The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- ECCN Code:
3A001.A.2.C
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Approvals | Base Product Number | Clock Frequency-Max | Degree of protection (IP) | Degree of protection (NEMA) | Explosion safety category for dust | Explosion safety category for gas | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Material housing | Mfr | Moisture Sensitivity Levels | Mounting | Number of contacts as change-over contact | Number of contacts as normally closed contact | Number of contacts as normally open contact | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Output Frequency | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Suitable for safety functions | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Type of control element | Type of electric connection | Usage Level | Operating Temperature | Series | Size / Dimension | Tolerance | JESD-609 Code | Number of Terminations | ECCN Code | Temperature Coefficient | Type | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Power (Watts) | Additional Feature | HTS Code | Subcategory | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Current Rating | Frequency | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Failure Rate | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Load Capacitance | RAM Size | Propagation Delay | Turn On Delay Time | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Number of Logic Blocks (LABs) | Speed Grade | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Output Level | Features | Height | Height Seated (Max) | Length | Width | Radiation Hardening | Ratings |
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![]() | Mfr Part No APA600-FG256M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 256-LBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | APA600 | 180 MHz | MICROSEMI CORP | Microsemi Corporation | APA600-FG256M | Microchip Technology | 3 | 186 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.29 | Compliant | No | 2.7 V | 2.3 V | 2.5 V | -55°C ~ 125°C (TC) | ProASICPLUS | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 186 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | MILITARY | 2.7 V | 2.3 V | 15.8 kB | 186 | 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 129024 | 600000 | 180 MHz | 21504 | 21504 | 600000 | 1.2 mm | 17 mm | 17 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A1425A-1CQ132B | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 132 | 150 MHz | MICROSEMI CORP | Microsemi Corporation | A1425A-1CQ132B | 100 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | GQFF | HERMETIC SEALED, CERAMIC, QFP-132 | TPAK132,2.5SQ,25 | SQUARE | FLATPACK, GUARD RING | Obsolete | NOT SPECIFIED | 5.88 | Non-Compliant | No | 5.5 V | 4.5 V | 5 V | Military grade | e0 | 3A001.A.2.C | TIN LEAD | 6250 PLD EQUIVALENT GATES AVAILABLE | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | FLAT | NOT SPECIFIED | 0.635 mm | compliant | S-CQFP-F132 | 100 | Not Qualified | 5 V | MILITARY | 100 | 310 CLBS, 2500 GATES | 2.9464 mm | FIELD PROGRAMMABLE GATE ARRAY | 2500 | MIL-STD-883 | 310 | 2.6 ns | 310 | 310 | 2500 | 24.13 mm | 24.13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A3PE600L-1FGG484M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | YES | 484-FPBGA (23x23) | 484 | A3PE600 | 250 MHz | MICROSEMI CORP | Microsemi Corporation | A3PE600L-1FGG484M | Microchip Technology | 3 | 270 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Yes | 1.575 V | 1.14 V | 1.2 V | -55°C ~ 125°C (TJ) | ProASIC3EL | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 270 | Not Qualified | 1.2/1.5,1.2/3.3 V | MILITARY | 270 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 13824 | 13824 | 600000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC3030-50PG84M | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | NO | 84 | 50 MHz | XILINX INC | Xilinx | XC3030-50PG84M | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | PGA | PGA, PGA84M,11X11 | PGA84M,11X11 | SQUARE | GRID ARRAY | Obsolete | PGA | 5.8 | Yes | 5 V | 3A001.A.2.C | 360 FLIP-FLOPS; TYP. GATES = 1500-2000; POWER-DOWN SUPPLY CURRENT = 80UA | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | 84 | S-CPGA-P84 | 74 | Not Qualified | 5 V | MILITARY | 74 | 100 CLBS, 1500 GATES | 4.318 mm | FIELD PROGRAMMABLE GATE ARRAY | 100 | 100 | 1500 | 27.94 mm | 27.94 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A42MX36-PQG240M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 240 | 240 | 085372 | 73 MHz | MICROSEMI CORP | Microsemi Corporation | A42MX36-PQG240M | Molex | 3 | 202 | 125 °C | -55 °C | Bulk | PLASTIC/EPOXY | FQFP | FQFP, QFP240,1.3SQ,20 | QFP240,1.3SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | Active | 40 | 5.81 | Compliant | Yes | 3.6 V | 3 V | 3.3 V | * | e3 | 3A001.A.2.C | MATTE TIN | 125 °C | -55 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G240 | 202 | Not Qualified | 5 V | 3.3,3.3/5,5 V | MILITARY | 5.5 V | 3 V | 320 B | 202 | 2438 CLBS, 54000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 1184 | 54000 | 131 MHz | 1184 | 1822 | 2.7 ns | 2438 | 2438 | 54000 | 3.4 mm | 32 mm | 32 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M1A3PE3000L-FGG896M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 896-BGA | YES | 896-FBGA (31x31) | 896 | M1A3PE3000 | 250 MHz | MICROSEMI CORP | Microsemi Corporation | M1A3PE3000L-FGG896M | Microchip Technology | 3 | 620 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Yes | 1.575 V | 1.14 V | 1.2 V | -55°C ~ 125°C (TJ) | ProASIC3L | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B896 | 620 | Not Qualified | 1.2/1.5,1.2/3.3 V | MILITARY | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 3000000 | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX2000-FGG1152M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 1152-BGA | YES | 1152 | 1152-FPBGA (35x35) | 400.011771 mg | 1152 | AX2000 | 649 MHz | IP67 | Other | None | None | MICROSEMI CORP | Microsemi Corporation | AX2000-FGG1152M | Plastic | Microchip Technology | 3 | 0 | 2 | 1 | 684 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.29 | Compliant | Yes | Yes | 1.575 V | 1.425 V | 1.5 V | Plunger | Cable entry metrical | Military grade | -55°C ~ 125°C (TA) | Axcelerator | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 245 | 1 mm | compliant | 649 MHz | S-PBGA-B1152 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 36 kB | 990 ps | 990 ps | 684 | 21504 CLBS, 2000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | 294912 | 2e+06 | 649 MHz | 32256 | MIL-STD-883 Class B | 21504 | 21504 | 0.99 ns | 21504 | 32256 | 2000000 | 1.73 mm | 35 mm | 35 mm | No | |||||||||||||||||||||||||
![]() | Mfr Part No A42MX16-PQ160M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 160-BQFP | YES | 160-PQFP (28x28) | 160 | A42MX16 | 94 MHz | IP00 | Other | None | None | MICROSEMI CORP | Microsemi Corporation | A42MX16-PQ160M | Plastic | Microchip Technology | 3 | 1 | 0 | 0 | 125 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | QFP | QFP, | SQUARE | FLATPACK | Obsolete | QFP | Obsolete | 30 | 5.23 | No | No | 3.6 V | 3 V | 3.3 V | Plunger | Other | -55°C ~ 125°C (TC) | MX | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 225 | 0.65 mm | compliant | 160 | S-PQFP-G160 | Not Qualified | MILITARY | 1232 CLBS, 24000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 24000 | 2.8 ns | 1232 | 24000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A40MX04-PQ100M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 100-BQFP | YES | 100-PQFP (20x14) | 100 | A40MX04 | 80 MHz | IP67 | Other | None | None | MICROSEMI CORP | Microsemi Corporation | A40MX04-PQ100M | Metal | Microchip Technology | 3 | 1 | 0 | 0 | 69 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | QFP | QFP, | RECTANGULAR | FLATPACK | Obsolete | QFP | Obsolete | 30 | 5.23 | No | No | 3.6 V | 3 V | 3.3 V | Roller lever | With cable preassembled | -55°C ~ 125°C (TC) | MX | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 225 | 0.65 mm | compliant | 100 | R-PQFP-G100 | Not Qualified | MILITARY | 547 CLBS, 6000 GATES | 3.4 mm | FIELD PROGRAMMABLE GATE ARRAY | 6000 | 2.7 ns | 547 | 6000 | 20 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A40MX04-PL68M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 68-LCC (J-Lead) | YES | 68-PLCC (24.23x24.23) | 68 | A40MX04 | 80 MHz | MICROSEMI CORP | Microsemi Corporation | A40MX04-PL68M | Microchip Technology | 3 | 57 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Obsolete | LCC | Obsolete | 30 | 5.23 | Non-Compliant | No | 3.6 V | 3 V | 3.3 V | -55°C ~ 125°C (TC) | MX | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 225 | 1.27 mm | compliant | 68 | S-PQCC-J68 | Not Qualified | MILITARY | 547 CLBS, 6000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 6000 | 2.7 ns | 547 | 6000 | 24.2316 mm | 24.2316 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A54SX16P-1TQ144M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 144 | 280 MHz | MICROSEMI CORP | A54SX16P-1TQ144M | 3 | 125 °C | -55 °C | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | 30 | 5.85 | No | 3.6 V | 3 V | 3.3 V | e0 | 3A001.A.2.C | TIN LEAD | CAN ALSO BE OPERATED AT 5V; 24000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | QUAD | GULL WING | 225 | 0.5 mm | compliant | S-PQFP-G144 | Not Qualified | MILITARY | 1452 CLBS, 16000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 0.8 ns | 1452 | 16000 | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A40MX02-PL44M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 44-LCC (J-Lead) | YES | 44-PLCC (16.59x16.59) | 44 | A40MX02 | 80 MHz | MICROSEMI CORP | Microsemi Corporation | A40MX02-PL44M | Microchip Technology | 3 | Surface Mount | 34 | 125 °C | -55 °C | 40 MHz | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Obsolete | LCC | Obsolete | 30 | 5.23 | No | SMD | 3.6 V | 3 V | 3.3 V | -10 to 60 °C | MX | e0 | 3A001.A.2.C | Temperature Compensated Crystal Oscillator (TCXO) | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 225 | 1.27 mm | compliant | 4 | S-PQCC-J44 | Not Qualified | MILITARY | 10 pF | 295 CLBS, 3000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 3000 | 2.7 ns | 295 | 3000 | Clipped Sinewave | 16.5862 mm | 16.5862 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A54SX16-1CQ208B | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | 240 MHz | MICROSEMI CORP | Microsemi Corporation | A54SX16-1CQ208B | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | QFF | QFF, TPAK208,2.9SQ,20 | TPAK208,2.9SQ,20 | SQUARE | FLATPACK | Obsolete | 20 | 5.27 | No | 3.63 V | 2.97 V | 3.3 V | Military grade | e0 | 3A001.A.2.C | TIN LEAD | 24000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | FLAT | 225 | 0.5 mm | compliant | S-CQFP-F208 | 172 | Not Qualified | 3.3,5 V | MILITARY | 172 | 1452 CLBS, 16000 GATES | 3.06 mm | FIELD PROGRAMMABLE GATE ARRAY | MIL-STD-883 Class B | 0.9 ns | 1452 | 1452 | 16000 | 29.21 mm | 29.21 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A42MX36-1PQ240M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 240 | 240 | 83 MHz | MICROSEMI CORP | Microsemi Corporation | A42MX36-1PQ240M | 3 | 202 | 125 °C | -55 °C | PLASTIC/EPOXY | FQFP | FQFP, QFP240,1.3SQ,20 | QFP240,1.3SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | 30 | 5.79 | Compliant | No | 3.6 V | 3 V | 3.3 V | e0 | 3A001.A.2.C | TIN LEAD | 125 °C | -55 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 225 | 0.5 mm | compliant | 240 | S-PQFP-G240 | 202 | Not Qualified | 5 V | 3.3,3.3/5,5 V | MILITARY | 5.5 V | 3 V | 320 B | 202 | 2438 CLBS, 54000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 1184 | 54000 | 151 MHz | 1184 | 1 | 1822 | 2.3 ns | 2438 | 2414 | 54000 | 3.4 mm | 32 mm | 32 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AX1000-CQ352M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 352-BFCQFP with Tie Bar | YES | 352 | 352-CQFP (75x75) | 10.567001 g | 352 | CE, CSA, UL | AX1000 | 649 MHz | MICROSEMI CORP | Cutler Hammer, Div of Eaton Co | PDG34G0125E3XK | Microchip Technology | Panel | 198 | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | GQFF | GQFF, TPAK352,2.9SQ,20 | TPAK352,2.9SQ,20 | SQUARE | FLATPACK, GUARD RING | Active | Active | 20 | 5.3 | Compliant | No | 1.575 V | 1.425 V | 1.5 V | Military grade | -55°C ~ 125°C (TA) | Axcelerator | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.425V ~ 1.575V | QUAD | FLAT | 225 | 0.5 mm | unknown | 125 A | 649 MHz | S-CQFP-F352 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 990 ps | 990 ps | 516 | 12096 CLBS, 1000000 GATES | 2.89 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1e+06 | 649 MHz | 18144 | MIL-STD-883 Class B | 12096 | 12096 | 0.99 ns | 12096 | 18144 | 1000000 | 2.66 mm | 48 mm | 48 mm | No | ||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A1425A-1CQ132M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | YES | 132 | 132 | CSA, UL | 150 MHz | MICROSEMI CORP | Bussmann | BSPA200120N5P | Wall | 100 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | GQFF | HERMETIC SEALED, CERAMIC, QFP-132 | TPAK132,2.5SQ,25 | SQUARE | FLATPACK, GUARD RING | Obsolete | 30 | 5.85 | Yes | No | 8542390000/8542390000/8542390000/8542390000/8542390000 | 5.5 V | 4.5 V | 5 V | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 6250 PLD EQUIVALENT GATES AVAILABLE | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | FLAT | 225 | 0.635 mm | not_compliant | 150 MHz | S-CQFP-F132 | 100 | Not Qualified | 5 V | 5 V | MILITARY | 5.5 V | 4.5 V | 2.6 ns | 100 | 310 CLBS, 2500 GATES | 2.9464 mm | FIELD PROGRAMMABLE GATE ARRAY | 310 | 2500 | 310 | 2.6 ns | 310 | 310 | 2500 | 24.13 mm | 24.13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A40MX02-1PL68M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 68-LCC (J-Lead) | YES | 68-PLCC (24.23x24.23) | 68 | A40MX02 | 92 MHz | MICROSEMI CORP | A40MX02-1PL68M | Microchip Technology | 3 | 57 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Obsolete | LCC | Obsolete | 30 | 5.23 | No | 3.6 V | 3 V | 3.3 V | -55°C ~ 125°C (TC) | MX | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 225 | 1.27 mm | compliant | 68 | S-PQCC-J68 | Not Qualified | MILITARY | 295 CLBS, 3000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 3000 | 2.3 ns | 295 | 3000 | 24.2316 mm | 24.2316 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A54SX32A-1PQ208M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 1210 (3225 Metric) | YES | 1210 | 208 | A54SX32A | 278 MHz | MICROSEMI CORP | Microsemi Corporation | A54SX32A-1PQ208M | KOA Speer Electronics, Inc. | 3 | 174 | 125 °C | -55 °C | Tape & Reel (TR) | PLASTIC/EPOXY | FQFP | PLASTIC, QFP-208 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Obsolete | Active | 30 | 5.25 | No | 2.75 V | 2.25 V | 2.5 V | -55°C ~ 155°C | SG73S-RT | 0.126 L x 0.102 W (3.20mm x 2.60mm) | ±1% | e0 | 2 | 3A001.A.2.C | ±200ppm/°C | 154 Ohms | Tin/Lead (Sn/Pb) | Thick Film | 1W | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 2.25V ~ 5.25V | QUAD | GULL WING | 225 | 0.5 mm | unknown | S-PQFP-G208 | 174 | Not Qualified | - | 2.5,3.3/5 V | MILITARY | 174 | 2880 CLBS, 48000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 48000 | 2880 | 1.1 ns | 2880 | 2880 | 48000 | Anti-Sulfur, Automotive AEC-Q200, Moisture Resistant, Pulse Withstanding | 0.028 (0.70mm) | 28 mm | 28 mm | - | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2GL150TS-1FCG1152M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | M2GL150 | MICROSEMI CORP | Microsemi Corporation | M2GL150TS-1FCG1152M | Microchip Technology | 4 | 574 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 35 X 35 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 5.27 | Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | -55°C ~ 125°C (TJ) | IGLOO2 | 3A001.A.2.C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | 30 | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | MILITARY | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 146124 | 5120000 | 146124 | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A40MX02-PL68M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 68-LCC (J-Lead) | YES | 68-PLCC (24.23x24.23) | 68 | A40MX02 | 80 MHz | MICROSEMI CORP | Microsemi Corporation | A40MX02-PL68M | Microchip Technology | 3 | 57 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Obsolete | LCC | Obsolete | 30 | 5.23 | No | 3.6 V | 3 V | 3.3 V | -55°C ~ 125°C (TC) | MX | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 225 | 1.27 mm | compliant | 68 | S-PQCC-J68 | Not Qualified | MILITARY | 295 CLBS, 3000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 3000 | 2.7 ns | 295 | 3000 | 24.2316 mm | 24.2316 mm |
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Package:Embedded - FPGAs (Field Programmable Gate Array)
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