The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
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- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Programming Voltage | Endurance | Write Cycle Time-Max (tWC) | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Length | Width |
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 | Mfr Part No PH28F640W18BE60 | Numonyx Memory Solutions | Datasheet | - | - | Min: 1 Mult: 1 | YES | 56 | 60 ns | NUMONYX | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | 9 X 7.70 MM, 1 MM HEIGHT, LEAD FREE, VFBGA-56 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Transferred | BGA | 1.8 V | EAR99 | NOR TYPE | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 8542.32.00.51 | BOTTOM | BALL | NOT SPECIFIED | 1 | 0.75 mm | unknown | NOT SPECIFIED | 56 | R-PBGA-B56 | Not Qualified | 1.95 V | INDUSTRIAL | 1.7 V | ASYNCHRONOUS | 4MX16 | 1 mm | 16 | 67108864 bit | PARALLEL | FLASH | 1.8 V | BOTTOM | 9 mm | 7.7 mm | ||||||||||||||||||||||||
 | Mfr Part No AM29LV065DU101REI | AMD | Datasheet | 716 | - | Min: 1 Mult: 1 | YES | 48 | 100 ns | ADVANCED MICRO DEVICES INC | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | MO-142DD, TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Transferred | TSOP1 | No | 3.3 V | e0 | EAR99 | NOR TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.03 mA | 8MX8 | 1.2 mm | 8 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 128 | 64K | YES | YES | 18.4 mm | 12 mm | |||||||||||||||
| Mfr Part No AM29LV065DU101REI | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 100 ns | SPANSION INC | 3 | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | MO-142DD, TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP1 | No | 3.3 V | e0 | EAR99 | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | not_compliant | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.03 mA | 8MX8 | 1.2 mm | 8 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 128 | 64K | YES | YES | 18.4 mm | 12 mm | |||||||||||||
 | Mfr Part No S29CD016J0PQAM11 | Spansion | Datasheet | 161 | - | Min: 1 Mult: 1 | YES | 80 | 54 ns | 66 MHz | SPANSION INC | 524288 words | 512000 | 125 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, QFP80,.7X.9,32 | QFP80,.7X.9,32 | RECTANGULAR | FLATPACK | Transferred | QFP | No | 2.6 V | EAR99 | NOR TYPE | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | 8542.32.00.51 | QUAD | GULL WING | 1 | 0.8 mm | unknown | 80 | R-PQFP-G80 | Not Qualified | 2.75 V | AUTOMOTIVE | 2.5 V | ASYNCHRONOUS | 0.09 mA | 512KX32 | 3.35 mm | 32 | 0.00006 A | 16777216 bit | PARALLEL | FLASH | 2.7 V | 0.000065 ms | YES | YES | YES | 16,30 | 2K,16K | YES | BOTTOM | YES | 20 mm | 14 mm | |||||||||||||
 | Mfr Part No AM29F010-70EE | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 70 ns | SPANSION INC | 3 | 131072 words | 128000 | 125 °C | -55 °C | PLASTIC/EPOXY | TSOP1 | TSOP-32 | TSSOP32,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP | No | 5 V | e0 | 3A001.A.2.C | NOR TYPE | TIN LEAD | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | not_compliant | 32 | R-PDSO-G32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.05 mA | 128KX8 | 1.2 mm | 8 | 0.0001 A | 1048576 bit | PARALLEL | FLASH | 5 V | 1000000 Write/Erase Cycles | YES | YES | YES | 8 | 16K | 18.4 mm | 8 mm | ||||||||||||||
| Mfr Part No S29AL032D90TFI043 | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | CYPRESS SEMICONDUCTOR CORP | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | LEAD FREE, MO-142DD, TSOP-48 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | Yes | 3 V | e3 | EAR99 | NOR TYPE | MATTE TIN | BOTTOM BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | 40 | R-PDSO-G48 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 2MX16 | 1.2 mm | 16 | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | BOTTOM | 18.4 mm | 12 mm | ||||||||||||||||||||||
| Mfr Part No S29AL032D90TFI043 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | ADVANCED MICRO DEVICES INC | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G48 | Not Qualified | INDUSTRIAL | 0.035 mA | 2MX16 | 16 | 0.000005 A | 33554432 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 8,63 | 8K,64K | YES | BOTTOM | YES | ||||||||||||||||||||||||||
| Mfr Part No KLM8G1GEUF-B04QT59 | Samsung Electronics Co. Ltd | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No K9F1216D0A-YCB0 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 30 ns | SAMSUNG SEMICONDUCTOR INC | 33554432 words | 32000000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | No | 2.65 V | e0 | EAR99 | SLC NAND TYPE | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | compliant | R-PDSO-G48 | Not Qualified | COMMERCIAL | 0.02 mA | 32MX16 | 16 | 0.00005 A | 536870912 bit | PARALLEL | FLASH | NO | NO | YES | 4K | 8K | 256 words | YES | |||||||||||||||||||||||||||
| Mfr Part No AS8F512K32P-150 | Micross Components | Datasheet | - | - | Min: 1 Mult: 1 | NO | 66 | 150 ns | MICROSS COMPONENTS | 524288 words | 512000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | PGA | PGA, PGA66,11X11 | PGA66,11X11 | SQUARE | GRID ARRAY | Active | No | 5 V | 3A001.A.2.C | NOR TYPE | ALSO HAVING 8-BIT WIDTH | 8542.32.00.51 | PERPENDICULAR | PIN/PEG | NOT SPECIFIED | 1 | 2.54 mm | compliant | NOT SPECIFIED | S-CPGA-P66 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.24 mA | 512KX32 | 32 | 0.0065 A | 16777216 bit | MIL-STD-883 | PARALLEL | FLASH MODULE | 5 V | 16 | YES | YES | 32 | 16K | 29.718 mm | 29.718 mm | ||||||||||||||||||
| Mfr Part No TS32GMTS800 | Transcend Information Inc | Datasheet | - | - | Min: 1 Mult: 1 | TRANSCEND INFORMATION INC | Active | Yes | unknown | FLASH MODULE | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC17128D-DD8R | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | 12.5 MHz | XILINX INC | 131072 words | 128000 | 125 °C | -55 °C | CERAMIC | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | Transferred | No | 5 V | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | not_compliant | R-XDIP-T8 | Not Qualified | MILITARY | 0.01 mA | 128KX1 | 3-STATE | 1 | 0.00005 A | 131072 bit | 38535Q/M;38534H;883B | COMMON | CONFIGURATION MEMORY | ||||||||||||||||||||||||||||||||||
| Mfr Part No MX25LM25645GXDR00TR | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No S29GL256P90TFIR1 | Spansion | Datasheet | 16000 | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC17256L-DD8I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | 55 ns | 10 MHz | XILINX INC | 262144 words | 1000 | 85 °C | -40 °C | CERAMIC | DIP | DIP, DIP8,.3 | DIP8,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-XDIP-T8 | Not Qualified | INDUSTRIAL | SYNCHRONOUS | 0.01 mA | 1KX8 | 3-STATE | 8 | 0.00005 A | 8192 bit | PARALLEL | COMMON | OTP ROM | ||||||||||||||||||||||||||||||
| Mfr Part No W25Q16JLSVIG | Winbond Electronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 104 MHz | 2017-07-25 | WINBOND ELECTRONICS CORP | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VSOP | VSOP, | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | Active | Yes | 3 V | EAR99 | NOR TYPE | IT ALSO OPERATES AT FREQUENCY 50 MHZ AT SUPPLY VOLTAGE 2.3 TO 2.7 V | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | compliant | R-PDSO-G8 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 2MX8 | 3-STATE | 0.9 mm | 8 | 16777216 bit | SERIAL | FLASH | 3 V | 1 | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||
| Mfr Part No XC1718-PD8C | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | 5 MHz | XILINX INC | 1 | 18144 words | 18144 | 70 °C | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | Transferred | No | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | THROUGH-HOLE | 225 | 2.54 mm | not_compliant | 30 | R-PDIP-T8 | Not Qualified | COMMERCIAL | 18144X1 | 3-STATE | 1 | COMMON | CONFIGURATION MEMORY | 15 V | |||||||||||||||||||||||||||||||||
| Mfr Part No AM29LV065DU101REF | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 100 ns | ADVANCED MICRO DEVICES INC | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G48 | Not Qualified | INDUSTRIAL | 0.03 mA | 8MX8 | 8 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | YES | YES | YES | 128 | 64K | YES | YES | |||||||||||||||||||||||||||||
| Mfr Part No AM29LV065DU101REF | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 100 ns | SPANSION INC | 3 | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | LEAD FREE, MO-142DD, TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | TSOP1 | Yes | 3.3 V | e3 | EAR99 | NOR TYPE | Matte Tin (Sn) | 8542.32.00.51 | DUAL | GULL WING | 260 | 1 | 0.5 mm | compliant | 40 | 48 | R-PDSO-G48 | Not Qualified | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.03 mA | 8MX8 | 1.2 mm | 8 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 128 | 64K | YES | YES | 18.4 mm | 12 mm | ||||||||||||
| Mfr Part No PM39F010-70VCE | Programmable Microelectronics Corp | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | 70 ns | PROGRAMMABLE MICROELECTRONICS CORP | 131072 words | 128000 | 85 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP32,.56,20 | TSSOP32,.56,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Transferred | Yes | 5 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 0.5 mm | unknown | R-PDSO-G32 | Not Qualified | OTHER | 0.02 mA | 128KX8 | 8 | 0.00001 A | 1048576 bit | PARALLEL | FLASH | YES | YES | YES | 32 | 4K |
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PH28F640W18BE60
Numonyx Memory Solutions
Package:Memory - Modules
Price: please inquire
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AM29LV065DU101REI
AMD
Package:Memory - Modules
Price: please inquire
-
AM29LV065DU101REI
Spansion
Package:Memory - Modules
Price: please inquire
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S29CD016J0PQAM11
Spansion
Package:Memory - Modules
Price: please inquire
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AM29F010-70EE
Spansion
Package:Memory - Modules
Price: please inquire
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S29AL032D90TFI043
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
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S29AL032D90TFI043
AMD
Package:Memory - Modules
Price: please inquire
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KLM8G1GEUF-B04QT59
Samsung Electronics Co. Ltd
Package:Memory - Modules
Price: please inquire
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K9F1216D0A-YCB0
Samsung Semiconductor
Package:Memory - Modules
Price: please inquire
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AS8F512K32P-150
Micross Components
Package:Memory - Modules
Price: please inquire
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TS32GMTS800
Transcend Information Inc
Package:Memory - Modules
Price: please inquire
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XC17128D-DD8R
AMD Xilinx
Package:Memory - Modules
Price: please inquire
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MX25LM25645GXDR00TR
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
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S29GL256P90TFIR1
Spansion
Package:Memory - Modules
Price: please inquire
-
XC17256L-DD8I
AMD Xilinx
Package:Memory - Modules
Price: please inquire
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W25Q16JLSVIG
Winbond Electronics Corp
Package:Memory - Modules
Price: please inquire
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XC1718-PD8C
AMD Xilinx
Package:Memory - Modules
Price: please inquire
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AM29LV065DU101REF
AMD
Package:Memory - Modules
Price: please inquire
-
AM29LV065DU101REF
Spansion
Package:Memory - Modules
Price: please inquire
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PM39F010-70VCE
Programmable Microelectronics Corp
Package:Memory - Modules
Price: please inquire