The category is 'Clock/Timing - Application Specific'
- All Manufacturers
- Differential - Input:Output
- Input
- Main Purpose
- Mounting Type
- Number of Circuits
- Operating Temperature
- Output
- PLL
- Package / Case
- Ratio - Input:Output
- Frequency(Max)
- Moisture Sensitivity Level (MSL)
- Package / Case:
256-LBGA, CSBGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Frequency-Max | Frequency(Max) | Mfr | Number of Elements | Package | Product Status | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Supply Voltage | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Output | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Number of Circuits | Input | Ratio - Input:Output | PLL | Differential - Input:Output | Telecom IC Type | Main Purpose | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No DS31406GN2 | Microchip Technology | Datasheet | 31 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) | 750MHz | -40°C~85°C | Tray | Active | 3 (168 Hours) | 1.8V | DS31406 | CML, LVDS, LVPECL | 1 | CMOS, TTL | 2:14 | Yes | Yes/Yes | Ethernet, SONET/SDH, Stratum, Telecom | ROHS3 Compliant | |||||||||||||||||||||||||||||
 | Mfr Part No DS3100GN | Microchip Technology | Datasheet | 51 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 256-LBGA, CSBGA | 256 | 311.04MHz | -40°C~85°C | Tray | 2012 | Obsolete | 3 (168 Hours) | 1.62V~1.98V | DS3100 | CMOS, LVDS, TTL | 1 | CMOS, LVDS, LVPECL, TTL | 14:11 | Yes | Yes/Yes | ATM/SONET/SDH SUPPORT CIRCUIT | Ethernet, SONET/SDH, Stratum, Telecom | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||
 | Mfr Part No DS31400GN | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA, CSBGA | YES | 750MHz | -40°C~85°C | Tray | e0 | Obsolete | 3 (168 Hours) | 256 | TIN LEAD | 1.8V | BOTTOM | BALL | 240 | 1 | 1.8V | 30 | DS31400 | CML, CMOS, LVDS, LVPECL, TTL | 256 | S-PBGA-B256 | Not Qualified | 1 | CMOS, TTL | 8:14 | Yes | Yes/Yes | ATM/SONET/SDH SUPPORT CIRCUIT | Ethernet, SONET/SDH, Stratum, Telecom | Non-RoHS Compliant | |||||||||||||||||
| Mfr Part No DS31407GN2 | Microchip Technology | Datasheet | 2640 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) | 750MHz | -40°C~85°C | Tray | Active | 3 (168 Hours) | 1.8V | DS31407 | CML, CMOS, LVDS, LVPECL, TTL | 1 | CMOS, TTL | 3:4 | Yes | Yes/Yes | Ethernet, SONET/SDH, Stratum, Telecom | ROHS3 Compliant | |||||||||||||||||||||||||||||
| Mfr Part No DS31404GN2 | Microchip Technology | Datasheet | 25 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA, CSBGA | 750MHz | -40°C~85°C | Tray | Active | 3 (168 Hours) | 1.8V | CML, CMOS, LVDS, LVPECL, TTL | 2 | CMOS, TTL | 4:8 | Yes | Yes/Yes | Ethernet, SONET/SDH, Stratum, Telecom | ROHS3 Compliant | |||||||||||||||||||||||||||||||
| Mfr Part No DS31408GN | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 256-LBGA, CSBGA | 256 | 750MHz | 2 | -40°C~85°C | Tray | Obsolete | 3 (168 Hours) | 256 | BOTTOM | BALL | 1 | 1.8V | DS31408 | CML, CMOS, LVDS, LVPECL, TTL | 256 | 1.8V | 1 | CMOS, TTL | 8:14 | Yes | Yes/Yes | ATM/SONET/SDH SUPPORT CIRCUIT | Ethernet, SONET/SDH, Stratum, Telecom | No | Non-RoHS Compliant | Lead Free | |||||||||||||||||||
| Mfr Part No DS3101GN | Analog Devices | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) | 311.04MHz | Analog Devices Inc./Maxim Integrated | Bulk | Active | -40°C ~ 85°C | - | 1.62V ~ 3.465V | CMOS, LVDS, TTL | 1 | CMOS, LVDS, LVPECL, TTL | 14:11 | Yes | No/No | SONET/SDH, Stratum | |||||||||||||||||||||||||||||||
| Mfr Part No DS31415GN2 | Microchip Technology | Datasheet | 31 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) | 750MHz | -40°C~85°C | Tray | Active | 3 (168 Hours) | 1.8V | CML, CMOS, LVDS, LVPECL, TTL | 1 | CMOS, TTL | 3:4 | Yes | Yes/Yes | Ethernet, SONET/SDH, Stratum, Telecom | ROHS3 Compliant | ||||||||||||||||||||||||||||||
| Mfr Part No DS3101GN | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA, CSBGA | YES | 256 | 311.04MHz | -40°C~85°C | Tray | 2012 | e0 | Obsolete | 3 (168 Hours) | 256 | TIN LEAD | 1.62V~3.465V | BOTTOM | BALL | 245 | 1 | 1.8V | CMOS, LVDS, TTL | 256 | 1 | CMOS, LVDS, LVPECL, TTL | 14:11 | Yes | No/No | ATM/SONET/SDH SUPPORT CIRCUIT | SONET/SDH, Stratum | No | Non-RoHS Compliant | ||||||||||||||||||
| Mfr Part No DS3100GN2 | Microchip Technology | Datasheet | 31 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) | 311.04MHz | -40°C~85°C | Tray | Active | 3 (168 Hours) | 1.62V~1.98V | DS3100 | CMOS, LVDS, TTL | 1 | CMOS, LVDS, LVPECL, TTL | 14:11 | Yes | Yes/Yes | Ethernet, SONET/SDH, Stratum, Telecom | ROHS3 Compliant | |||||||||||||||||||||||||||||
| Mfr Part No DS31408GN2 | Microchip Technology | Datasheet | 4960 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA, CSBGA | 256-CSBGA (17x17) | 750MHz | -40°C~85°C | Tray | Active | 3 (168 Hours) | 1.8V | DS31408 | CML, CMOS, LVDS, LVPECL, TTL | 1 | CMOS, TTL | 8:14 | Yes | Yes/Yes | Ethernet, SONET/SDH, Stratum, Telecom | ROHS3 Compliant | |||||||||||||||||||||||||||||
| Mfr Part No DS31400GN2 | Microchip Technology | Datasheet | 7 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA, CSBGA | 256-CSPBGA (17x17) | 750MHz | -40°C~85°C | Tray | Active | 3 (168 Hours) | 1.8V | DS31400 | CML, CMOS, LVDS, LVPECL, TTL | 1 | CMOS, TTL | 8:14 | Yes | Yes/Yes | Ethernet, SONET/SDH, Stratum, Telecom | ROHS3 Compliant | |||||||||||||||||||||||||||||
| Mfr Part No DS3101GN | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA, CSBGA | YES | 311.04MHz | -40°C~85°C | Tray | 2009 | e1 | yes | Obsolete | 3 (168 Hours) | 256 | TIN SILVER COPPER | 1.62V~3.465V | BOTTOM | BALL | 260 | 1 | 1.8V | compliant | NOT SPECIFIED | CMOS, LVDS, TTL | 256 | S-PBGA-B256 | Not Qualified | 1 | CMOS, LVDS, LVPECL, TTL | 14:11 | Yes | No/No | ATM/SONET/SDH SUPPORT CIRCUIT | SONET/SDH, Stratum |
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DS31406GN2
Microchip Technology
Package:Clock/Timing - Application Specific
33.179694
-
DS3100GN
Microchip Technology
Package:Clock/Timing - Application Specific
Price: please inquire
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DS31400GN
Microchip Technology
Package:Clock/Timing - Application Specific
Price: please inquire
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DS31407GN2
Microchip Technology
Package:Clock/Timing - Application Specific
15.073083
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DS31404GN2
Microchip Technology
Package:Clock/Timing - Application Specific
22.298360
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DS31408GN
Microchip Technology
Package:Clock/Timing - Application Specific
Price: please inquire
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DS3101GN
Analog Devices
Package:Clock/Timing - Application Specific
Price: please inquire
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DS31415GN2
Microchip Technology
Package:Clock/Timing - Application Specific
16.180176
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DS3101GN
Microchip Technology
Package:Clock/Timing - Application Specific
Price: please inquire
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DS3100GN2
Microchip Technology
Package:Clock/Timing - Application Specific
57.238372
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DS31408GN2
Microchip Technology
Package:Clock/Timing - Application Specific
68.648483
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DS31400GN2
Microchip Technology
Package:Clock/Timing - Application Specific
63.027173
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DS3101GN
Microsemi Corporation
Package:Clock/Timing - Application Specific
Price: please inquire