The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Approvals | Base Product Number | Brand | Center Frequency | Clock Frequency-Max | Data RAM Size | Device Logic Gates | Device System Gates | Factory Pack QuantityFactory Pack Quantity | Frequency Aging | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | MSL | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Output Frequency | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Voltage, Rating | Operating Temperature | Packaging | Series | JESD-609 Code | Temperature Coefficient | Type | Resistance | Terminal Finish | Additional Feature | HTS Code | Subcategory | Power Rating | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Resistor Type | Reach Compliance Code | Frequency Stability | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Operating Supply Current | Load Capacitance | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Product Type | Total RAM Bits | Number of Gates | Speed Grade | Resistance Tolerance | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Repetitive Peak Reverse Voltage | Number of Equivalent Gates | Output Level | Flash Size | Product Category | Length | Width |
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 | Mfr Part No M2S005-1FGG484I | Microchip | Datasheet | 4000 | - | Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S005 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S005-1FGG484I | 166 MHz | Microchip Technology | 3 | SMD/SMT | MSL 3 - 168 hours | 209 | 6060 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.79 | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 209 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 209 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 191Kbit | 1 | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-TQ144 | Microchip | Datasheet | 2143 | - | Min: 1 Mult: 1 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | MICROSEMI CORP | Microsemi Corporation | M2S005-TQ144 | Microchip Technology | 3 | 84 | 85 °C | Tray | PLASTIC/EPOXY | LFQFP | TQFP-144 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 30 | 5.85 | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 240 | 0.5 mm | not_compliant | S-PQFP-G144 | 84 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 84 | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-VFG256I | Microchip | Datasheet | 101 | - | Min: 1 Mult: 1 | VFPBGA-256 | YES | 256-FPBGA (17x17) | 256 | M2S005 | Microchip Technology / Atmel | 64 kB | 119 | MICROSEMI CORP | - | - | Microchip | M2S005S-VFG256I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 161 | 505 LAB | 6060 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 2.4 | Details | Yes | 1.26 V | 1.14 V | 1.2 V | 50 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | 8.06 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | SOC - Systems on a Chip | 0.125 W | CMOS | BOTTOM | BALL | 250 | 0.8 mm | General Purpose | compliant | S-PBGA-B256 | 161 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 161 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | 1 | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | SoC FPGA | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-FGG484 | Microchip | Datasheet | 32 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S010 | 64 kB | - | - | 166 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | 0 C | SMD/SMT | 233 | 12084 LE | Tray | Active | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 10K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-1VFG256I | Microchip | Datasheet | 162 |
| Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | M2S005 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 161 | 6060 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-VFG400 | Microchip | Datasheet | 12 |
| Min: 1 Mult: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S005 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S005-VFG400 | 166 MHz | + 85 C | Microchip Technology | 0 C | 3 | SMD/SMT | 169 | 6060 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.28 | Yes | 1.26 V | 1.14 V | 1.2 V | 2.5, 3.3 V | 0 to 85 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 171 | Not Qualified | 1.2 V | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 171 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FGG484I | Microchip | Datasheet | 2290 |
| Min: 1 Mult: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | A2F500 | Microchip Technology / Atmel | 80 MHz | 64 kB | 60 | MICROSEMI CORP | - | - | Microchip | A2F500M3G-FGG484I | 80 MHz | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 204 I/O | - | 6000 LE | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,26X26,40 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.22 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 0.062696 oz | -40°C ~ 100°C (TJ) | Tray | A2F500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 128 | Not Qualified | 1.5 V | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | 16.5 mA | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 128 | 11520 CLBS, 500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | 500000 | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | 512KB | SoC FPGA | 23 mm | 23 mm | ||||||||||||||||||||||||||||
| Mfr Part No M2S025-VFG400 | Microchip | Datasheet | 12 | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S025 | 64 kB | - | - | 166 MHz | Microchip Technology | 207 | 27696 LE | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1FGG484 | Microchip | Datasheet | 1646 | - | Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | A2F500 | Microchip Technology / Atmel | 100 MHz | 64 kB | 60 | MICROSEMI CORP | - | - | Microchip | A2F500M3G-1FGG484 | 100 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | MCU - 41, FPGA - 128 | - | 6000 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,26X26,40 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 1.36 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 1.5000 V | 0.534969 oz | 0 to 85 °C | Tray | SmartFusion® | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 128 | Not Qualified | 1.5 V | 1.5,1.8,2.5,3.3 V | OTHER | 16.5 mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 128 | 11520 CLBS, 500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | 500000 | 1 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | 512KB | SoC FPGA | 23 mm | 23 mm | ||||||||||||||||||||||||||
| Mfr Part No M2S025-FGG484 | Microchip | Datasheet | 72 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S025 | 64 kB | - | - | 166 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | 0 C | SMD/SMT | 267 | 27696 LE | Tray | Active | 1.2000 V | 25 V | 0 to 85 °C | SmartFusion®2 | 200 ppm/°C | 6.8 | 0.05 W | General Purpose | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010T-FGG484 | Microchip | Datasheet | 20 |
| Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S010 | 64 kB | - | - | 166 MHz | + 85 C | Microchip Technology | 0 C | SMD/SMT | 233 | 12084 LE | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion®2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 10K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010TS-1VFG256I | Microchip | Datasheet | 12 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | VFPBGA-256 | 256-FPBGA (17x17) | M2S010 | Microchip Technology / Atmel | 64 kB | 119 | - | - | Microchip | 166 MHz | Microchip Technology | Yes | SMD/SMT | 138 | 1007 LAB | 12084 LE | Tray | Active | Compliant | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | SOC - Systems on a Chip | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | FPGA - 10K Logic Modules | 1 Core | 256KB | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FGG484 | Microchip | Datasheet | 2292 | - | Min: 1 Mult: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | A2F500 | Microchip Technology / Atmel | 40 MHz | 80 MHz | 64 kB | 500000 | 500000 | 60 | ±2.8(20th) ppm/Year | MICROSEMI CORP | - | - | Microchip | A2F500M3G-FGG484 | 80 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | Surface Mount | SMD/SMT | 204 I/O | - | 6000 LE | 85 °C | 40 MHz | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 1.37 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 1.5000 V | -20 to 70 °C | Tray | A2F500 | e1 | Temperature Compensated Crystal Oscillator (TCXO) | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 4.6 ppm | 10 | S-PBGA-B484 | 128 | Not Qualified | 3.0000 V | 1.5,1.8,2.5,3.3 V | OTHER | 16.5 mA | 10 pF | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 128 | 11520 CLBS, 500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | 500000 | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | Clipped Sinewave | 512KB | SoC FPGA | 23 mm | 23 mm | |||||||||||||||
| Mfr Part No M2S010S-1TQ144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | Microchip Technology | 84 | Tray | Obsolete | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No UPD72874AGC-YEB-A | Renesas | Datasheet | 34 |
| Min: 1 Mult: 1 | Renesas Electronics America Inc | Bulk | Active | * | 50 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB008R16A2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Name Brand Replacements™ | 3707-600500-NBR | Intel | 384 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA027R31C2I1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | cUL, UL | Rittal | 3336435 | Intel | 720 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFC023R25A3E3E | Intel | Datasheet | 711 |
| Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAZU2EG-L1SFVA625I | AMD | Datasheet | 1652 |
| Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | XAZU2 | AMD | 128 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 1.2GHz | 1.2MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB012R24C2I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - |
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M2S005-1FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005-TQ144
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005S-VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-FGG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005S-1VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
46.570470
-
M2S005-VFG400
Microchip
Package:Embedded - System On Chip (SoC)
73.599754
-
A2F500M3G-FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
136.616802
-
M2S025-VFG400
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-1FGG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025-FGG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010T-FGG484
Microchip
Package:Embedded - System On Chip (SoC)
93.835819
-
M2S010TS-1VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
89.661652
-
A2F500M3G-FGG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010S-1TQ144I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
UPD72874AGC-YEB-A
Renesas
Package:Embedded - System On Chip (SoC)
16.556430
-
AGFB008R16A2E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA027R31C2I1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFC023R25A3E3E
Intel
Package:Embedded - System On Chip (SoC)
14,209.180439
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XAZU2EG-L1SFVA625I
AMD
Package:Embedded - System On Chip (SoC)
498.810627
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AGFB012R24C2I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire