The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
- All Manufacturers
- ECCN Code
- HTS Code
- Terminal Position
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- Part Life Cycle Code
- Number of Terminals
- ECCN Code:
3A001.A.2.C
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | # I/Os (Max) | # Registers | Base Product Number | Clock Frequency-Max | Device System Gates | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | Logic Cells | Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Blocks/Elements | Number of Logic Elements | Number of Usable Gates | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Part Package Code | Process Technology | Product Status | Programmable | Propagation Delay Time | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Number of LABs/CLBs | Screening Level | Speed Grade | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Length | Width | Radiation Hardening |
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 | Mfr Part No XC4003E-3PG120M | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | NO | 120 | 125 MHz | XILINX INC | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | PGA | CERAMIC, PGA-120 | PGA120,13X13 | SQUARE | GRID ARRAY | Obsolete | PGA | No | 5.5 V | 4.5 V | 5 V | No | 3A001.A.2.C | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | NOT SPECIFIED | 2.54 mm | compliant | NOT SPECIFIED | 120 | S-CPGA-P120 | 80 | Not Qualified | MILITARY | 80 | 100 CLBS, 2000 GATES | 4.318 mm | FIELD PROGRAMMABLE GATE ARRAY | 2 ns | 100 | 100 | 2000 | 34.544 mm | 34.544 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No RTSX32SU-CQ256E | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 310 MHz | MICROSEMI CORP | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | GQFF | GQFF, TPAK256,3SQ,20 | TPAK256,3SQ,20 | SQUARE | FLATPACK, GUARD RING | Transferred | QFP | No | 2.75 V | 2.25 V | 2.5 V | e0 | 3A001.A.2.C | TIN LEAD | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | QUAD | FLAT | 0.5 mm | unknown | 256 | S-CQFP-F256 | 227 | Not Qualified | MILITARY | 227 | 2880 CLBS, 48000 GATES | 3.3 mm | FIELD PROGRAMMABLE GATE ARRAY | MIL-PRF-38535 | 1.4 ns | 2880 | 2880 | 48000 | 36 mm | 36 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No RTSX32SU-CQ256E | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 310 MHz | MICROCHIP TECHNOLOGY INC | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | GQFF | CERAMIC, QFP-256 | TPAK256,3SQ,20 | SQUARE | FLATPACK, GUARD RING | Active | No | 2.75 V | 2.25 V | 2.5 V | e0 | 3A001.A.2.C | TIN LEAD | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | QUAD | FLAT | 0.5 mm | compliant | S-CQFP-F256 | 227 | Not Qualified | MILITARY | 227 | 2880 CLBS, 48000 GATES | 3.3 mm | FIELD PROGRAMMABLE GATE ARRAY | MIL-PRF-38535 | 1.4 ns | 2880 | 2880 | 48000 | 36 mm | 36 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX1000-CG624M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 624 | 649 MHz | MICROSEMI CORP | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | CGA | CGA, CGA624,25X25,50 | CGA624,25X25,50 | SQUARE | GRID ARRAY | Transferred | No | 1.575 V | 1.425 V | 1.5 V | 3A001.A.2.C | 8542.39.00.01 | PERPENDICULAR | UNSPECIFIED | 1.27 mm | unknown | S-CPGA-X624 | 418 | Not Qualified | MILITARY | 418 | 12096 CLBS, 1000000 GATES | 5.41 mm | FIELD PROGRAMMABLE GATE ARRAY | MIL-STD-883 Class B | 0.99 ns | 12096 | 18144 | 1000000 | 32.5 mm | 32.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC3090-50PG175MSPC0109 | AMD Xilinx | Datasheet | 456 | - | Min: 1 Mult: 1 | NO | 175 | 50 MHz | XILINX INC | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | PGA | PGA, | PGA176,16X16MOD | SQUARE | GRID ARRAY | Obsolete | PGA | 5.5 V | 4.5 V | 5 V | 3A001.A.2.C | MAX 144 I/OS; 928 FLIP-FLOPS; POWER-DOWN SUPPLY CURRENT = 5UA @ VCC = 3.2V & T = 25DEG CEL | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | 175 | S-CPGA-P175 | Not Qualified | MILITARY | 320 CLBS, 9000 GATES | 3.5052 mm | FIELD PROGRAMMABLE GATE ARRAY | 320 | 9000 | 42.164 mm | 42.164 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC3064-70PG132MSPC0107 | AMD Xilinx | Datasheet | 223 | - | Min: 1 Mult: 1 | NO | 132 | 70 MHz | XILINX INC | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | PGA | PGA, | PGA132,14X14 | SQUARE | GRID ARRAY | Obsolete | PGA | 5.5 V | 4.5 V | 5 V | 3A001.A.2.C | 688 FLIP-FLOPS; TYP. GATES = 3500-4500 | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | 132 | S-CPGA-P132 | 110 | Not Qualified | MILITARY | 110 | 224 CLBS, 3500 GATES | 3.9116 mm | FIELD PROGRAMMABLE GATE ARRAY | 9 ns | 224 | 3500 | 37.084 mm | 37.084 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC3064-50PG132MSPC0108 | AMD Xilinx | Datasheet | 767 | - | Min: 1 Mult: 1 | NO | 132 | 50 MHz | XILINX INC | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | PGA | PGA, | PGA132,14X14 | SQUARE | GRID ARRAY | Obsolete | PGA | 5.5 V | 4.5 V | 5 V | 3A001.A.2.C | MAX 110 I/OS; 688 FLIP-FLOPS; POWER-DOWN SUPPLY CURRENT = 4UA @ VCC = 3.2V & T = 25DEG CEL | 8542.39.00.01 | PERPENDICULAR | PIN/PEG | 2.54 mm | unknown | 132 | S-CPGA-P132 | Not Qualified | MILITARY | 224 CLBS, 6400 GATES | 4.318 mm | FIELD PROGRAMMABLE GATE ARRAY | 224 | 6400 | 37.084 mm | 37.084 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7V2000T-2FFG1157E | AMD Xilinx | Datasheet | 193 | - | Min: 1 Mult: 1 | YES | 1157 | XILINX INC | 4 | 125 °C | -55 °C | PLASTIC/EPOXY | BGA | LEAD FREE, FBGA-1157 | SQUARE | GRID ARRAY | Transferred | BGA | Yes | 1.03 V | 0.97 V | 1 V | e1 | Yes | 3A001.A.2.C | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | 1157 | S-PBGA-B1157 | Not Qualified | MILITARY | 305400 CLBS | FIELD PROGRAMMABLE GATE ARRAY | 305400 | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000L-FGG484M | Microchip Technology | Datasheet | 558 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3PE3000 | 250 MHz | 60 | MICROSEMI CORP | M1A3PE3000L-FGG484M | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 341 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | M1A3PE3000L | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 3000000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000L-FG484M | Microchip Technology | Datasheet | 724 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3PE3000 | 250 MHz | 60 | MICROSEMI CORP | M1A3PE3000L-FG484M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 341 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | M1A3PE3000L | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 25 mA | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 3000000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE600L-FGG484M | Microchip Technology | Datasheet | 2082 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | A3PE600 | 250 MHz | 60 | MICROSEMI CORP | A3PE600L-FGG484M | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 270 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | A3PE600L | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 270 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 270 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 13824 | 13824 | 600000 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-1FGG144M | Microchip Technology | Datasheet | 1788 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P1000 | 350 MHz | 160 | MICROSEMI CORP | A3P1000-1FGG144M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 97 I/O | 11000 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | A3P1000 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | MILITARY | 8 mA | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 24576 | 24576 | 1000000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000L-1FGG484M | Microchip Technology | Datasheet | 548 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-484 | YES | 484-FPBGA (23x23) | 484 | M1A3PE3000 | 250 MHz | 504 kbit | 60 | MICROSEMI CORP | M1A3PE3000L-1FGG484M | 350 MHz | + 125 C | Microchip Technology | - 55 C | 3 | SMD/SMT | 341 I/O | 3500 LAB | 35000 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | M1A3PE3000L | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 25 mA | 700 Mb/s | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 3000000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-1PQG208M | Microchip Technology | Datasheet | 1653 | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | A3P1000 | 350 MHz | 24 | MICROSEMI CORP | A3P1000-1PQG208M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 154 I/O | 11000 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 1.36 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | -55°C ~ 125°C (TJ) | Tray | A3P1000 | e3 | 3A001.A.2.C | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | 154 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | MILITARY | 8 mA | 154 | 24576 CLBS, 1000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 24576 | 24576 | 1000000 | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000L-1FG896M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 896-FBGA (31x31) | 896 | M1A3PE3000 | 250 MHz | 27 | MICROSEMI CORP | M1A3PE3000L-1FG896M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 620 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 1 MM PITCH, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | M1A3PE3000L | e0 | 3A001.A.2.C | TIN LEAD | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 25 mA | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 3000000 | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P1000-PQG208M | Microchip Technology | Datasheet | 1617 | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | M1A3P1000 | 350 MHz | 24 | MICROSEMI CORP | M1A3P1000-PQG208M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 154 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | -55°C ~ 125°C (TJ) | Tray | M1A3P1000 | e3 | 3A001.A.2.C | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | 154 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | MILITARY | 8 mA | 154 | 24576 CLBS, 1000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 24576 | 24576 | 1000000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE3000L-1FGG484M | Microchip Technology | Datasheet | 721 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE3000 | 250 MHz | 60 | MICROSEMI CORP | A3PE3000L-1FGG484M | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 341 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 1 MM PITCH, GREEN, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | A3PE3000L | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 1.575 V | 1.14 V | 63 kB | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 1 | 75264 | 75264 | 75264 | 3000000 | 23 mm | 23 mm | No | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL010T-1FG484M | Microchip Technology | Datasheet | 2039 | - | Min: 1 Mult: 1 | Surface Mount | FBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2GL010 | 60 | MICROSEMI CORP | M2GL010T-1FG484M | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 233 I/O | 12084 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 1 MM PITCH, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | 0.761080 oz | -55°C ~ 125°C (TJ) | Tray | M2GL010T | 3A001.A.2.C | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | 1.2 V | MILITARY | 667 Mb/s | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | 933888 | 4 Transceiver | 12084 | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL025TS-1FGG484M | Microchip Technology | Datasheet | 1970 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2GL025 | 60 | MICROSEMI CORP | M2GL025TS-1FGG484M | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 267 I/O | 27696 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.27 | Details | Yes | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | -55°C ~ 125°C (TJ) | Tray | M2GL025TS | 3A001.A.2.C | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 1.2 V | MILITARY | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 27696 | 1130496 | 4 Transceiver | 27696 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No A54SX32-TQ144M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 113 | 1080 | A54SX32 | 240 MHz | 48000 | SX | MICROSEMI CORP | 1800 | Microsemi Corporation | A54SX32-TQ144M | Microchip Technology | 3 | Surface Mount | 113 | 2880 | 32000 | 3.63/5.5(V) | 2.97/4.5(V) | 3.3/5(V) | -55C to 125C | 125C | -55C | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | LFQFP | 1.40 MM HEIGHT, MO-136, TQFP-144 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | TQFP | Obsolete | 0.35um | Obsolete | Yes | 0.9(ns) | No | 30 | 5.23 | No | 3.6 V | 3 V | 3.3 V | -55°C ~ 125°C (TC) | SX | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | 225 | 0.5 mm | unknown | 240(MHz) | 144 | S-PQFP-G144 | Not Qualified | MILITARY | 2880 CLBS, 32000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 48000 | 2880 | 0.9 ns | 2880 | 32000 | 20 mm | 20 mm |
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