The category is 'Embedded - CPLDs (Complex Programmable Logic Devices)'
- All Manufacturers
- Additional Feature
- ECCN Code
- HTS Code
- JESD-609 Code
- JTAG BST
- Moisture Sensitivity Level (MSL)
- Number of I/Os
- Number of Macro Cells
- Number of Terminations
- Operating Supply Voltage
- Output Function
- Pbfree Code
- ECCN Code:
3A991.D
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Frequency(Max) | Memory Types | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Temperature Grade | Programmable Type | Propagation Delay | Organization | Programmable Logic Type | Number of Logic Elements/Cells | Number of Gates | Max Frequency | Number of Logic Blocks (LABs) | Speed Grade | Output Function | Number of Macro Cells | JTAG BST | Voltage Supply - Internal | Delay Time tpd(1) Max | Number of Logic Elements/Blocks | In-System Programmable | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No XCR3512XL-10FG324I | Xilinx Inc. | Datasheet | 2032 |
| Min: 1 Mult: 1 | 11 Weeks | Surface Mount | 324-BBGA | YES | EEPROM | 260 | -40°C~85°C TA | Bulk | 1996 | CoolRunner XPLA3 | e0 | no | Active | 3 (168 Hours) | 324 | 3A991.D | Tin/Lead (Sn63Pb37) | YES | 8542.39.00.01 | BOTTOM | BALL | 225 | 3.3V | 1mm | not_compliant | 30 | 324 | Not Qualified | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 10 ns | 12000 | 97MHz | 10 | MACROCELL | 512 | YES | 2.7V~3.6V | 9ns | 32 | 2.5mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||||
 | Mfr Part No XCR3384XL-12FT256C | Xilinx Inc. | Datasheet | 2390 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | Surface Mount | 256-LBGA | 256 | EEPROM | 212 | 0°C~70°C TA | Tray | 1996 | CoolRunner XPLA3 | e0 | no | Active | 3 (168 Hours) | 256 | 3A991.D | Tin/Lead (Sn63Pb37) | YES | 8542.39.00.01 | BOTTOM | BALL | 240 | 3.3V | 1mm | 30 | XCR3384XL | 256 | Not Qualified | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 12 ns | 24 | 9000 | 83MHz | 12 | MACROCELL | 384 | YES | 3V~3.6V | 10.8ns | 1.55mm | 17mm | 17mm | Non-RoHS Compliant | Contains Lead | |||||||||||||
| Mfr Part No XCR3512XL-7FG324C | Xilinx Inc. | Datasheet | 2909 | - | Min: 1 Mult: 1 | 11 Weeks | Surface Mount | 324-BBGA | YES | EEPROM | 260 | 0°C~70°C TA | Bulk | 1996 | CoolRunner XPLA3 | e0 | no | Active | 3 (168 Hours) | 324 | 3A991.D | YES | 8542.39.00.01 | BOTTOM | BALL | 225 | 3.3V | 1mm | not_compliant | 30 | 324 | Not Qualified | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 7.5 ns | 12000 | 135MHz | 7 | MACROCELL | 512 | YES | 3V~3.6V | 7ns | 32 | 2.5mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||
| Mfr Part No XCR3384XL-7FTG256C | Xilinx Inc. | Datasheet | 1759 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | Surface Mount | 256-LBGA | 256 | EEPROM | 212 | 0°C~70°C TA | Tray | 1996 | CoolRunner XPLA3 | e1 | yes | Active | 3 (168 Hours) | 256 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 30 | 256 | Not Qualified | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 7.5 ns | 24 | 9000 | 135MHz | 7 | MACROCELL | 384 | YES | 3V~3.6V | 7ns | 1.55mm | ROHS3 Compliant | |||||||||||||||||
