The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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- Number of Terminals
- ECCN Code:
3A001.A.2.C
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | RAM Size | Propagation Delay | Turn On Delay Time | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Screening Level | Number of Logic Blocks (LABs) | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Length | Width | Radiation Hardening |
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 | Mfr Part No A54SX72A-1PQG208M | Microchip Technology | Datasheet | 691 |
| Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | A54SX72 | 250 MHz | 24 | MICROSEMI CORP | A54SX72A-1PQG208M | 250 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 171 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 2.75 V | 2.25 V | 2.5 V | Actel | -55°C ~ 125°C (TC) | Tray | A54SX72A | 3A001.A.2.C | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | 171 | Not Qualified | 2.5 V | 2.5,3.3/5 V | MILITARY | 171 | 6036 CLBS, 108000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 108000 | 6036 | 1.3 ns | 6036 | 6036 | 108000 | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||
| Mfr Part No A54SX32A-1TQG100M | Microchip Technology | Datasheet | 556 |
| Min: 1 Mult: 1 | Surface Mount | TQFP-100 | YES | 100-TQFP (14x14) | 100 | A54SX32 | 278 MHz | 90 | MICROSEMI CORP | A54SX32A-1TQG100M | 278 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 81 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, QFP100,.63SQ,20 | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 2.75 V | 2.25 V | 2.5 V | Actel | 0.023175 oz | -55°C ~ 125°C (TC) | Tray | A54SX32A | e3 | 3A001.A.2.C | Matte Tin (Sn) | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G100 | 81 | Not Qualified | 2.5 V | 2.5,2.5/5 V | MILITARY | 81 | 2880 CLBS, 48000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 48000 | 2880 | 1.1 ns | 2880 | 2880 | 48000 | 1.4 mm | 14 mm | 14 mm | |||||||||||||||||||||||
| Mfr Part No A42MX16-1PQG160M | Microchip Technology | Datasheet | 2264 |
| Min: 1 Mult: 1 | Surface Mount | PQFP-160 | YES | 160-PQFP (28x28) | 160 | A42MX16 | 108 MHz | 24 | MICROSEMI CORP | A42MX16-1PQG160M | 198 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 125 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | QFP | QFP, | SQUARE | FLATPACK | Active | Active | 40 | 5.29 | Details | Yes | This product may require additional documentation to export from the United States. | 5.5 V | 3 V | 3.3 V | Actel | 0.196363 oz | -55°C ~ 125°C (TC) | Tray | A42MX16 | e3 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 245 | 0.65 mm | compliant | S-PQFP-G160 | Not Qualified | 3.3 V, 5 V | MILITARY | 1232 CLBS, 24000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 24000 | 2.4 ns | 1232 | 24000 | 3.4 mm | 28 mm | 28 mm | |||||||||||||||||||||||||||||
| Mfr Part No A40MX02-1PLG44M | Microchip Technology | Datasheet | 1618 |
| Min: 1 Mult: 1 | Surface Mount | PLCC-44 | YES | 44-PLCC (16.59x16.59) | 44 | A40MX02 | 92 MHz | 27 | MICROSEMI CORP | A40MX02-1PLG44M | 160 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 34 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Active | Active | 40 | 5.28 | Details | Yes | This product may require additional documentation to export from the United States. | 5.5 V | 3 V | 3.3 V | Actel | 0.084185 oz | -55°C ~ 125°C (TC) | Tube | A40MX02 | e3 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J44 | Not Qualified | 3.3 V, 5 V | MILITARY | 295 CLBS, 3000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 3000 | 2.3 ns | 295 | 3000 | 3.68 mm | 16.59 mm | 16.59 mm | |||||||||||||||||||||||||||||
| Mfr Part No A42MX16-PQG208M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | A42MX16 | 94 MHz | 24 | MICROSEMI CORP | A42MX16-PQG208M | 172 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 140 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.29 | Details | Yes | This product may require additional documentation to export from the United States. | 5.5 V | 3 V | 3.3 V | Actel | -55°C ~ 125°C (TC) | Tray | A42MX16 | e3 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | Not Qualified | 3.3 V, 5 V | MILITARY | 1232 CLBS, 24000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 24000 | 2.8 ns | 1232 | 24000 | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||||||
