The category is 'Embedded - Microprocessors'
Embedded - Microprocessors (6000)
- All Manufacturers
- Package / Case
- Packaging
- Moisture Sensitivity Level (MSL)
- RoHS Status
- Core Processor
- Graphics Acceleration
- Number of Cores/Bus Width
- Operating Temperature
- Part Status
- RAM Controllers
- Series
- USB
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | Contact Shape | Shell Material | Supplier Device Package | Insert Material | Number of Terminals | Base Product Number | Clock Frequency-Max | Contact Sizes | Core | Data RAM Size | Development Kit | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Instruction Type | Interface Type | L1 Cache Data Memory | L1 Cache Instruction Memory | Lead Free Status / RoHS Status | Manufacturer Lifecycle Status | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Part Package Code | Processor Series | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Unit Weight | Usage Level | Watchdog Timers | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | ECCN Code | Connector Type | Type | Number of Positions | Terminal Finish | Additional Feature | HTS Code | Fastening Type | Contact Type | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Shell Finish | Pin Count | Shell Size - Insert | JESD-30 Code | Qualification Status | Housing Color | Brand Name | Operating Supply Voltage | Power Supplies | Temperature Grade | Note | Speed | Shell Size, MIL | uPs/uCs/Peripheral ICs Type | Core Processor | Supply Current-Max | Bit Size | Data Bus Width | Seated Height-Max | Number of Timers/Counters | Address Bus Width | Includes | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Format | Integrated Cache | RAM (words) | Voltage - I/O | Number of UART Channels | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Co-Processors/DSP | Number of Cores | Bus Compatibility | On Chip Data RAM Width | Security Features | Display & Interface Controllers | Number of DMA Channels | SATA | Features | Total Dose | Height | Length | Width | Thickness | Material Flammability Rating | Lead Free |
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 | Mfr Part No X2000 | Lumissil Microsystems | Datasheet | - | - | Min: 1 Mult: 1 | BGA-270 | 270-BGA (12x12) | Xburst2 | Halley5 | 1680 | Floating Point | GPIO, I2C, SPI, UART, USB | + 85 C | LPDDR3 | Lumissil Microsystems | - 40 C | Yes | SMD/SMT | Tray | Active | Watchdog Timer | -40°C ~ 85°C (TA) | Cut Tape | X2000 | 1.7 V to 1.95 V | 1.2GHz | XBurst® 2 | 16 bit | 1.8V, 3.3V | 10/100/1000Mbps (1) | - | No | LPDDR3 | USB 2.0 OTG (1) | DMA, I²C, I²S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG | - | AES, RSA, TRNG, MD5, SHA, SHA2 | DVP, LCD, MIPI-CSI, MIPI-DSI | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No FH8067303782501S R3ZQ | Intel | Datasheet | 32 | - | Min: 1 Mult: 1 | 1 | Yes | 964085 | Details | Tray | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EEC1005-I/WC-UB1 | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | WFBGA-144 | 256 KB | 168 | I2C | + 85 C | SRAM | - 40 C | SMD/SMT | No Watchdog Timer | Tray | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No HW8076502693601S R3ME | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 300 | Yes | 959594 | Details | Reel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No HW8076502693701S R3MF | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 300 | Yes | 959595 | Details | Reel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No FH8067303534104S R3ZN | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 1 | Yes | 964083 | Details | Tray | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AT91SAM9G20B-CU | Atmel (Microchip Technology) | Datasheet | 100 | - | Min: 1 Mult: 1 | Surface Mount | LFBGA | 217-LFBGA (15x15) | ARM926EJ-S | 32 kB | 126 | 2-Wire, I2S, SPI, UART, USART | 32 kB | 32 kB | 400 MHz | + 85 C | Atmel | - 40 C | Yes | SMD/SMT | 96 I/O | Bulk | AT91SAMx | Active | Details | 0.015429 oz | -40°C ~ 85°C (TA) | Tray | SAM9G20 | 1 V | 400MHz | ARM926EJ-S | 32 bit | 7 Timer | 1.8V, 3.3V | 10/100Mbps | 1 Core, 32-Bit | No | SDRAM, SRAM | USB 2.0 (2) | EBI/EMI, I²C, MMC/SD/SDIO, SPI, SSC, UART/USART | - | 1 Core | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PC7410VGH450NE | E2V | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 79RC32H435-300BCI | Intersil (Renesas Electronics America) | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 125 MHz | INTEGRATED DEVICE TECHNOLOGY INC | 79RC32H435-300BCI | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | 20 | 5.88 | No | 1.3 V | 1.1 V | 1.2 V | e0 | 3A001.A.3 | Tin/Lead (Sn63Pb37) | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 225 | 1 mm | not_compliant | S-PBGA-B256 | Not Qualified | 1.2,2.5,3.3 V | INDUSTRIAL | 300 MHz | MICROPROCESSOR | 32 | 1.7 mm | 32 | YES | YES | 32 | FIXED POINT | YES | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No DRA756BPGABCQ1 | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | Production (Last Updated: 5 days ago) | YES | 760 | 760 | 32 MHz | Texas INC | ACTIVE (Last Updated: 5 days ago) | DRA756BPGABCQ1 | Texas Instruments | 3 | 125 °C | -40 °C | Tray | PLASTIC/EPOXY | FBGA | FCBGA-760 | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | 5.64 | Compliant | Yes | 1.2 V | 1.11 V | 1.15 V | Automotive grade | * | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B760 | Texas | AUTOMOTIVE | MICROPROCESSOR CIRCUIT | 2.96 mm | AEC-Q100 | 64 | 10 | CAN; I2C; PCI; SPI; UART; USB | 2.96 mm | 23 mm | 23 mm | 2.39 mm | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AM3872BCYEA80 | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 684 | 30 MHz | Texas INC | AM3872BCYEA80 | PLASTIC/EPOXY | FBGA | 23 X 23 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, FCBGA-684 | BGA684,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Obsolete | BGA | NOT SPECIFIED | 5.84 | Yes | 1.42 V | 1.28 V | 1.35 V | 3A991.A.2 | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 684 | S-PBGA-B684 | Not Qualified | 0.95/1.35 V | 800 MHz | MICROPROCESSOR | 32 | 3.06 mm | 16 | YES | YES | 16 | FLOATING POINT | YES | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No DRA752BPGABCQ1 | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 760 | Texas INC | DRA752BPGABCQ1 | Texas Instruments | 3 | 125 °C | -40 °C | Bulk | PLASTIC/EPOXY | FBGA | BGA-760 | SQUARE | GRID ARRAY, FINE PITCH | Obsolete | Active | 5.83 | Yes | 1.2 V | 1.11 V | 1.15 V | Automotive grade | * | e1 | No | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B760 | Texas | AUTOMOTIVE | MICROPROCESSOR CIRCUIT | 2.96 mm | AEC-Q100 | 10 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No HS1-80C86RH/PROTO | Intersil (Renesas Electronics America) | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 5 MHz | RENESAS ELECTRONICS CORP | HS1-80C86RH/PROTO | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | 5.58 | 5.5 V | 4.5 V | 5 V | * | Last Time Buy | 3A001.A.2.C | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-CDIP-T40 | Not Qualified | MILITARY | 5 MHz | MICROPROCESSOR | 16 | 5.72 mm | 20 | NO | YES | 16 | FIXED POINT | NO | 100k Rad(Si) V | 15.24 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No P1017NSE5CFB | Freescale | Datasheet | 123 |
| Min: 1 Mult: 1 | Panel Mount | 457-FBGA | Flange | Circular | Composite | 457-TEPBGA-1 (19x19) | -- | 16 | -- | Freescale Semiconductor | Bulk | Obsolete | -65°C ~ 175°C | Bulk | MIL-DTL-38999 Series III, Tri-Start™ TV | Active | -- | Receptacle Housing | For Male Pins | 29 | Threaded | Crimp | N (Normal) | Shielded | Environment Resistant | Cadmium | 25-29 | Olive Drab | Contacts Not Included | 500MHz | -- | PowerPC e500v2 | -- | - | 10/100/1000Mbps (2) | 1 Core, 32-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (1) | DUART, I²C, MMC/SD, SPI | Security; SEC 4.2 | Cryptography, Random Number Generator | - | - | -- | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No P1020NXN2HFB | Freescale | Datasheet | 2648 | - | Min: 1 Mult: 1 | Surface Mount | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | Freescale Semiconductor | Bulk | Active | -40°C ~ 105°C (TA) | QorIQ P1 | 800MHz | PowerPC e500v2 | 2.5V, 3.3V | 10/100/1000Mbps (3) | 2 Core, 32-Bit | No | DDR2, DDR3 | USB 2.0 + PHY (2) | DUART, I²C, MMC/SD, SPI | - | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAM437XBZDN100 | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 491 | Texas INC | XAM437XBZDN100 | 3 | PLASTIC/EPOXY | LFBGA | LFBGA, | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Obsolete | BGA | NOT SPECIFIED | 5.76 | Yes | 1.144 V | 1.056 V | 1.1 V | e1 | No | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 0.65 mm | compliant | 491 | S-PBGA-B491 | Texas | 1000 MHz | MICROPROCESSOR, RISC | 32 | 1.3 mm | 28 | YES | YES | 16 | FLOATING