The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
- Organization
- Terminal Position
- Memory IC Type
- Memory Width
- Terminal Form
- Memory Density
- Surface Mount
- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | Memory IC Type | Programming Voltage | Serial Bus Type | Endurance | Data Retention Time-Min | Write Protection | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Length | Width |
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 | Mfr Part No IS25DLP512M-CMLA2-TR | Integrated Silicon Solution Inc | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No HM1-7621-2 | Intersil Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | 200 ns | INTERSIL CORP | 512 words | 64000 | 125 °C | -55 °C | CERAMIC | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | not_compliant | R-XDIP-T16 | Not Qualified | MILITARY | ASYNCHRONOUS | 0.05 mA | 64KX16 | 16 | 1048576 bit | PARALLEL | OTP ROM | |||||||||||||||||||||||||||||||||
| Mfr Part No S29GL032A90FFIR32 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 90 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Obsolete | Yes | 3.3 V | e1 | EAR99 | NOR TYPE | TIN SILVER COPPER | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 40 | R-PBGA-B64 | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 2MX16 | 1.4 mm | 16 | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | TOP | 13 mm | 11 mm | ||||||||||||||||||||||
| Mfr Part No S29GL032A90FFIR32 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 64 | 90 ns | ADVANCED MICRO DEVICES INC | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA64,8X8,40 | SQUARE | GRID ARRAY | Transferred | Yes | 3.3 V | EAR99 | NOR TYPE | 8542.32.00.51 | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B64 | Not Qualified | INDUSTRIAL | 0.06 mA | 2MX16 | 16 | 0.000005 A | 33554432 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 8,63 | 8K,64K | 4/8 words | YES | TOP | YES | |||||||||||||||||||||||||
| Mfr Part No S29AL016D90BAI02 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No N82HS641N | YAGEO Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 55 ns | PHILIPS COMPONENTS | 8192 words | 8000 | 75 °C | PLASTIC/EPOXY | , | RECTANGULAR | IN-LINE | Obsolete | 5 V | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | unknown | R-PDIP-T24 | Not Qualified | 5.25 V | COMMERCIAL EXTENDED | 4.75 V | ASYNCHRONOUS | 8KX8 | 8 | 65536 bit | PARALLEL | OTP ROM | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No N82HS641N | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 55 ns | PHILIPS SEMICONDUCTORS | 8192 words | 8000 | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP24,.6 | DIP24,.6 | RECTANGULAR | IN-LINE | Transferred | No | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T24 | Not Qualified | COMMERCIAL | 0.175 mA | 8KX8 | 8 | 65536 bit | OTP ROM | ||||||||||||||||||||||||||||||||||||
| Mfr Part No AT49LV2048A-90TI | Atmel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | ATMEL CORP | , | Obsolete | No | EAR99 | 8542.32.00.51 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL256N90TFIR13 | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 90 ns | SPANSION INC | 3 | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | LEAD FREE, MO-142EC, TSOP-56 | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP1 | Yes | 3.3 V | e3 | Yes | 3A991.B.1.A | NOR TYPE | MATTE TIN | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | unknown | 40 | 56 | R-PDSO-G56 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.09 mA | 16MX16 | 3-STATE | 1.2 mm | 16 | 0.000005 A | 268435456 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 256 | 128K | 8/16 words | YES | YES | 18.4 mm | 14 mm | ||||||||
| Mfr Part No S29GL256N90TFIR13 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 90 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | LEAD FREE, MO-142EC, TSOP-56 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | Yes | 3.3 V | e3 | EAR99 | NOR TYPE | MATTE TIN | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | 40 | R-PDSO-G56 | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.09 mA | 16MX16 | 3-STATE | 1.2 mm | 16 | 268435456 bit | PARALLEL | FLASH | 3 V | 8 | 18.4 mm | 14 mm | ||||||||||||||||||||||
| Mfr Part No S29GL256N90TFIR13 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 90 ns | ADVANCED MICRO DEVICES INC | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | Yes | 3.3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | R-PDSO-G56 | Not Qualified | INDUSTRIAL | ASYNCHRONOUS | 0.09 mA | 16MX16 | 3-STATE | 16 | 0.000005 A | 268435456 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 256 | 128K | 8/16 words | YES | YES | |||||||||||||||||||||||
| Mfr Part No MBM29F800T-90PFTN | FUJITSU Limited | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | FUJITSU LTD | 1048576 words | 1000000 | 70 °C | -20 °C | PLASTIC/EPOXY | TSOP1 | PLASTIC, TSOP1-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | No | 5 V | e0 | EAR99 | NOR TYPE | TIN LEAD | MINIMUM 100000 WRITE/ERASE CYCLES; ALSO CONFIGURABLE AS 512K X 16; AUTOMATIC WRITE | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | R-PDSO-G48 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 1MX8 | 1.2 mm | 8 | 0.000005 A | 8388608 bit | PARALLEL | FLASH | 5 V | 100000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,15 | 16K,8K,32K,64K | YES | TOP | 18.4 mm | 12 mm | ||||||||||||||
| Mfr Part No M28F220-70YN1 | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 70 ns | STMICROELECTRONICS | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | TSOP1 | 12 X 20 MM, PLASTIC, TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP | No | 5 V | e0 | EAR99 | NOR TYPE | TIN LEAD | BOTTOM BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | not_compliant | 48 | R-PDSO-G48 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.035 mA | 256KX8 | 1.2 mm | 8 | 0.000005 A | 2097152 bit | PARALLEL | FLASH | 12 V | 100 Write/Erase Cycles | 16 | NO | NO | YES | 1,2,1,1 | 16K,8K,96K,128K | BOTTOM | 18.4 mm | 12 mm | ||||||||||||||
