The category is 'Memory - Modules'
Memory - Modules (5402)
- All Manufacturers
- Reach Compliance Code
- Ihs Manufacturer
- Part Life Cycle Code
- Organization
- Terminal Position
- Memory IC Type
- Memory Width
- Terminal Form
- Memory Density
- Surface Mount
- JESD-30 Code
- ECCN Code
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | RoHS | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Parallel/Serial | Memory IC Type | Programming Voltage | Endurance | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Page Size | Ready/Busy | Boot Block | Common Flash Interface | Length | Width |
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 | Mfr Part No FT24C512A-TSR-B | FMD(Fremont Micro Devices) | Datasheet | - | - | Min: 1 Mult: 1 | Tube-packed | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No K4F2E3S4HA-GFCL | Samsung | Datasheet | 1600 |
| Min: 1 Mult: 1 | Tape & Reel (TR) | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No FT24C512A-TTR-T | FMD(Fremont Micro Devices) | Datasheet | - | - | Min: 1 Mult: 1 | Tape & Reel (TR) | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No BL24C04 | BL(Shanghai Belling) | Datasheet | 28528 | - | Min: 1 Mult: 1 | Tube-packed | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M393A1K43DB1-CWE | Samsung | Datasheet | 400 |
| Min: 1 Mult: 1 | Tape & Reel (TR) | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No P24CM01B-SSH-MIT | PUYA) | Datasheet | 28441 | - | Min: 1 Mult: 1 | Tube-packed | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No FT24C512A-TSR-T | FMD(Fremont Micro Devices) | Datasheet | - | - | Min: 1 Mult: 1 | Tape & Reel (TR) | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No K4A8G045WB-BCTD | Samsung | Datasheet | 7984 |
| Min: 1 Mult: 1 | Tape & Reel (TR) | true | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No ES29LV320DB-90TGI | Excel (Suzhou) Semiconductor Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 90 ns | EXCEL SEMICONDUCTOR INC | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP, TSSOP48,.8,20 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Obsolete | Yes | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 260 | 0.5 mm | unknown | R-PDSO-G48 | Not Qualified | INDUSTRIAL | 0.03 mA | 2MX16 | 16 | 0.00001 A | 33554432 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 8,63 | 8K,64K | YES | BOTTOM | YES | |||||||||||||||||||||||
| Mfr Part No MX30LF4G28AC-TI/TR | Macronix International Co Ltd | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No GD25Q64BSIGY | ELM Technology Corp | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 120 MHz | ELM TECHNOLOGY CORP | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP-8 | RECTANGULAR | SMALL OUTLINE | Contact Manufacturer | 3 V | EAR99 | NOR TYPE | 8542.32.00.51 | DUAL | GULL WING | 1 | 1.27 mm | unknown | R-PDSO-G8 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 8MX8 | 2.16 mm | 8 | 67108864 bit | SERIAL | FLASH | 2.7 V | 5.28 mm | 5.23 mm | ||||||||||||||||||||||||||||||
| Mfr Part No AM29F200AT-55EC | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 55 ns | ADVANCED MICRO DEVICES INC | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Obsolete | TSOP | No | 5 V | e0 | EAR99 | NOR TYPE | TIN LEAD | TOP BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | Not Qualified | 5.25 V | COMMERCIAL | 4.75 V | ASYNCHRONOUS | 0.06 mA | 128KX16 | 3-STATE | 1.2 mm | 16 | 0.000005 A | 2097152 bit | PARALLEL | FLASH | 5 V | 100000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,3 | 16K,8K,32K,64K | YES | TOP | 18.4 mm | 12 mm | |||||||||||
 | Mfr Part No AM29F200AT-55EC | Spansion | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 55 ns | SPANSION INC | 3 | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSOP-48 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE | Obsolete | TSOP | No | 5 V | e0 | EAR99 | NOR TYPE | TIN LEAD | TOP BOOT BLOCK | 8542.32.00.51 | DUAL | GULL WING | 260 | 0.5 mm | not_compliant | 48 | R-PDSO-G48 | Not Qualified | COMMERCIAL | 0.06 mA | 128KX16 | 16 | 0.000005 A | 2097152 bit | PARALLEL | FLASH | 5 V | 100000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,3 | 16K,8K,32K,64K | YES | TOP | |||||||||||||||||
| Mfr Part No AM29F200AT-55EC | Cypress Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 55 ns | CYPRESS SEMICONDUCTOR CORP | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Active | No | 5 V | NOR TYPE | DUAL | GULL WING | 0.5 mm | compliant | R-PDSO-G48 | Not Qualified | 5 V | COMMERCIAL | 0.06 mA | 128KX16 | 0.000005 A | 2097152 bit | PARALLEL | FLASH | 100000 Write/Erase Cycles | 8 | YES | YES | YES | 1,2,1,3 | 16K,8K,32K,64K | YES | TOP | ||||||||||||||||||||||||||||
