ratings |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No 10AS066K1F35E1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | QL3P41 | INTEL CORP | Intel Corporation | 10AS066K1F35E1SG | Broadcom Limited | 396 | 100 °C | Bulk | PLASTIC/EPOXY | BGA | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | SQUARE | GRID ARRAY | Obsolete | Obsolete | 5.66 | Yes | 0.93 V | 0.87 V | 0.9 V | 0°C ~ 100°C (TJ) | Tray | - | Discontinued at Digi-Key | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | -- | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX250LU2F50I2LG | ALTERA | Datasheet | 665 |
| Min: 1 Mult: 1 | Surface Mount | 52-TQFP | 52-TQFP (10x10) | ML620Q156 | A/D 12x10b SAR | Rohm Semiconductor | 34 | Bulk | Last Time Buy | -40°C ~ 105°C (TA) | Tray | - | Active | External, Internal | 8.4MHz | 2K x 8 | 1.8V ~ 5.5V | nX-U16/100 | POR, PWM, WDT | FLASH | 16-Bit | 64KB (32K x 16) | I²C, SSP, UART/USART | MCU, FPGA | 2K x 8 | FPGA - 2500K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS048H3F34I2LG | ALTERA | Datasheet | 730 |
| Min: 1 Mult: 1 | 0603 (1608 Metric) | YES | 0603 | 1152 | SG731J | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS048H3F34I2LG | 1.2 GHz | KOA Speer Electronics, Inc. | Yes | SMD/SMT | 492 | 60000 LAB | 480000 LE | 100 °C | -40 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965303 | Active | Active | NOT SPECIFIED | 5.47 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -55°C ~ 155°C | Tray | SG73 | 0.063 L x 0.031 W (1.60mm x 0.80mm) | ±20% | Active | 2 | ±200ppm/°C | 18 Ohms | Thick Film | 0.1W, 1/10W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 492 | Not Qualified | - | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 480K Logic Elements | 480000 | 2 Core | -- | Automotive AEC-Q200, Moisture Resistant, Pulse Withstanding | SoC FPGA | 0.022 (0.55mm) | 35 mm | 35 mm | AEC-Q200 | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1702-2LLEVSVA2197 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 608 | Tray | Active | Yes | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1802-2LLIVSVA2197 | AMD | Datasheet | 647 |
| Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 648 | Tray | Active | Yes | -40°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z007S-2CLG225E | AMD | Datasheet | 11 |
| Min: 1 Mult: 1 | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) | - | XC7Z007 | TE Connectivity / Laird External Antennas | - | 460 MHz | 1 | TE Connectivity | Whip | AMD | Magnetic Mount | 54 | Tray | Active | UHF | - | 0°C ~ 100°C (TJ) | QW | Passive Antenna | Mobile Antennas | Antennas | Straight with Base | - | 766MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | GPS Antennas - GNSS, GLONASS, Galileo, Beidou | Unity | Artix™-7 FPGA, 23K Logic Cells | 1 Band | - | Outdoor Antennas | Antennas | 6 in | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB008R24C3E4X | Intel | Datasheet | 515 |
| Min: 1 Mult: 1 | - | - | ITT Cannon | 1 | ITT Cannon | Intel | 576 | Tray | Active | 0°C ~ 100°C (TJ) | KPT | D-Sub Connectors | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | D-Sub Connectors - Standard Density | FPGA - 764K Logic Elements | - | D-Sub Standard Connectors | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB006R24C2E1V | Intel | Datasheet | 752 |
| Min: 1 Mult: 1 | - | - | Welwyn Components / TT Electronics | 2512 | 6432 | 1800 | TT Electronics | Intel | PCB Mount | 576 | Tray | Active | 0.001429 oz | 0°C ~ 100°C (TJ) | Reel | PWC | Resistors | Thick Film | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Thick Film Resistors | FPGA - 573K Logic Elements | - | - | Thick Film Resistors - SMD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA019R25A2E2V | Intel | Datasheet | 510 |
| Min: 1 Mult: 1 | - | - | KYOCERA AVX | 3000 | KYOCERA AVX | Intel | 480 | Tray | Active | Details | Accu-L | 0°C ~ 100°C (TJ) | Reel | 0603, 0805 | Inductors, Chokes & Coils | SMD/SMT | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Fixed Inductors | FPGA - 1.9M Logic Elements | - | RF Inductors | RF Inductors - SMD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB012R24B2E2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Cable | - | - | Intel | 3 | Intel | Intel | 768 | Tray | Active | Non-Compliant | 0°C ~ 100°C (TJ) | Tray | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | Intel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA023R25A2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAZU2EG-1SFVA625Q | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | XAZU2 | Vishay / Dale | 0402 | 1005 | 10000 | Vishay | + 155 C | AMD | - 55 C | PCB Mount | 128 | Tray | Active | Details | 0.000023 oz | -40°C ~ 125°C (TJ) | Reel | RCWE | 1 % | 2 Terminal | 200 PPM / C | Thick Film Surface Mount Chip Resistors | 80.6 mOhms | Current Sense | Resistors | 125 mW (1/8 W) | Thick Film | SMD/SMT | 500MHz, 1.2GHz | 1.2MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | Current Sense Resistors | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | Thick Film Resistors | Current Sense Resistors - SMD | 0.35 mm | 1.05 mm | 0.55 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU15EG-L1FFVB1156I | AMD | Datasheet | 628 | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU15 | ITT Cannon | 25 | ITT Cannon | AMD | 328 | Tray | 132041-0864 | Active | Details | -40°C ~ 100°C (TJ) | PL | Circular Connectors | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Circular Push Pull Connectors | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | Circular Push Pull Connectors | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-2LSEVSVD1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 2 Pin | 1760-FCBGA (40x40) | EPCOS / TDK | 0.2 | 160 | EPCOS / TDK | + 105 C | AMD Xilinx | - 25 C | 402 | Tray | B43641A9187M57 | Active | Details | 400 VDC | 0°C ~ 100°C (TJ) | Bulk | B43641 | 20 % | Long Life Capacitors | 180 uF | Capacitors | Snap In | 700 mV | 10 mm | 0.99 A | 100 Hz | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Electrolytic Capacitors | 520 mOhms | Versal™ Prime FPGA, 70k Logic Cells | - | General Purpose Electrolytic Capacitors | Aluminum Electrolytic Capacitors - Snap In | 22 mm | 30 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-2LSEVSVD1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 7 mm x 5 mm | 1760-FCBGA (40x40) | CTS Electronic Components | 55 % | 1000 | CTS | + 85 C | AMD Xilinx | - 40 C | 726 | Tray | Active | Details | 2.62 V | 2.37 V | 0°C ~ 100°C (TJ) | Reel | 637 | Oscillators | 45 mA | 148.35 MHz | 25 PPM | SMD/SMT | 700 mV | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Standard Oscillators | LVDS | Versal™ Prime FPGA, 1.2M Logic Cells | - | Standard Clock Oscillators | 1.7 mm | 7 mm | 5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-L2FSVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Panduit Corp | 366 | Bulk | Obsolete | -40°C ~ 100°C (TJ) | * | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-2FSVE1156E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 0805 (2012 Metric) | 0805 | RN732A | KOA Speer Electronics, Inc. | 366 | Tape & Reel (TR) | Obsolete | -55°C ~ 155°C | RN73 | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±0.5% | 2 | ±25ppm/°C | 1.18 kOhms | Thin Film | 0.1W, 1/10W | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Moisture Resistant | 0.024 (0.60mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-L2FFVG1517I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | 505433 | Molex | 561 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-1FFVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Pulse Electronics | 366 | Bulk | Obsolete | -40°C ~ 100°C (TJ) | - | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU46DR-2FSVH1760E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | BLF6 | NXP USA Inc. | 574 | Tube | Active | 0°C ~ 100°C (TJ) | * | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - |
-
10AS066K1F35E1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
1SX250LU2F50I2LG
ALTERA
Package:Embedded - System On Chip (SoC)
24,866.549277
-
10AS048H3F34I2LG
ALTERA
Package:Embedded - System On Chip (SoC)
4,067.419303
-
XCVC1702-2LLEVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1802-2LLIVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
20,486.379658
-
XC7Z007S-2CLG225E
AMD
Package:Embedded - System On Chip (SoC)
84.226174
-
AGFB008R24C3E4X
Intel
Package:Embedded - System On Chip (SoC)
10,625.057692
-
AGFB006R24C2E1V
Intel
Package:Embedded - System On Chip (SoC)
9,315.781110
-
AGFA019R25A2E2V
Intel
Package:Embedded - System On Chip (SoC)
15,432.916606
-
AGFB012R24B2E2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA023R25A2E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XAZU2EG-1SFVA625Q
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU15EG-L1FFVB1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1302-2LSEVSVD1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1402-2LSEVSVD1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU47DR-L2FSVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU47DR-2FSVE1156E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU47DR-L2FFVG1517I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU48DR-1FFVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU46DR-2FSVH1760E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire