The category is 'Embedded - Microcontrollers - Application Specific'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | uPs/uCs/Peripheral ICs Type | Supply Current-Max | Seated Height-Max | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | Number of Serial I/Os | Bus Compatibility | Data Transfer Rate-Max | Time-Min | Interrupt Capability | Volatile | Communication Protocol | Information Access Method | Host Data Transfer Rate-Max | Display Configuration | Length | Width |
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![]() | Mfr Part No XCZU2EG-2LSFVC784I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FCBGA-784 | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Yes | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No OX16C950-PCC60-B | PLX Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | 60 MHz | PLX TECHNOLOGY INC | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Obsolete | LCC | No | 5.25 V | 4.75 V | 5 V | 8542.31.00.01 | QUAD | J BEND | NOT SPECIFIED | 1.27 mm | unknown | NOT SPECIFIED | 44 | S-PQCC-J44 | Not Qualified | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 2.34 mm | 3 | NO | YES | 8 | 1 | 7.5 MBps | ASYNC, BIT | 16.61 mm | 16.61 mm | ||||||||||||||||||
![]() | Mfr Part No TC8566AF | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 16.5 MHz | TOSHIBA CORP | 85 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP, | RECTANGULAR | FLATPACK | Obsolete | QFP | No | 5.5 V | 4.5 V | 5 V | e0 | TIN LEAD | 8542.31.00.01 | QUAD | GULL WING | unknown | 100 | R-PQFP-G100 | Not Qualified | INDUSTRIAL | SECONDARY STORAGE CONTROLLER, FLOPPY DISK DRIVE | 30 mA | 8 | 0.0625 MBps | |||||||||||||||||||||||||
![]() | Mfr Part No PDI1394L11D | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 80 | NXP SEMICONDUCTORS | 70 °C | PLASTIC/EPOXY | QFP | QFP, | RECTANGULAR | FLATPACK | Obsolete | QFP | 3.6 V | 3 V | 3.3 V | 8542.31.00.01 | QUAD | GULL WING | 0.8 mm | unknown | 80 | R-PQFP-G80 | Not Qualified | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 3.2 mm | 8 | NO | NO | 8 | 1 | ASYNC, BIT | 20 mm | 14 mm | |||||||||||||||||||||||
![]() | Mfr Part No PDI1394L11D | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 80 | PHILIPS SEMICONDUCTORS | 70 °C | PLASTIC/EPOXY | QFP | QFP, QFP80,.7X.9,32 | QFP80,.7X.9,32 | RECTANGULAR | FLATPACK | Transferred | No | 3.3 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | GULL WING | 0.8 mm | unknown | R-PQFP-G80 | Not Qualified | COMMERCIAL | 150 mA | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No SDIN8DE2-4G-XI | SanDisk Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | SANDISK CORP | 85 °C | -40 °C | UNSPECIFIED | DIE | DIE, | RECTANGULAR | UNCASED CHIP | Obsolete | Yes | 3.6 V | 2.7 V | 3.3 V | 8542.31.00.01 | UPPER | NO LEAD | unknown | R-XUUC-N | INDUSTRIAL | SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE | 120 MBps | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU9CG-2LFFVC900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | ADVANCED MICRO DEVICES INC | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | Yes | 0.85 V | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | |||||||||||||||||||||||||||||||
![]() | Mfr Part No RTL8110SB-LF | Realtek Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 128 | REALTEK SEMICONDUCTOR CORP | 70 °C | PLASTIC/EPOXY | QFP | QFP128,.67X.93,20 | RECTANGULAR | FLATPACK | Contact Manufacturer | 5.5 V | 4.5 V | 5 V | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 0.5 mm | unknown | NOT SPECIFIED | R-PQFP-G128 | Not Qualified | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, LAN | NO | 1 | ASYNC, BIT | |||||||||||||||||||||||||||||
![]() | Mfr Part No PT8A2704W | Pericom Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | PERICOM TECHNOLOGY INC | , | Transferred | 8542.31.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PSB50388EL | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 2017-10-28 | INTEL CORP | , | Obsolete | 8542.31.00.01 | compliant | MICROPROCESSOR CIRCUIT | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No RG82855PMSL6TJ | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 593 | INTEL CORP | BGA | BGA, BGA593,29X29,50 | BGA593,29X29,50 | SQUARE | GRID ARRAY | Obsolete | No | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | compliant | S-XBGA-B593 | Not Qualified | |||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No VT8235(CD)-G(DNW3) | VIA Technologies Inc | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SED1278FOH | Epson Electronics America Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 80 | 2 MHz | SEIKO EPSON CORP | 75 °C | -20 °C | PLASTIC/EPOXY | QFP | QFP, | RECTANGULAR | FLATPACK | Obsolete | QFP | No | 5.5 V | 4.5 V | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | GULL WING | 0.8 mm | unknown | 80 | R-PQFP-G80 | Not Qualified | COMMERCIAL EXTENDED | DISPLAY CONTROLLER, DOT MATRIX LCD DRIVER | 3.4 mm | 1 | 8 | 16 X 40 DOTS | 20 mm | 14 mm | |||||||||||||||||||||
![]() | Mfr Part No TMS37F158LGIDBTRG4 | Texas Instruments | Datasheet | 1200 | - | Min: 1 Mult: 1 | YES | 30 | TEXAS INSTRUMENTS INC | 2 | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Obsolete | Yes | 3.6 V | 2 V | e4 | Yes | NICKEL PALLADIUM GOLD | DUAL | GULL WING | 260 | compliant | 30 | R-PDSO-G30 | INDUSTRIAL | MICROPROCESSOR CIRCUIT | SPI; UART; USART | |||||||||||||||||||||||||||||
![]() | Mfr Part No UPD7210 | NEC Electronics Group | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU19EG-3FFVE1924I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1924 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | Yes | 0.9 V | e1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1924 | INDUSTRIAL | PROGRAMMABLE SoC | 3.71 mm | 45 mm | 45 mm | ||||||||||||||||||||||||||||
![]() | Mfr Part No SED1345F0A | Seiko Epson Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 80 | SEIKO EPSON CORP | PLASTIC/EPOXY | QFP | QFP, FL(UNSPEC) | FL(UNSPEC) | RECTANGULAR | FLATPACK | Obsolete | No | 5 V | e0 | TIN LEAD | 8542.31.00.01 | QUAD | GULL WING | 0.8 mm | unknown | R-PQFP-G80 | Not Qualified | DISPLAY CONTROLLER, CRT TO LCD CONVERTER | 3.4 mm | 640 X 480 DOTS | 20 mm | 14 mm | ||||||||||||||||||||||||||||||
![]() | Mfr Part No QGE7320MCSL8EF | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No BCM50991ELB0KFEBG | Broadcom Limited | Datasheet | 8000 | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No NS32FX211N | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | NO | 16 | 0.032 MHz | NATIONAL SEMICONDUCTOR CORP | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP16,.3 | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | No | 5.25 V | 4.75 V | 5 V | e0 | EAR99 | TIN LEAD | PRESCALED XTAL OSCILLATOR OUTPUT FOR RTC | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T16 | Not Qualified | COMMERCIAL | TIMER, REAL TIME CLOCK | 1 mA | 5.08 mm | 4 | 1/10 SECOND | N | YES | PARALLEL, DIRECT ADDRESS | 21.755 mm | 7.62 mm |
XCZU2EG-2LSFVC784I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
OX16C950-PCC60-B
PLX Technology
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
TC8566AF
Toshiba America Electronic Components
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PDI1394L11D
NXP Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PDI1394L11D
Philips Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SDIN8DE2-4G-XI
SanDisk Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU9CG-2LFFVC900I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
RTL8110SB-LF
Realtek Semiconductor
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PT8A2704W
Pericom Technology Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PSB50388EL
Intel Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
RG82855PMSL6TJ
Intel Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
VT8235(CD)-G(DNW3)
VIA Technologies Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SED1278FOH
Epson Electronics America Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
TMS37F158LGIDBTRG4
Texas Instruments
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
UPD7210
NEC Electronics Group
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU19EG-3FFVE1924I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SED1345F0A
Seiko Epson Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
QGE7320MCSL8EF
Intel Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
BCM50991ELB0KFEBG
Broadcom Limited
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
NS32FX211N
Texas Instruments
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