 | Mfr Part No K9F5616Q0C-DCB0 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 63 | 30 ns | SAMSUNG SEMICONDUCTOR INC | 16777216 words | 16000000 | 70 °C | PLASTIC/EPOXY | VFBGA | VFBGA, BGA63,10X12,32 | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Obsolete | BGA | 1.8 V | EAR99 | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 63 | R-PBGA-B63 | Not Qualified | 1.95 V | COMMERCIAL | 1.65 V | ASYNCHRONOUS | 0.015 mA | 16MX16 | 1 mm | 16 | 0.00005 A | 268435456 bit | PARALLEL | FLASH | 1.8 V | NO | NO | YES | 2K | 8K | 256 words | YES | 11 mm | 9 mm | |||||||||||||||||||
 | Mfr Part No 5962-9669005HYC | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 32 | 60 ns | MICROSEMI CORP | 131072 words | 128000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | , | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Transferred | MODULE | 5 V | e4 | 3A001.A.2.C | GOLD | 100K ERASE/PROGRAM CYCLES | 8542.32.00.51 | DUAL | THROUGH-HOLE | 1 | unknown | 32 | R-CDMA-T32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 128KX8 | 8 | 1048576 bit | PARALLEL | FLASH MODULE | 5 V | ||||||||||||||||||||||||||||||
| Mfr Part No 5962-9669005HYC | White Microelectronics | Datasheet | - | - | Min: 1 Mult: 1 | NO | 32 | 60 ns | WHITE MICROELECTRONICS | 131072 words | 128000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP, CERAMIC-32 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Obsolete | 5 V | e4 | GOLD | 100K ERASE/PROGRAM CYCLES | DUAL | THROUGH-HOLE | 1 | unknown | R-CDMA-T32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 128KX8 | 8 | 1048576 bit | PARALLEL | FLASH MODULE | 5 V | ||||||||||||||||||||||||||||||||||
| Mfr Part No SEDC600M/480G | Kingston Technology Company | Datasheet | 1716 |
| Min: 1 Mult: 1 | 4 Weeks, 2 Days | NO | KINGSTON TECHNOLOGY COMPANY INC | 515396075520 words | 480000000000 | 70 °C | UNSPECIFIED | XMA | MODULE | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Active | EAR99 | TLC NAND TYPE | 8542.32.00.51 | UNSPECIFIED | NO LEAD | 1 | unknown | R-XXMA-N | ASYNCHRONOUS | 480GX8 | 8 | 4123168604160 bit | SERIAL | FLASH MODULE | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No DM54S387J | National Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | 60 ns | NATIONAL SEMICONDUCTOR CORP | 256 words | 256 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | DIP, DIP16,.3 | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-GDIP-T16 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.13 mA | 256X4 | OPEN-COLLECTOR | 5.08 mm | 4 | 1024 bit | PARALLEL | OTP ROM | 19.43 mm | 7.62 mm | |||||||||||||||||||||||||
| Mfr Part No DM54S387J | Rochester Electronics LLC | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | 60 ns | ROCHESTER ELECTRONICS LLC | 256 words | 256 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | DIP, | RECTANGULAR | IN-LINE | Active | 5 V | e0 | EAR99 | TIN LEAD | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-GDIP-T16 | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 256X4 | 5.08 mm | 4 | 1024 bit | PARALLEL | OTP ROM | 19.43 mm | 7.62 mm |
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FT24C512A-TSR-B
FMD(Fremont Micro Devices)
Package:Memory - Modules
Price: please inquire
-
K4F2E3S4HA-GFCL
Samsung
Package:Memory - Modules
42.874074
-
FT24C512A-TTR-T
FMD(Fremont Micro Devices)
Package:Memory - Modules
Price: please inquire
-
BL24C04
BL(Shanghai Belling)
Package:Memory - Modules
Price: please inquire
-
M393A1K43DB1-CWE
Samsung
Package:Memory - Modules
6.696163
-
P24CM01B-SSH-MIT
PUYA)
Package:Memory - Modules
Price: please inquire
-
FT24C512A-TSR-T
FMD(Fremont Micro Devices)
Package:Memory - Modules
Price: please inquire
-
K4A8G045WB-BCTD
Samsung
Package:Memory - Modules
22.046878
-
ES29LV320DB-90TGI
Excel (Suzhou) Semiconductor Co Ltd
Package:Memory - Modules
Price: please inquire
-
MX30LF4G28AC-TI/TR
Macronix International Co Ltd
Package:Memory - Modules
Price: please inquire
-
GD25Q64BSIGY
ELM Technology Corp
Package:Memory - Modules
Price: please inquire
-
AM29F200AT-55EC
AMD
Package:Memory - Modules
Price: please inquire
-
AM29F200AT-55EC
Spansion
Package:Memory - Modules
Price: please inquire
-
AM29F200AT-55EC
Cypress Semiconductor
Package:Memory - Modules
Price: please inquire
-
K9F5616Q0C-DCB0
Samsung Semiconductor
Package:Memory - Modules
Price: please inquire
-
5962-9669005HYC
Microsemi Corporation
Package:Memory - Modules
Price: please inquire
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5962-9669005HYC
White Microelectronics
Package:Memory - Modules
Price: please inquire
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SEDC600M/480G
Kingston Technology Company
Package:Memory - Modules
201.767897
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DM54S387J
National Semiconductor Corporation
Package:Memory - Modules
Price: please inquire
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DM54S387J
Rochester Electronics LLC
Package:Memory - Modules
Price: please inquire