| Mfr Part No A42MX09-PQG100M | Microchip Technology | Datasheet | 539 |
| Min: 1 Mult: 1 | Surface Mount | PQFP-100 | YES | 100-PQFP (20x14) | 100 | A42MX09 | 117 MHz | 66 | MICROSEMI CORP | A42MX09-PQG100M | 215 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 83 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | QFP | QFP, | RECTANGULAR | FLATPACK | Active | Active | 40 | 5.29 | Details | Yes | This product may require additional documentation to export from the United States. | 5.5 V | 3 V | 3.3 V | Actel | 0.062040 oz | -55°C ~ 125°C (TC) | Tray | A42MX09 | e3 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 245 | 0.65 mm | compliant | R-PQFP-G100 | Not Qualified | 3.3 V, 5 V | MILITARY | 684 CLBS, 14000 GATES | 3.4 mm | FIELD PROGRAMMABLE GATE ARRAY | 14000 | 2.5 ns | 684 | 14000 | 2.7 mm | 20 mm | 14 mm | |||||||||||||||||||||||||||||
| Mfr Part No A42MX24-1PLG84M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PLCC-84 | YES | 84-PLCC (29.31x29.31) | 84 | A42MX24 | 16 | MICROSEMI CORP | A42MX24-1PLG84M | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 72 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | QCCJ | ROHS COMPLIANT, PLASTIC, LCC-84 | SQUARE | CHIP CARRIER | Active | Active | 40 | 5.28 | Details | Yes | This product may require additional documentation to export from the United States. | 5.5 V | 3 V | 3.3 V | Actel | 0.239083 oz | -55°C ~ 125°C (TC) | Tube | A42MX24 | e3 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J84 | Not Qualified | 3.3 V, 5 V | MILITARY | 1890 CLBS, 36000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 36000 | 2.1 ns | 1890 | 36000 | 3.68 mm | 29.31 mm | 29.31 mm | |||||||||||||||||||||||||||||||
| Mfr Part No A42MX09-1PQG160M | Microchip Technology | Datasheet | 663 |
| Min: 1 Mult: 1 | Surface Mount | PQFP-160 | YES | 160-PQFP (28x28) | 160 | A42MX09 | 135 MHz | 24 | MICROSEMI CORP | A42MX09-1PQG160M | 247 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 101 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | QFP | QFP, | SQUARE | FLATPACK | Active | Active | 40 | 5.29 | Details | Yes | This product may require additional documentation to export from the United States. | 5.5 V | 3 V | 3.3 V | Actel | 0.196363 oz | -55°C ~ 125°C (TC) | Tray | A42MX09 | e3 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 245 | 0.65 mm | compliant | S-PQFP-G160 | Not Qualified | 3.3 V, 5 V | MILITARY | 684 CLBS, 14000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 14000 | 2.1 ns | 684 | 14000 | 3.4 mm | 28 mm | 28 mm | |||||||||||||||||||||||||||||
| Mfr Part No A40MX04-VQG80M | Microchip Technology | Datasheet | 1891 | - | Min: 1 Mult: 1 | Surface Mount | VQFP | YES | 80-VQFP (14x14) | 80 | A40MX04 | 80 MHz | 90 | MICROSEMI CORP | A40MX04-VQG80M | 139 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 69 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | TQFP | 1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-80 | SQUARE | FLATPACK, THIN PROFILE | Active | Active | 40 | 1.55 | Details | Yes | This product may require additional documentation to export from the United States. | 5.5 V | 3 V | 3.3 V | Actel | -55°C ~ 125°C (TC) | Tray | A40MX04 | e3 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 260 | 0.65 mm | compliant | S-PQFP-G80 | Not Qualified | 3.3 V, 5 V | MILITARY | 547 CLBS, 6000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 6000 | 2.7 ns | 547 | 6000 | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||
| Mfr Part No A40MX04-1PLG84M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PLCC-84 | YES | 84-PLCC (29.31x29.31) | 84 | A40MX04 | 48 MHz | 16 | MICROSEMI CORP | A40MX04-1PLG84M | 160 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 69 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Active | Active | 40 | 5.29 | Details | Yes | This product may require additional documentation to export from the United States. | 5.5 V | 3 V | 3.3 V | Actel | 0.239083 oz | -55°C ~ 125°C (TC) | Tube | A40MX04 | e3 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J84 | Not Qualified | 3.3 V, 5 V | MILITARY | 547 CLBS, 6000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 6000 | 2.3 ns | 547 | 6000 | 3.68 mm | 29.31 mm | 29.31 mm | |||||||||||||||||||||||||||||