POINT | YES | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No V62/15602-01XE | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | 6 Weeks | YES | 324 | Texas INC | V62/15602-01XE | 3 | 105 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | BGA | 5.83 | No | 1.144 V | 1.056 V | 1.1 V | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 0.8 mm | not_compliant | 324 | S-PBGA-B324 | Texas | INDUSTRIAL | 800 MHz | MICROPROCESSOR, RISC | 400 mA | 32 | 1.4 mm | 28 | YES | YES | 16 | FIXED POINT | YES | 65536 | 8 | 64 | 15 mm | 15 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPC8308VMADD | Freescale | Datasheet | 80 | - | Min: 1 Mult: 1 | Surface Mount | 473-LFBGA | 473-MAPBGA (19x19) | Freescale Semiconductor | Tray | Obsolete | 0°C ~ 105°C (TA) | MPC83xx | 266MHz | PowerPC e300c3 | 1.8V, 2.5V, 3.3V | 10/100/1000Mbps (3) | 1 Core, 32-Bit | No | DDR2 | USB 2.0 (1) | DUART, HSSI, I²C, MMC/SD/SDIO, SPI | - | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MCIMX353DVM5B | Freescale | Datasheet | 83 |
| Min: 1 Mult: 1 | Surface Mount | 400-LFBGA | 400-LFBGA (17x17) | Freescale Semiconductor | Bulk | Active | -20°C ~ 70°C (TA) | i.MX35 | 532MHz | ARM1136JF-S | 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V | 10/100Mbps (1) | 1 Core, 32-Bit | Yes | LPDDR, DDR2 | USB 2.0 + PHY (2) | 1-Wire, ASRC, ATA, CAN, I²C, I²S, MMC/SDIO, SAI, SPI, SSI, UART | Multimedia; GPU, IPU, VFP | Secure Fusebox, Secure JTAG, Tamper Detection | Keypad, KPP, LCD | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No P5020NSE1TNB | Freescale | Datasheet | 676 |
| Min: 1 Mult: 1 | Surface Mount | 1295-BBGA, FCBGA | 1295-FCPBGA (37.5x37.5) | P5020 | Freescale Semiconductor | Bulk | Active | 0°C ~ 105°C (TA) | QorIQ P5 | 2.0GHz | PowerPC e5500 | - | 1Gbps (5), 10Gbps (1) | 2 Core, 64-Bit | No | DDR3, DDR3L | USB 2.0 + PHY (2) | DUART, I²C, MMC/SD, SPI | Security; SEC 4.2 | Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection | - | SATA 3Gbps (2) |
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X2000
Lumissil Microsystems
Package:Embedded - Microprocessors
Price: please inquire
-
FH8067303782501S R3ZQ
Intel
Package:Embedded - Microprocessors
Price: please inquire
-
EEC1005-I/WC-UB1
Atmel (Microchip Technology)
Package:Embedded - Microprocessors
Price: please inquire
-
HW8076502693601S R3ME
Intel
Package:Embedded - Microprocessors
Price: please inquire
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HW8076502693701S R3MF
Intel
Package:Embedded - Microprocessors
Price: please inquire
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FH8067303534104S R3ZN
Intel
Package:Embedded - Microprocessors
Price: please inquire
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AT91SAM9G20B-CU
Atmel (Microchip Technology)
Package:Embedded - Microprocessors
Price: please inquire
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PC7410VGH450NE
E2V
Package:Embedded - Microprocessors
Price: please inquire
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79RC32H435-300BCI
Intersil (Renesas Electronics America)
Package:Embedded - Microprocessors
Price: please inquire
-
DRA756BPGABCQ1
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
-
AM3872BCYEA80
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
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DRA752BPGABCQ1
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
-
HS1-80C86RH/PROTO
Intersil (Renesas Electronics America)
Package:Embedded - Microprocessors
Price: please inquire
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P1017NSE5CFB
Freescale
Package:Embedded - Microprocessors
58.959204
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P1020NXN2HFB
Freescale
Package:Embedded - Microprocessors
Price: please inquire
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XAM437XBZDN100
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
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V62/15602-01XE
Texas Instruments
Package:Embedded - Microprocessors
Price: please inquire
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MPC8308VMADD
Freescale
Package:Embedded - Microprocessors
Price: please inquire
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MCIMX353DVM5B
Freescale
Package:Embedded - Microprocessors
36.897130
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P5020NSE1TNB
Freescale
Package:Embedded - Microprocessors
577.818256