| Mfr Part No XCR3384XL-12FT256I | Xilinx Inc. | Datasheet | 1673 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | Surface Mount | 256-LBGA | 256 | EEPROM | 212 | -40°C~85°C TA | Tray | 1996 | CoolRunner XPLA3 | e0 | no | Active | 3 (168 Hours) | 256 | 3A991.D | Tin/Lead (Sn63Pb37) | YES | 8542.39.00.01 | BOTTOM | BALL | 240 | 3.3V | 1mm | 30 | XCR3384XL | 256 | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 12 ns | 24 | 9000 | 83MHz | 12 | MACROCELL | 384 | YES | 2.7V~3.6V | 10.8ns | 1.55mm | 17mm | 17mm | No | Non-RoHS Compliant | Contains Lead | |||||||||||||
| Mfr Part No XCR3384XL-12FTG256C | Xilinx Inc. | Datasheet | 551 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | Surface Mount | 256-LBGA | 256 | EEPROM | 212 | 0°C~70°C TA | Tray | 1996 | CoolRunner XPLA3 | e1 | yes | Active | 3 (168 Hours) | 256 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 30 | 256 | Not Qualified | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 12 ns | 24 | 9000 | 83MHz | 12 | MACROCELL | 384 | YES | 3V~3.6V | 10.8ns | 1.55mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||||||
 | Mfr Part No XCR3384XL-10FG324I | Xilinx Inc. | Datasheet | 33 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | Surface Mount | 324-BBGA | 324 | EEPROM | 220 | -40°C~85°C TA | Tray | 1996 | CoolRunner XPLA3 | e0 | no | Active | 3 (168 Hours) | 324 | 3A991.D | Tin/Lead (Sn63Pb37) | YES | 8542.39.00.01 | BOTTOM | BALL | 225 | 3.3V | 1mm | not_compliant | 30 | XCR3384XL | 324 | Not Qualified | 3.3V | 3.6V | In System Programmable (min 1K program/erase cycles) | 10 ns | 24 | 9000 | 102MHz | 10 | MACROCELL | 384 | YES | 2.7V~3.6V | 9ns | 2.5mm | 23mm | 23mm | Non-RoHS Compliant | Contains Lead | ||||||||||||
| Mfr Part No XC2C384-10FG324C | Xilinx | Datasheet | 362 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | 324 | 125MHz | ROMless | 240 | e0 | no | 3 (168 Hours) | 324 | 3A991.D | Tin/Lead (Sn63Pb37) | 70°C | 0°C | YES | 8542.39.00.01 | BOTTOM | BALL | 225 | 1.8V | 1mm | not_compliant | 30 | 324 | Not Qualified | 1.8V | 1.9V | COMMERCIAL | 10 ns | FLASH PLD | 9000 | 24 | 10 | MACROCELL | 384 | YES | YES | 2.5mm | 23mm | 23mm | Non-RoHS Compliant | |||||||||||||||||||
| Mfr Part No XCR3384XL-10FTG256C | Xilinx | Datasheet | 262 | - | Min: 1 Mult: 1 | Surface Mount | 256 | 102MHz | EEPROM | 212 | e1 | yes | 3 (168 Hours) | 256 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 70°C | 0°C | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 30 | 256 | Not Qualified | 3.3V | 3.6V | COMMERCIAL | 10 ns | EE PLD | 9000 | 24 | 10 | MACROCELL | 384 | YES | YES | 1.55mm | 17mm | 17mm | RoHS Compliant | |||||||||||||||||||||
 | Mfr Part No XCR3512XL-7FGG324C | Xilinx | Datasheet | 652 | - | Min: 1 Mult: 1 | 6 Weeks | Surface Mount | FBGA | 324 | 135MHz | EEPROM | 260 | 1996 | e1 | yes | Active | 3 (168 Hours) | 324 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 70°C | 0°C | YES | 8542.39.00.01 | BOTTOM | BALL | 250 | 3.3V | 1mm | 30 | 324 | Not Qualified | 3.3V | 3.6V | COMMERCIAL | 7.5 ns | EE PLD | 12000 | 32 | 7 | MACROCELL | 512 | YES | YES | 2.5mm | 23mm | 23mm | RoHS Compliant | |||||||||||||||||
| Mfr Part No XCR3512XL-10FTG256C | Xilinx | Datasheet | 800 | - | Min: 1 Mult: 1 | Surface Mount | 256 | 97MHz | EEPROM | 212 | e1 | yes | 3 (168 Hours) | 256 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 70°C | 0°C | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 30 | 256 | Not Qualified | 3.3V | 3.6V | COMMERCIAL | 10 ns | EE PLD | 12000 | 32 | 10 | MACROCELL | 512 | YES | YES | 1.55mm | 17mm | 17mm | RoHS Compliant | |||||||||||||||||||||
| Mfr Part No XCR3384XL-10FT256C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256 | 102MHz | EEPROM | 212 | Bulk | e0 | no | 3 (168 Hours) | 256 | 3A991.D | Tin/Lead (Sn63Pb37) | 70°C | 0°C | YES | 8542.39.00.01 | BOTTOM | BALL | 240 | 3.3V | 1mm | 30 | 256 | Not Qualified | 3.3V | 3.6V | COMMERCIAL | 10 ns | EE PLD | 9000 | 24 | 10 | MACROCELL | 384 | YES | YES | 1.55mm | 17mm | 17mm | RoHS Compliant | Contains Lead | |||||||||||||||||||
| Mfr Part No XCR3384XL-12FTG256I | Xilinx | Datasheet | 12 | - | Min: 1 Mult: 1 | Surface Mount | 256 | 83MHz | EEPROM | 212 | e1 | yes | 3 (168 Hours) | 256 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 85°C | -40°C | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 30 | 256 | Not Qualified | 3.3V | 3.6V | INDUSTRIAL | 12 ns | EE PLD | 9000 | 24 | 12 | MACROCELL | 384 | YES | YES | 1.55mm | 17mm | 17mm | RoHS Compliant | |||||||||||||||||||||
| Mfr Part No XCR3384XL-10FGG324C | Xilinx | Datasheet | 452 | - | Min: 1 Mult: 1 | FBGA | YES | 102MHz | EEPROM | 220 | e1 | yes | 3 (168 Hours) | 324 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 70°C | 0°C | YES | 8542.39.00.01 | BOTTOM | BALL | 250 | 3.3V | 1mm | 30 | 324 | 3.3V | 3.6V | COMMERCIAL | 10 ns | 0 DEDICATED INPUTS, 220 I/O | EE PLD | 24 | 10 | MACROCELL | 384 | YES | YES | 2.5mm | 23mm | 23mm | No | RoHS Compliant | |||||||||||||||||||||
 | Mfr Part No XCR3512XL-10FGG324C | Xilinx | Datasheet | 382 | - | Min: 1 Mult: 1 | 6 Weeks | Surface Mount | FBGA | 324 | 97MHz | EEPROM | 260 | 1996 | e1 | yes | Active | 3 (168 Hours) | 324 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 70°C | 0°C | YES | 8542.39.00.01 | BOTTOM | BALL | 250 | 3.3V | 1mm | 30 | 324 | Not Qualified | 3.3V | 3.6V | COMMERCIAL | 10 ns | EE PLD | 12000 | 32 | 10 | MACROCELL | 512 | YES | YES | 2.5mm | 23mm | 23mm | RoHS Compliant | |||||||||||||||||
 | Mfr Part No XCR3512XL-12FGG324C | Xilinx | Datasheet | 417 | - | Min: 1 Mult: 1 | 6 Weeks | Surface Mount | FBGA | 324 | 77MHz | EEPROM | 260 | 1996 | e1 | yes | Active | 3 (168 Hours) | 324 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 70°C | 0°C | YES | 8542.39.00.01 | BOTTOM | BALL | 250 | 3.3V | 1mm | 30 | 324 | Not Qualified | 3.3V | 3.6V | COMMERCIAL | 12 ns | EE PLD | 12000 | 32 | 12 | MACROCELL | 512 | YES | YES | 2.5mm | 23mm | 23mm | RoHS Compliant | |||||||||||||||||
| Mfr Part No XCR3384XL-12FGG324C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA | YES | 83MHz | EEPROM | 220 | e1 | yes | 3 (168 Hours) | 324 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 70°C | 0°C | YES | 8542.39.00.01 | BOTTOM | BALL | 250 | 3.3V | 1mm | 30 | 324 | 3.3V | 3.6V | COMMERCIAL | 12 ns | 0 DEDICATED INPUTS, 220 I/O | EE PLD | 24 | 12 | MACROCELL | 384 | YES | YES | 2.5mm | 23mm | 23mm | No | RoHS Compliant | |||||||||||||||||||||
 | Mfr Part No XCR3512XL-12FGG324I | Xilinx | Datasheet | 514 | - | Min: 1 Mult: 1 | 6 Weeks | Surface Mount | FBGA | 324 | 77MHz | EEPROM | 260 | 1996 | e1 | yes | Active | 3 (168 Hours) | 324 | 3A991.D | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 85°C | -40°C | YES | 8542.39.00.01 | BOTTOM | BALL | 250 | 3.3V | 1mm | 30 | 324 | Not Qualified | 3.3V | 3.6V | INDUSTRIAL | 12 ns | EE PLD | 12000 | 32 | 12 | MACROCELL | 512 | YES | YES | 2.5mm | 23mm | 23mm | RoHS Compliant | |||||||||||||||||
| Mfr Part No XC2C384-7FG324C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | 324 | 217MHz | ROMless | 240 | e0 | no | 3 (168 Hours) | 324 | 3A991.D | 70°C | 0°C | YES | 8542.39.00.01 | BOTTOM | BALL | 225 | 1.8V | 1mm | not_compliant | 30 | 324 | Not Qualified | 1.8V | 1.9V | COMMERCIAL | 7.5 ns | FLASH PLD | 9000 | 24 | 7 | MACROCELL | 384 | YES | YES | 2.5mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||
| Mfr Part No XCR3384XL-7FG324C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | 324 | 135MHz | EEPROM | 220 | Bulk | e0 | no | 3 (168 Hours) | 324 | 3A991.D | 70°C | 0°C | YES | 8542.39.00.01 | BOTTOM | BALL | 225 | 3.3V | 1mm | not_compliant | 30 | 324 | Not Qualified | 3.3V | 3.6V | COMMERCIAL | 7.5 ns | EE PLD | 9000 | 24 | 7 | MACROCELL | 384 | YES | YES | 2.5mm | 23mm | 23mm | Non-RoHS Compliant | Contains Lead |
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XCR3512XL-10FG324I
Xilinx Inc.
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
259.174982
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XCR3384XL-12FT256C
Xilinx Inc.
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
133.002267
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XCR3512XL-7FG324C
Xilinx Inc.
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
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XCR3384XL-7FTG256C
Xilinx Inc.
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
241.801428
-
XCR3384XL-12FT256I
Xilinx Inc.
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
170.775994
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XCR3384XL-12FTG256C
Xilinx Inc.
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
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XCR3384XL-10FG324I
Xilinx Inc.
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
81.742953
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XC2C384-10FG324C
Xilinx
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
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XCR3384XL-10FTG256C
Xilinx
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
-
XCR3512XL-7FGG324C
Xilinx
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
-
XCR3512XL-10FTG256C
Xilinx
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
-
XCR3384XL-10FT256C
Xilinx
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
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XCR3384XL-12FTG256I
Xilinx
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
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XCR3384XL-10FGG324C
Xilinx
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
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XCR3512XL-10FGG324C
Xilinx
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
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XCR3512XL-12FGG324C
Xilinx
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
-
XCR3384XL-12FGG324C
Xilinx
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
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XCR3512XL-12FGG324I
Xilinx
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
-
XC2C384-7FG324C
Xilinx
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
-
XCR3384XL-7FG324C
Xilinx
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire