The category is 'Embedded - CPLDs (Complex Programmable Logic Devices)'
- All Manufacturers
- Base Part Number
- Delay Time tpd(1) Max
- Mounting Type
- Number of I/Os
- Number of Logic Elements/Blocks
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Programmable Type
- Series
- Voltage Supply - Internal
- Base Part Number:
EPM2210
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Brand | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting Styles | Number of I/O Lines | Number of I/Os | Number of Macrocells | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Unit Weight | Operating Temperature | Packaging | Series | Tolerance | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Temperature Coefficient | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Power Rating | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Termination Style | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Programmable Type | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | Propagation Delay | Turn On Delay Time | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Operating Temperature Range | Max Frequency | Number of Logic Blocks (LABs) | Output Function | Number of Macro Cells | JTAG BST | Voltage Supply - Internal | Delay Time tpd(1) Max | Number of Logic Elements/Blocks | In-System Programmable | Features | Product Category | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No EPM2210F324C3 | Intel | Datasheet | 3 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 324-BGA | YES | 272 | 0°C~85°C TJ | Tray | MAX® II | e0 | Active | 3 (168 Hours) | 324 | 3A991 | TIN LEAD | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 220 | 2.5V | 1mm | 30 | EPM2210 | S-PBGA-B324 | Not Qualified | 2.625V | 1.5/3.32.5/3.3V | 2.375V | In System Programmable | 7 ns | MACROCELL | 1700 | YES | 2.5V 3.3V | 7ns | 2210 | 2.2mm | 19mm | 19mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EPM2210GF324C5 | Intel | Datasheet | 414 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 324-BGA | YES | 272 | 0°C~85°C TJ | Tray | MAX® II | e0 | Active | 3 (168 Hours) | 324 | 3A991 | TIN LEAD | YES | 8542.39.00.01 | BOTTOM | BALL | 220 | 1.8V | 1mm | 30 | EPM2210 | S-PBGA-B324 | Not Qualified | 1.89V | 1.5/3.31.8V | 1.71V | In System Programmable | 11.2 ns | MACROCELL | 1700 | YES | 1.71V~1.89V | 7ns | 2210 | 2.2mm | 19mm | 19mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EPM2210GF324C4N | Intel | Datasheet | 2419 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 324-BGA | YES | 272 | 0°C~85°C TJ | Tray | MAX® II | e1 | Active | 3 (168 Hours) | 324 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.8V | 1mm | 40 | EPM2210 | S-PBGA-B324 | Not Qualified | 1.89V | 1.5/3.31.8V | 1.71V | In System Programmable | 9.1 ns | MACROCELL | 1700 | YES | 1.71V~1.89V | 7ns | 2210 | 2.2mm | 19mm | 19mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EPM2210GF256C5 | Intel | Datasheet | 72 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-BGA | YES | 204 | 0°C~85°C TJ | Tray | MAX® II | e0 | Active | 3 (168 Hours) | 256 | 3A991 | TIN LEAD | YES | 8542.39.00.01 | BOTTOM | BALL | 220 | 1.8V | 1mm | 30 | EPM2210 | S-PBGA-B256 | Not Qualified | 1.89V | 1.5/3.31.8V | 1.71V | In System Programmable | 11.2 ns | MACROCELL | 1700 | YES | 1.71V~1.89V | 7ns | 2210 | 2.2mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EPM2210GF256I5 | Intel | Datasheet | 792 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-BGA | YES | 204 | -40°C~100°C TJ | Tray | MAX® II | e0 | Active | 3 (168 Hours) | 256 | 3A991 | TIN LEAD | YES | 8542.39.00.01 | BOTTOM | BALL | 220 | 1.8V | 1mm | 30 | EPM2210 | S-PBGA-B256 | Not Qualified | 1.89V | 1.5/3.31.8V | 1.71V | In System Programmable | 11.2 ns | MACROCELL | 1700 | YES | 1.71V~1.89V | 7ns | 2210 | 2.2mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EPM2210GF256C4N | Intel | Datasheet | 364 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-BGA | YES | 204 | 0°C~85°C TJ | Tray | MAX® II | e1 | Active | 3 (168 Hours) | 256 | 3A991 | TIN SILVER COPPER | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.8V | 1mm | 40 | EPM2210 | S-PBGA-B256 | Not Qualified | 1.89V | 1.5/3.31.8V | 1.71V | In System Programmable | 9.1 ns | MACROCELL | 1700 | YES | 1.71V~1.89V | 7ns | 2210 | 2.2mm | 17mm | 17mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EPM2210GF324I5N | Intel | Datasheet | 2420 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 324-BGA | YES | 272 | -40°C~100°C TJ | Tray | MAX® II | e1 | Active | 3 (168 Hours) | 324 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.8V | 1mm | 40 | EPM2210 | S-PBGA-B324 | Not Qualified | 1.89V | 1.5/3.31.8V | 1.71V | In System Programmable | 11.2 ns | MACROCELL | 1700 | YES | 1.71V~1.89V | 7ns | 2210 | 2.2mm | 19mm | 19mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EPM2210GF324C3 | Intel | Datasheet | 471 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 324-BGA | YES | 272 | 0°C~85°C TJ | Tray | MAX® II | e0 | Active | 3 (168 Hours) | 324 | 3A991 | TIN LEAD | YES | 8542.39.00.01 | BOTTOM | BALL | 220 | 1.8V | 1mm | 30 | EPM2210 | S-PBGA-B324 | Not Qualified | 1.89V | 1.5/3.31.8V | 1.71V | In System Programmable | 7 ns | MACROCELL | 1700 | YES | 1.71V~1.89V | 7ns | 2210 | 2.2mm | 19mm | 19mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EPM2210GF324C5N | Intel | Datasheet | 2420 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 324-BGA | YES | 272 | 0°C~85°C TJ | Tray | MAX® II | e1 | Active | 3 (168 Hours) | 324 | 3A991 | TIN SILVER COPPER | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.8V | 1mm | 40 | EPM2210 | S-PBGA-B324 | Not Qualified | 1.89V | 1.5/3.31.8V | 1.71V | In System Programmable | 11.2 ns | MACROCELL | 1700 | YES | 1.71V~1.89V | 7ns | 2210 | 2.2mm | 19mm | 19mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EPM2210GF256C3 | Intel | Datasheet | 528 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-BGA | YES | 204 | 0°C~85°C TJ | Tray | MAX® II | e0 | Active | 3 (168 Hours) | 256 | 3A991 | TIN LEAD | YES | 8542.39.00.01 | BOTTOM | BALL | 220 | 1.8V | 1mm | 30 | EPM2210 | S-PBGA-B256 | Not Qualified | 1.89V | 1.5/3.31.8V | 1.71V | In System Programmable | 7 ns | MACROCELL | 1700 | YES | 1.71V~1.89V | 7ns | 2210 | 2.2mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EPM2210GF324C3N | Intel | Datasheet | 174 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 324-BGA | YES | 272 | 0°C~85°C TJ | Tray | MAX® II | e1 | Active | 3 (168 Hours) | 324 | 3A991 | TIN SILVER COPPER | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.8V | 1mm | 40 | EPM2210 | S-PBGA-B324 | Not Qualified | 1.89V | 1.5/3.31.8V | 1.71V | In System Programmable | 7 ns | MACROCELL | 1700 | YES | 1.71V~1.89V | 7ns | 2210 | 2.2mm | 19mm | 19mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EPM2210GF324I5 | Intel | Datasheet | 504 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 324-BGA | YES | 272 | -40°C~100°C TJ | Tray | MAX® II | e0 | Active | 3 (168 Hours) | 324 | 3A991 | TIN LEAD | YES | 8542.39.00.01 | BOTTOM | BALL | 220 | 1.8V | 1mm | 30 | EPM2210 | S-PBGA-B324 | Not Qualified | 1.89V | 1.5/3.31.8V | 1.71V | In System Programmable | 11.2 ns | MACROCELL | 1700 | YES | 1.71V~1.89V | 7ns | 2210 | 2.2mm | 19mm | 19mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EPM2210GF256C4 | Intel | Datasheet | 714 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-BGA | YES | 204 | 0°C~85°C TJ | Tray | MAX® II | e0 | Active | 3 (168 Hours) | 256 | 3A991 | TIN LEAD | YES | 8542.39.00.01 | BOTTOM | BALL | 220 | 1.8V | 1mm | 30 | EPM2210 | S-PBGA-B256 | Not Qualified | 1.89V | 1.5/3.31.8V | 1.71V | In System Programmable | 9.1 ns | MACROCELL | 1700 | YES | 1.71V~1.89V | 7ns | 2210 | 2.2mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EPM2210GF324C4 | Intel | Datasheet | 541 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 324-BGA | YES | 272 | 0°C~85°C TJ | Tray | MAX® II | e0 | Active | 3 (168 Hours) | 324 | 3A991 | TIN LEAD | YES | 8542.39.00.01 | BOTTOM | BALL | 220 | 1.8V | 1mm | 30 | EPM2210 | S-PBGA-B324 | Not Qualified | 1.89V | 1.5/3.31.8V | 1.71V | In System Programmable | 9.1 ns | MACROCELL | 1700 | YES | 1.71V~1.89V | 7ns | 2210 | 2.2mm | 19mm | 19mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EPM2210F324A5N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 324-BGA | YES | 272 | -40°C~125°C TJ | Tray | MAX® II | e1 | Active | 3 (168 Hours) | 324 | 3A991 | TIN SILVER COPPER | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 2.5V | 1mm | 40 | EPM2210 | S-PBGA-B324 | Not Qualified | 2.625V | 1.5/3.32.5/3.3V | 2.375V | In System Programmable | 11.2 ns | MACROCELL | 1700 | YES | 2.5V 3.3V | 7ns | 2210 | 2.2mm | 19mm | 19mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EPM2210F324C3N | ALTERA | Datasheet | 1849 |
| Min: 1 Mult: 1 | Surface Mount | Surface Mount | 324-BGA | YES | 324 | 324-FBGA (19x19) | 324 | TE Connectivity / Holsworthy | 1 | INTEL CORP | TE Connectivity | EPM2210F324C3N | + 225 C | FLASH | - 25 C | 3 | Chassis Mount | 272 | 272 | 1700 | 85 °C | PLASTIC/EPOXY | BGA | BGA, BGA324,18X18,40 | BGA324,18X18,40 | SQUARE | GRID ARRAY | 3-1879449-1 | Active | 40 | 1.2 | Compliant | Yes | 2.625 V | 2.375 V | 2.5 V | 1.890 lbs | 0°C ~ 85°C (TJ) | Bulk | TE | 5 % | e1 | Active | 440 PPM / C | 330 Ohms | TIN SILVER COPPER | 85 °C | 0 °C | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | Resistors | 400 W | Wirewound | BOTTOM | BALL | 260 | 1 mm | compliant | 3.01205 GHz | EPM2210 | Solder Lug | S-PBGA-B324 | Not Qualified | 3.3 V | 1.5/3.3,2.5/3.3 V | OTHER | In System Programmable | 3.6 V | 2.375 V | 1 kB | 55 mA | 7 ns | 7 ns | 0 DEDICATED INPUTS, 272 I/O | 2.2 mm | FLASH PLD | 2210 | Wirewound Resistors | - 25 C to + 225 C | 304 MHz | 221 | MACROCELL | 1700 | YES | 2.5V, 3.3V | 7.0ns | 2210 | YES | - | Wirewound Resistors - Chassis Mount | 282 mm | 40 mm | No | Lead Free | ||||||||||||||
| Mfr Part No EPM2210GF256C3 | ALTERA | Datasheet | 1692 |
| Min: 1 Mult: 1 | Surface Mount | 256-BGA | YES | 256-FBGA (17x17) | 256 | INTEL CORP | Intel Corporation | EPM2210GF256C3 | Altera | 3 | 204 | 204 | 1700 | 85 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.02 | No | 1.89 V | 1.71 V | 1.8 V | 0°C ~ 85°C (TJ) | Tray | MAX® II | e0 | Active | 3A991 | TIN LEAD | YES | 8542.39.00.01 | Programmable Logic Devices | CMOS | BOTTOM | BALL | 220 | 1 mm | compliant | EPM2210 | S-PBGA-B256 | Not Qualified | 1.5/3.3,1.8 V | COMMERCIAL EXTENDED | In System Programmable | 7 ns | 0 DEDICATED INPUTS, 204 I/O | 2.2 mm | FLASH PLD | MACROCELL | 1700 | YES | 1.71 V ~ 1.89 V | 7.0ns | 2210 | YES | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EPM2210GF324I5 | ALTERA | Datasheet | 2248 |
| Min: 1 Mult: 1 | Surface Mount | 324-BGA | YES | 324-FBGA (19x19) | 324 | INTEL CORP | Intel Corporation | EPM2210GF324I5 | 3 | 272 | 272 | 1700 | PLASTIC/EPOXY | BGA | BGA, BGA324,18X18,40 | BGA324,18X18,40 | SQUARE | GRID ARRAY | Active | 30 | 5.02 | No | 1.89 V | 1.71 V | 1.8 V | -40°C ~ 100°C (TJ) | Tray | MAX® II | e0 | Active | 3A991 | TIN LEAD | YES | 8542.39.00.01 | Programmable Logic Devices | CMOS | BOTTOM | BALL | 220 | 1 mm | compliant | EPM2210 | S-PBGA-B324 | Not Qualified | 1.5/3.3,1.8 V | In System Programmable | 11.2 ns | 0 DEDICATED INPUTS, 272 I/O | 2.2 mm | FLASH PLD | MACROCELL | 1700 | YES | 1.71 V ~ 1.89 V | 7.0ns | 2210 | YES | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EPM2210GF324C5 | ALTERA | Datasheet | 13 |
| Min: 1 Mult: 1 | Surface Mount | 324-BGA | YES | 324-FBGA (19x19) | 324 | INTEL CORP | Intel Corporation | EPM2210GF324C5 | 3 | 272 | 272 | 1700 | 85 °C | PLASTIC/EPOXY | BGA | BGA, BGA324,18X18,40 | BGA324,18X18,40 | SQUARE | GRID ARRAY | Active | 30 | 5.02 | No | 1.89 V | 1.71 V | 1.8 V | 0°C ~ 85°C (TJ) | Tray | MAX® II | e0 | Active | 3A991 | TIN LEAD | YES | 8542.39.00.01 | Programmable Logic Devices | CMOS | BOTTOM | BALL | 220 | 1 mm | compliant | EPM2210 | S-PBGA-B324 | Not Qualified | 1.5/3.3,1.8 V | COMMERCIAL EXTENDED | In System Programmable | 11.2 ns | 0 DEDICATED INPUTS, 272 I/O | 2.2 mm | FLASH PLD | MACROCELL | 1700 | YES | 1.71 V ~ 1.89 V | 7.0ns | 2210 | YES | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EPM2210GF256I5N | ALTERA | Datasheet | 352 |
| Min: 1 Mult: 1 | Surface Mount | 256-BGA | YES | 256-FBGA (17x17) | 256 | INTEL CORP | Intel Corporation | EPM2210GF256I5N | 3 | 204 | 204 | 1700 | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | 40 | 1.23 | Yes | 1.89 V | 1.71 V | 1.8 V | -40°C ~ 100°C (TJ) | Tray | MAX® II | e1 | Active | 3A991 | TIN SILVER COPPER | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | Programmable Logic Devices | CMOS | BOTTOM | BALL | 260 | 1 mm | compliant | EPM2210 | S-PBGA-B256 | Not Qualified | 1.5/3.3,1.8 V | In System Programmable | 11.2 ns | 0 DEDICATED INPUTS, 204 I/O | 2.2 mm | FLASH PLD | MACROCELL | 1700 | YES | 1.71 V ~ 1.89 V | 7.0ns | 2210 | YES | 17 mm | 17 mm |
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EPM2210F324C3
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
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EPM2210GF324C5
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
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EPM2210GF324C4N
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
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EPM2210GF256C5
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
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EPM2210GF256I5
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
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EPM2210GF256C4N
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
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EPM2210GF324I5N
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
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EPM2210GF324C3
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
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EPM2210GF324C5N
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
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EPM2210GF256C3
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
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EPM2210GF324C3N
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
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EPM2210GF324I5
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
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EPM2210GF256C4
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
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EPM2210GF324C4
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
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EPM2210F324A5N
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
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EPM2210F324C3N
ALTERA
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
172.687254
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EPM2210GF256C3
ALTERA
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
202.316621
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EPM2210GF324I5
ALTERA
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
161.448304
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EPM2210GF324C5
ALTERA
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
101.930195
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EPM2210GF256I5N
ALTERA
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
114.040089