The category is 'Embedded - CPLDs (Complex Programmable Logic Devices)'
- All Manufacturers
- JESD-609 Code
- JTAG BST
- Moisture Sensitivity Level (MSL)
- Mounting Type
- Number of I/Os
- Number of Macro Cells
- Number of Terminations
- Operating Temperature
- Package / Case
- Packaging
- Part Status
- Peak Reflow Temperature (Cel)
- Package / Case:
256-BGA
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Memory Types | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Programmable Type | Max Supply Voltage | Min Supply Voltage | Clock Frequency | Propagation Delay | Turn On Delay Time | Number of Logic Elements/Cells | Number of Gates | Max Frequency | Speed Grade | Output Function | Number of Macro Cells | JTAG BST | Voltage Supply - Internal | Delay Time tpd(1) Max | Number of Logic Elements/Blocks | Height Seated (Max) | Length | Width | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No XC95288XL-7FG256C | Xilinx Inc. | Datasheet | 14 | - | Min: 1 Mult: 1 | 10 Weeks | Lead, Tin | Surface Mount | Surface Mount | 256-BGA | 256 | FLASH | 192 | 0°C~70°C TA | Tray | 1996 | XC9500XL | e0 | no | Active | 3 (168 Hours) | 256 | EAR99 | YES | 8542.39.00.01 | BOTTOM | BALL | 225 | 3.3V | 1mm | 30 | XC95288XL | 256 | Not Qualified | 3.3V | In System Programmable (min 10K program/erase cycles) | 3.6V | 3V | 7.5 ns | 7.5 ns | 16 | 6400 | 125MHz | 7 | MACROCELL | 288 | YES | 3V~3.6V | 2mm | Non-RoHS Compliant | Contains Lead | |||||||||||||
 | Mfr Part No EPM570F256C5 | Intel | Datasheet | 12 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-BGA | YES | 160 | 0°C~85°C TJ | Tray | MAX® II | e0 | Active | 3 (168 Hours) | 256 | EAR99 | TIN LEAD | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 220 | 2.5V | 1mm | 30 | EPM570 | S-PBGA-B256 | Not Qualified | 2.625V | 1.5/3.32.5/3.3V | 2.375V | In System Programmable | 8.7 ns | MACROCELL | 440 | YES | 2.5V 3.3V | 5.4ns | 570 | 2.2mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||
| Mfr Part No EPM1270F256C5N | Intel | Datasheet | 440 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-BGA | YES | 212 | 0°C~85°C TJ | Tray | MAX® II | e1 | Active | 3 (168 Hours) | 256 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 2.5V | 1mm | 40 | EPM1270 | S-PBGA-B256 | Not Qualified | 2.625V | 1.5/3.32.5/3.3V | 2.375V | In System Programmable | 10 ns | MACROCELL | 980 | YES | 2.5V 3.3V | 6.2ns | 1270 | 2.2mm | 17mm | 17mm | RoHS Compliant | |||||||||||||||||||
| Mfr Part No EPM570F256I5N | Intel | Datasheet | 15 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-BGA | YES | 160 | -40°C~100°C TJ | Tray | MAX® II | e1 | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 2.5V | 1mm | 40 | EPM570 | S-PBGA-B256 | Not Qualified | 2.625V | 1.5/3.32.5/3.3V | 2.375V | In System Programmable | 8.7 ns | MACROCELL | 440 | YES | 2.5V 3.3V | 5.4ns | 570 | 2.2mm | 17mm | 17mm | RoHS Compliant | |||||||||||||||||||
| Mfr Part No EPM2210F256C5N | Intel | Datasheet | 800 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-BGA | YES | 204 | 0°C~85°C TJ | Tray | MAX® II | e1 | Active | 3 (168 Hours) | 256 | TIN SILVER COPPER | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 2.5V | 1mm | 40 | EPM2210 | S-PBGA-B256 | Not Qualified | 2.625V | 1.5/3.32.5/3.3V | 2.375V | In System Programmable | 11.2 ns | MACROCELL | 1700 | YES | 2.5V 3.3V | 7ns | 2210 | 2.2mm | 17mm | 17mm | RoHS Compliant | ||||||||||||||||||||
| Mfr Part No EPM2210F256C4N | Intel | Datasheet | 619 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-BGA | YES | 204 | 0°C~85°C TJ | Tray | MAX® II | e1 | Active | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn/Ag/Cu) | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 2.5V | 1mm | 40 | EPM2210 | S-PBGA-B256 | Not Qualified | 2.625V | 1.5/3.32.5/3.3V | 2.375V | In System Programmable | 9.1 ns | MACROCELL | 1700 | YES | 2.5V 3.3V | 7ns | 2210 | 2.2mm | 17mm | 17mm | RoHS Compliant | ||||||||||||||||||||
| Mfr Part No XC95288XL-10FGG256C | Xilinx Inc. | Datasheet | 4 | - | Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | Surface Mount | 256-BGA | 256 | FLASH | 192 | 0°C~70°C TA | Tray | 1996 | XC9500XL | e1 | yes | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 30 | XC95288XL | 256 | Not Qualified | 3.3V | In System Programmable (min 10K program/erase cycles) | 3.6V | 3V | 10 ns | 10 ns | 16 | 6400 | 100MHz | 10 | MACROCELL | 288 | YES | 3V~3.6V | 2mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||
| Mfr Part No EPM570F256C5N | Intel | Datasheet | 864 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-BGA | YES | 160 | 0°C~85°C TJ | Tray | 2009 | MAX® II | e1 | Active | 3 (168 Hours) | 256 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 2.5V | 1mm | 40 | EPM570 | S-PBGA-B256 | Not Qualified | 2.625V | 1.5/3.32.5/3.3V | 2.375V | In System Programmable | 8.7 ns | MACROCELL | 440 | YES | 2.5V 3.3V | 5.4ns | 570 | 2.2mm | 17mm | 17mm | RoHS Compliant | |||||||||||||||||||
| Mfr Part No EPM1270F256I5N | Intel | Datasheet | 800 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-BGA | YES | 212 | -40°C~100°C TJ | Tray | 2003 | MAX® II | e1 | Active | 3 (168 Hours) | 256 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 250 | 2.5V | 1mm | 30 | EPM1270 | S-PBGA-B256 | Not Qualified | 2.625V | 1.5/3.32.5/3.3V | 2.375V | In System Programmable | 10 ns | MACROCELL | 980 | YES | 2.5V 3.3V | 6.2ns | 1270 | 2.2mm | 17mm | 17mm | RoHS Compliant | ||||||||||||||||||
| Mfr Part No EPM2210F256A5N | Intel | Datasheet | 106 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-BGA | YES | 204 | -40°C~125°C TJ | Tray | MAX® II | e1 | Active | 3 (168 Hours) | 256 | 3A991 | TIN SILVER COPPER | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 2.5V | 1mm | 40 | EPM2210 | S-PBGA-B256 | Not Qualified | 2.625V | 1.5/3.32.5/3.3V | 2.375V | In System Programmable | 11.2 ns | MACROCELL | 1700 | YES | 2.5V 3.3V | 7ns | 2210 | 2.2mm | 17mm | 17mm | RoHS Compliant | |||||||||||||||||||
| Mfr Part No EPM7256AEFC256-7N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-BGA | YES | 164 | 0°C~70°C TA | Tray | MAX® 7000A | e1 | Active | 3 (168 Hours) | 256 | 3A991 | TIN SILVER COPPER | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 40 | EPM7256 | Not Qualified | 3.6V | 2.5/3.33.3V | 3V | In System Programmable | 126.6MHz | 7.5 ns | 5000 | MACROCELL | 256 | YES | 3V~3.6V | 7.5ns | 16 | 2.1mm | 17mm | 17mm | RoHS Compliant | ||||||||||||||||||
| Mfr Part No XC95288XL-10FGG256I | Xilinx Inc. | Datasheet | 223 | - | Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | Surface Mount | 256-BGA | 256 | FLASH | 192 | -40°C~85°C TA | Tray | 1996 | XC9500XL | e1 | yes | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 30 | XC95288XL | 256 | Not Qualified | 3.3V | In System Programmable (min 10K program/erase cycles) | 3.6V | 3V | 10 ns | 10 ns | 16 | 6400 | 100MHz | 10 | MACROCELL | 288 | YES | 3V~3.6V | 2mm | 17mm | 17mm | ROHS3 Compliant | |||||||||||
 | Mfr Part No XC95288XL-10FG256C | Xilinx Inc. | Datasheet | 72 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 256-BGA | YES | FLASH | 192 | 0°C~70°C TA | Bulk | 1996 | XC9500XL | e0 | no | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn63Pb37) | YES | 8542.39.00.01 | BOTTOM | BALL | 225 | 3.3V | 1mm | not_compliant | 30 | 256 | S-PBGA-B256 | Not Qualified | 3.3V | 3.6V | In System Programmable (min 10K program/erase cycles) | 10 ns | 6400 | 100MHz | 10 | MACROCELL | 288 | YES | 3V~3.6V | 16 | 2mm | 17mm | 17mm | Non-RoHS Compliant | ||||||||||||||
| Mfr Part No EPM1270F256C5 | Intel | Datasheet | 8000 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-BGA | YES | 212 | 0°C~85°C TJ | Tray | MAX® II | e0 | Active | 3 (168 Hours) | 256 | 3A991 | TIN LEAD | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 220 | 2.5V | 1mm | 30 | EPM1270 | S-PBGA-B256 | Not Qualified | 2.625V | 1.5/3.32.5/3.3V | 2.375V | In System Programmable | 10 ns | MACROCELL | 980 | YES | 2.5V 3.3V | 6.2ns | 1270 | 2.2mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||
| Mfr Part No XC95288XL-7FGG256I | Xilinx Inc. | Datasheet | 16 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | Surface Mount | 256-BGA | 256 | FLASH | 192 | -40°C~85°C TA | Tray | 1996 | XC9500XL | e1 | yes | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 30 | XC95288XL | 256 | Not Qualified | 3.3V | In System Programmable (min 10K program/erase cycles) | 3.6V | 3V | 7.5 ns | 7.5 ns | 16 | 6400 | 125MHz | 7 | MACROCELL | 288 | YES | 3V~3.6V | 2mm | ROHS3 Compliant | |||||||||||||