| Mfr Part No SDIN5D2-8G-L | SanDisk Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 153 | SANDISK CORP | 3 | 8589934592 words | 8000000000 | 85 °C | -25 °C | PLASTIC/EPOXY | VFBGA | VFBGA, | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | Yes | 3.3 V | Yes | EAR99 | MLC NAND TYPE | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.5 mm | unknown | R-PBGA-B153 | 3.6 V | OTHER | 2.7 V | SYNCHRONOUS | 8GX8 | 1 mm | 8 | 68719476736 bit | PARALLEL | FLASH | 3.3 V | 13 mm | 11.5 mm | |||||||||||||||||||||||||||||
| Mfr Part No SST39SF010-90-4C-WH | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 90 ns | SILICON STORAGE TECHNOLOGY INC | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | TSOP1 | 8 X 14 MM, TSOP1-32 | TSSOP32,.56,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP1 | No | 5 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 240 | 1 | 0.5 mm | unknown | 10 | 32 | R-PDSO-G32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 128KX8 | 1.2 mm | 8 | 0.00005 A | 1048576 bit | PARALLEL | FLASH | 5 V | YES | YES | YES | 32 | 4K | 12.4 mm | 8 mm | ||||||||||||||||||
| Mfr Part No MX25U3232FZNI02/TRAY | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No W25X16VDAIZ | Winbond Electronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | 50 MHz | WINBOND ELECTRONICS CORP | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | DIP | 0.300 INCH, ROHS COMPLIANT, PLASTIC, DIP-8 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | Yes | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | THROUGH-HOLE | NOT SPECIFIED | 1 | 2.54 mm | unknown | NOT SPECIFIED | 8 | R-PDIP-T8 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.018 mA | 2MX8 | 3-STATE | 5.33 mm | 8 | 0.00001 A | 16777216 bit | SERIAL | FLASH | 3 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 9.27 mm | 7.62 mm | |||||||||||||||||
 | Mfr Part No S29PL064J60BFI12 | Spansion | Datasheet | 540 | - | Min: 1 Mult: 1 | YES | 48 | 60 ns | SPANSION INC | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | 8.15 X 6.15 MM, FBGA-48 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Transferred | BGA | Yes | 3 V | e1 | Yes | EAR99 | NOR TYPE | TIN SILVER COPPER | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | unknown | 40 | 48 | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.07 mA | 4MX16 | 1 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 16,126 | 4K,32K | 8 words | YES | BOTTOM/TOP | YES | 8.15 mm | 6.15 mm | |||||||||
| Mfr Part No S29PL064J60BFI12 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 60 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | 8.15 X 6.15 MM, FBGA-48 | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Transferred | Yes | 3 V | e1 | EAR99 | NOR TYPE | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | compliant | 40 | R-PBGA-B48 | Not Qualified | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.07 mA | 4MX16 | 1 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 16,126 | 4K,32K | 8 words | YES | BOTTOM/TOP | YES | 8.15 mm | 6.15 mm | ||||||||||||
| Mfr Part No MX52LM04A11XUI | Macronix International Co Ltd | Datasheet | 525 | - | Min: 1 Mult: 1 | YES | 153 | 200 MHz | MACRONIX INTERNATIONAL CO LTD | 4294967296 words | 4000000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | TFBGA, BGA153,14X14,20 | BGA153,14X14,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Active | Yes | 3.3 V | EAR99 | MLC NAND TYPE | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.5 mm | unknown | R-PBGA-B153 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.045 mA | 4GX8 | OPEN-DRAIN | 0.8 mm | 8 | 34359738368 bit | PARALLEL | FLASH CARD | 3.3 V | NO | NO | YES | 11 mm | 10 mm |
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IS25DLP512M-CMLA2-TR
Integrated Silicon Solution Inc
Package:Memory - Modules
Price: please inquire
-
HM1-7621-2
Intersil Corporation
Package:Memory - Modules
Price: please inquire
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S29GL032A90FFIR32
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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S29GL032A90FFIR32
AMD
Package:Memory - Modules
Price: please inquire
-
S29AL016D90BAI02
Spansion
Package:Memory - Modules
Price: please inquire
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N82HS641N
YAGEO Corporation
Package:Memory - Modules
Price: please inquire
-
N82HS641N
Philips Semiconductors
Package:Memory - Modules
Price: please inquire
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AT49LV2048A-90TI
Atmel Corporation
Package:Memory - Modules
Price: please inquire
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S29GL256N90TFIR13
Spansion
Package:Memory - Modules
Price: please inquire
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S29GL256N90TFIR13
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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S29GL256N90TFIR13
AMD
Package:Memory - Modules
Price: please inquire
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MBM29F800T-90PFTN
FUJITSU Limited
Package:Memory - Modules
Price: please inquire
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M28F220-70YN1
STMicroelectronics
Package:Memory - Modules
Price: please inquire
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SDIN5D2-8G-L
SanDisk Corporation
Package:Memory - Modules
Price: please inquire
-
SST39SF010-90-4C-WH
Silicon Storage Technology
Package:Memory - Modules
Price: please inquire
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MX25U3232FZNI02/TRAY
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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W25X16VDAIZ
Winbond Electronics Corp
Package:Memory - Modules
Price: please inquire
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S29PL064J60BFI12
Spansion
Package:Memory - Modules
Price: please inquire
-
S29PL064J60BFI12
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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MX52LM04A11XUI
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire