The category is 'Interface - Telecom'
Interface - Telecom (6000)
- All Manufacturers
- Moisture Sensitivity Level (MSL)
- Part Status
- RoHS Status
- Package / Case
- Mounting Type
- Packaging
- Factory Lead Time
- Number of Circuits
- Function
- Voltage - Supply
- Terminal Position
- Number of Terminations
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Manufacturer Package Code | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | ECCN Code | Terminal Finish | Applications | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Operating Mode | Supply Current-Max | Seated Height-Max | Telecom IC Type | Filter | Companding Law | Neg Supply Voltage-Nom | Crystal Frequency | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No HT9312B | Holtek Semiconductor Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 22 | HOLTEK SEMICONDUCTOR INC | 70 °C | -20 °C | PLASTIC/EPOXY | DIP | DIP, DIP22(UNSPEC) | DIP22(UNSPEC) | RECTANGULAR | IN-LINE | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | unknown | R-PDIP-T22 | Not Qualified | COMMERCIAL | 2 mA | 3.58 MHz | |||||||||||||||||||||
![]() | Mfr Part No SIW1711FIF | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | RF MICRO DEVICES INC | MLF | 1 | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | DFN | No | 1.8 V | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | 32 | S-XQCC-N32 | Not Qualified | INDUSTRIAL | 0.9 mm | TELECOM CIRCUIT | 5 mm | 5 mm | |||||||||||||||
![]() | Mfr Part No NE5750N | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | NXP SEMICONDUCTORS | 70 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | 5 V | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | unknown | R-PDIP-T24 | Not Qualified | COMMERCIAL | TELECOM CIRCUIT | |||||||||||||||||||||||||
![]() | Mfr Part No NE5750N | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | PHILIPS SEMICONDUCTORS | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP24,.3 | DIP24,.3 | RECTANGULAR | IN-LINE | Transferred | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T24 | Not Qualified | COMMERCIAL | 12 mA | |||||||||||||||||||||
![]() | Mfr Part No AD614BS | Stanley Engineered Fastening | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No TP13067ADWR | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | TEXAS INSTRUMENTS INC | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | 5 V | FULL DUPLEX | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | R-PDSO-G20 | Not Qualified | INDUSTRIAL | SYNCHRONOUS/ASYNCHRONOUS | 11 mA | 2.65 mm | PCM CODEC | YES | A-LAW | -5 V | 12.8 mm | 7.5 mm | ||||||||||||||
![]() | Mfr Part No RF9904 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 16 | RF MICRO DEVICES INC | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP16,.25 | SOP16,.25 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 5 V | e0 | TIN LEAD | 8542.39.00.01 | DUAL | GULL WING | 1 | 1.27 mm | unknown | 16 | R-PDSO-G16 | Not Qualified | INDUSTRIAL | 0.035 mA | 1.905 mm | TELECOM CIRCUIT | 9.9 mm | 3.9 mm | |||||||||||||
![]() | Mfr Part No S1T2418G01-D0B0 | Samsung Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | NO | 8 | SAMSUNG SEMICONDUCTOR INC | 70 °C | -20 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | DIP | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 8 | R-PDIP-T8 | Not Qualified | COMMERCIAL | 5.08 mm | TELEPHONE RINGER CIRCUIT | 9.2 mm | 7.62 mm | |||||||||||||||||||
![]() | Mfr Part No RF5722 | RF Micro Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | RF MICRO DEVICES INC | 2 | 85 °C | -30 °C | UNSPECIFIED | HVQCCN | 2.2 X 2.2 MM, 0.45 PITCH, GREEN, QFN-8 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Transferred | QFN | Yes | 3.3 V | e3 | 5A991.G | MATTE TIN | 8517.70.00.00 | QUAD | NO LEAD | 260 | 1 | 0.65 mm | unknown | 30 | 8 | S-XQCC-N8 | Not Qualified | OTHER | 0.5 mm | TELECOM CIRCUIT | 2.2 mm | 2.2 mm | |||||||||||
![]() | Mfr Part No AP22803AM8-13 | Diodes Incorporated | Datasheet | 339 | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SC14420CQ | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 80 | NATIONAL SEMICONDUCTOR CORP | 60 °C | -10 °C | PLASTIC/EPOXY | QFP | QFP, QFP80,.7SQ,32 | QFP80,.7SQ,32 | SQUARE | FLATPACK | Obsolete | 5 V | 8542.39.00.01 | QUAD | GULL WING | 1 | 0.8 mm | unknown | S-PQFP-G80 | Not Qualified | COMMERCIAL | 10 mA | BASEBAND CIRCUIT | |||||||||||||||||||||
![]() | Mfr Part No ADL5360XCPZ-R7 | Analog Devices Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 36 | ANALOG DEVICES INC | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | 6 X 6 MM, LFCSP-36 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | QFN | Yes | 3.3 V | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | 36 | S-XQCC-N36 | Not Qualified | INDUSTRIAL | 1 mm | RF FRONT END CIRCUIT | 6 mm | 6 mm | |||||||||||||||||
![]() | Mfr Part No PBL3798 | Ericsson | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No IDT77V500S27PFI | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | INTEGRATED DEVICE TECHNOLOGY INC | 3 | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | LFQFP, QFP100,.63SQ,20 | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | No | 3.3 V | e0 | TIN LEAD | ATM | 8542.39.00.01 | QUAD | GULL WING | 240 | 1 | 0.5 mm | not_compliant | 20 | 100 | S-PQFP-G100 | Not Qualified | INDUSTRIAL | 0.2 mA | 1.6 mm | ATM/SONET/SDH SWITCHING CIRCUIT | 14 mm | 14 mm | |||||||||
![]() | Mfr Part No CLRC66303HN/TRAYB | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | NXP SEMICONDUCTORS | 85 °C | -25 °C | PLASTIC/EPOXY | HVQCCN | HVQCCN, | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Active | 5 V | 8542.39.00.01 | QUAD | NO LEAD | 1 | 0.5 mm | unknown | S-PQCC-N32 | OTHER | 1 mm | TELECOM CIRCUIT | 5 mm | 5 mm | |||||||||||||||||||||
![]() | Mfr Part No MM74HC943J | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 20 | NATIONAL SEMICONDUCTOR CORP | 85 °C | -40 °C | CERAMIC, GLASS-SEALED | DIP | DIP, DIP20,.3 | DIP20,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | TIN LEAD | FULL DUPLEX | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-GDIP-T20 | Not Qualified | INDUSTRIAL | 5.08 mm | MODEM | 24.51 mm | 7.62 mm | |||||||||||||||
![]() | Mfr Part No MM74HC943J | Fairchild Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 20 | FAIRCHILD SEMICONDUCTOR CORP | 85 °C | -40 °C | CERAMIC | DIP | DIP, DIP20,.3 | DIP20,.3 | RECTANGULAR | IN-LINE | Transferred | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T20 | Not Qualified | INDUSTRIAL | MODEM | ||||||||||||||||||||
![]() | Mfr Part No SY87701ALZI | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 28 | MICREL INC | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, SOP28,.4 | SOP28,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | No | 3.3 V | e0 | Tin/Lead (Sn75Pb25) | ATM; SDH; SONET | 8542.39.00.01 | DUAL | GULL WING | 240 | 1 | 1.27 mm | not_compliant | 30 | 28 | R-PDSO-G28 | Not Qualified | INDUSTRIAL | 0.16 mA | 2.65 mm | ATM/SONET/SDH CLOCK RECOVERY CIRCUIT | 17.93 mm | 7.52 mm | |||||||||
![]() | Mfr Part No TEA1062/C4 | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | NXP SEMICONDUCTORS | 75 °C | -25 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | DIP | Yes | 2.7 V | e3 | TIN | 8542.39.00.01 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 16 | R-PDIP-T16 | Not Qualified | COMMERCIAL EXTENDED | 4.32 mm | TELEPHONE SPEECH CIRCUIT | 38.1 mm | 7.62 mm | |||||||||||||||
![]() | Mfr Part No BCM88280CB1IFSBG | Broadcom Limited | Datasheet | 160 | - | Min: 1 Mult: 1 |
HT9312B
Holtek Semiconductor Inc
Package:Interface - Telecom
Price: please inquire
SIW1711FIF
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
NE5750N
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
NE5750N
Philips Semiconductors
Package:Interface - Telecom
Price: please inquire
AD614BS
Stanley Engineered Fastening
Package:Interface - Telecom
Price: please inquire
TP13067ADWR
Texas Instruments
Package:Interface - Telecom
Price: please inquire
RF9904
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
S1T2418G01-D0B0
Samsung Semiconductor
Package:Interface - Telecom
Price: please inquire
RF5722
RF Micro Devices Inc
Package:Interface - Telecom
Price: please inquire
AP22803AM8-13
Diodes Incorporated
Package:Interface - Telecom
Price: please inquire
SC14420CQ
Texas Instruments
Package:Interface - Telecom
Price: please inquire
ADL5360XCPZ-R7
Analog Devices Inc
Package:Interface - Telecom
Price: please inquire
PBL3798
Ericsson
Package:Interface - Telecom
Price: please inquire
IDT77V500S27PFI
Integrated Device Technology Inc
Package:Interface - Telecom
Price: please inquire
CLRC66303HN/TRAYB
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
MM74HC943J
Texas Instruments
Package:Interface - Telecom
Price: please inquire
MM74HC943J
Fairchild Semiconductor Corporation
Package:Interface - Telecom
Price: please inquire
SY87701ALZI
Microchip Technology Inc
Package:Interface - Telecom
Price: please inquire
TEA1062/C4
NXP Semiconductors
Package:Interface - Telecom
Price: please inquire
BCM88280CB1IFSBG
Broadcom Limited
Package:Interface - Telecom
Price: please inquire