| Mfr Part No EPM2210F256C5 | Intel | Datasheet | 12 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-BGA | YES | 204 | 0°C~85°C TJ | Tray | MAX® II | e0 | Active | 3 (168 Hours) | 256 | 3A991 | Tin/Lead (Sn/Pb) | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 220 | 2.5V | 1mm | 30 | EPM2210 | S-PBGA-B256 | Not Qualified | 2.625V | 1.5/3.32.5/3.3V | 2.375V | In System Programmable | 11.2 ns | MACROCELL | 1700 | YES | 2.5V 3.3V | 7ns | 2210 | 2.2mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||
| Mfr Part No XC95288XL-7FGG256C | Xilinx Inc. | Datasheet | 28 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | Surface Mount | 256-BGA | 256 | FLASH | 192 | 0°C~70°C TA | Tray | 1996 | XC9500XL | e1 | yes | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | YES | 8542.39.00.01 | BOTTOM | BALL | 260 | 3.3V | 1mm | 30 | XC95288XL | 256 | Not Qualified | 3.3V | In System Programmable (min 10K program/erase cycles) | 3.6V | 3V | 7.5 ns | 7.5 ns | 16 | 6400 | 125MHz | 7 | MACROCELL | 288 | YES | 3V~3.6V | 2mm | ROHS3 Compliant | |||||||||||||
| Mfr Part No EPM570F256C4N | Intel | Datasheet | 12 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-BGA | YES | 160 | 0°C~85°C TJ | Tray | 2009 | MAX® II | e1 | Active | 3 (168 Hours) | 256 | TIN SILVER COPPER | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 2.5V | 1mm | 40 | EPM570 | S-PBGA-B256 | Not Qualified | 2.625V | 1.5/3.32.5/3.3V | 2.375V | In System Programmable | 7 ns | MACROCELL | 440 | YES | 2.5V 3.3V | 5.4ns | 570 | 2.2mm | 17mm | 17mm | RoHS Compliant | |||||||||||||||||||
| Mfr Part No EPM1270GF256I5N | Intel | Datasheet | - |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-BGA | YES | 212 | -40°C~100°C TJ | Tray | MAX® II | e1 | Active | 3 (168 Hours) | 256 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.8V | 1mm | 40 | EPM1270 | S-PBGA-B256 | Not Qualified | 1.89V | 1.5/3.31.8V | 1.71V | In System Programmable | 10 ns | MACROCELL | 980 | YES | 1.71V~1.89V | 6.2ns | 1270 | 2.2mm | 17mm | 17mm | RoHS Compliant | |||||||||||||||||||
| Mfr Part No EPM2210F256I5N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-BGA | YES | 204 | -40°C~100°C TJ | Tray | 2003 | MAX® II | e1 | Active | 3 (168 Hours) | 256 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | IT CAN ALSO OPERATE AT 3.3V | 8542.39.00.01 | BOTTOM | BALL | 260 | 2.5V | 1mm | 40 | EPM2210 | S-PBGA-B256 | Not Qualified | 2.625V | 1.5/3.32.5/3.3V | 2.375V | In System Programmable | 11.2 ns | MACROCELL | 1700 | YES | 2.5V 3.3V | 7ns | 2210 | 2.2mm | 17mm | 17mm | RoHS Compliant |
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XC95288XL-7FG256C
Xilinx Inc.
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
-
EPM570F256C5
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
15.277439
-
EPM1270F256C5N
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
14.437516
-
EPM570F256I5N
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
-
EPM2210F256C5N
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
-
EPM2210F256C4N
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
-
XC95288XL-10FGG256C
Xilinx Inc.
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
-
EPM570F256C5N
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
-
EPM1270F256I5N
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
-
EPM2210F256A5N
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
-
EPM7256AEFC256-7N
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
-
XC95288XL-10FGG256I
Xilinx Inc.
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
-
XC95288XL-10FG256C
Xilinx Inc.
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
40.844525
-
EPM1270F256C5
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire
-
XC95288XL-7FGG256I
Xilinx Inc.
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
101.663976
-
EPM2210F256C5
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
53.311711
-
XC95288XL-7FGG256C
Xilinx Inc.
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
81.273576
-
EPM570F256C4N
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
43.396119
-
EPM1270GF256I5N
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
34.387186
-
EPM2210F256I5N
Intel
Package:Embedded - CPLDs (Complex Programmable Logic Devices)
Price: please inquire