| Mfr Part No A42MX16-1VQG100M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | VQFP | YES | 100-VQFP (14x14) | 100 | A42MX16 | 108 MHz | 90 | MICROSEMI CORP | A42MX16-1VQG100M | 198 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 83 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | TFQFP | 1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-100 | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.29 | Details | Yes | This product may require additional documentation to export from the United States. | 5.5 V | 3 V | 3.3 V | Actel | -55°C ~ 125°C (TC) | Tray | A42MX16 | e3 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G100 | Not Qualified | 3.3 V, 5 V | MILITARY | 1232 CLBS, 24000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 24000 | 2.4 ns | 1232 | 24000 | 1 mm | 14 mm | 14 mm | ||||||||||||||||||||||||||||||
| Mfr Part No A42MX09-TQG176M | Microchip Technology | Datasheet | 411 |
| Min: 1 Mult: 1 | Surface Mount | TQFP-176 | YES | 176-TQFP (24x24) | 176 | A42MX09 | 117 MHz | 40 | MICROSEMI CORP | A42MX09-TQG176M | 215 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 104 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.29 | Details | Yes | This product may require additional documentation to export from the United States. | 5.5 V | 3 V | 3.3 V | Actel | -55°C ~ 125°C (TC) | Tray | A42MX09 | e3 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G176 | Not Qualified | 3.3 V, 5 V | MILITARY | 684 CLBS, 14000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 14000 | 2.5 ns | 684 | 14000 | 1.4 mm | 24 mm | 24 mm | ||||||||||||||||||||||||||||||
| Mfr Part No A42MX09-1TQG176M | Microchip Technology | Datasheet | 451 |
| Min: 1 Mult: 1 | Surface Mount | TQFP-176 | YES | 176-TQFP (24x24) | 176 | A42MX09 | 135 MHz | 40 | MICROSEMI CORP | A42MX09-1TQG176M | 247 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 104 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.29 | Details | Yes | This product may require additional documentation to export from the United States. | 5.5 V | 3 V | 3.3 V | Actel | -55°C ~ 125°C (TC) | Tray | A42MX09 | e3 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 260 | 0.5 mm | compliant | S-PQFP-G176 | Not Qualified | 3.3 V, 5 V | MILITARY | 684 CLBS, 14000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 14000 | 2.1 ns | 684 | 14000 | 1.4 mm | 24 mm | 24 mm | ||||||||||||||||||||||||||||||
| Mfr Part No A42MX09-PQG160M | Microchip Technology | Datasheet | 423 |
| Min: 1 Mult: 1 | Surface Mount | PQFP-160 | YES | 160-PQFP (28x28) | 160 | A42MX09 | 117 MHz | 24 | MICROSEMI CORP | A42MX09-PQG160M | 215 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 101 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | QFP | ROHS COMPLIANT, PLASTIC, QFP-160 | SQUARE | FLATPACK | Active | Active | 40 | 5.29 | Details | Yes | This product may require additional documentation to export from the United States. | 5.5 V | 3 V | 3.3 V | Actel | 0.196363 oz | -55°C ~ 125°C (TC) | Tray | A42MX09 | e3 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 245 | 0.65 mm | compliant | S-PQFP-G160 | Not Qualified | 3.3 V, 5 V | MILITARY | 684 CLBS, 14000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 14000 | 2.5 ns | 684 | 14000 | 3.4 mm | 28 mm | 28 mm | |||||||||||||||||||||||||||||
| Mfr Part No A42MX09-1PQG100M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PQFP-100 | YES | 100-PQFP (20x14) | 100 | A42MX09 | 135 MHz | 66 | MICROSEMI CORP | A42MX09-1PQG100M | 247 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 83 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | QFP | ROHS COMPLIANT, PLASTIC, QFP-100 | RECTANGULAR | FLATPACK | Active | Active | 40 | 5.29 | Details | Yes | This product may require additional documentation to export from the United States. | 5.5 V | 3 V | 3.3 V | Actel | 0.062040 oz | -55°C ~ 125°C (TC) | Tray | A42MX09 | e3 | 3A001.A.2.C | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 245 | 0.65 mm | compliant | R-PQFP-G100 | Not Qualified | 3.3 V, 5 V | MILITARY | 684 CLBS, 14000 GATES | 3.4 mm | FIELD PROGRAMMABLE GATE ARRAY | 14000 | 2.1 ns | 684 | 14000 | 2.7 mm | 20 mm | 14 mm | |||||||||||||||||||||||||||||
| Mfr Part No AX1000-FGG896M | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 896 | 896-FBGA (31x31) | 400.011771 mg | 896 | AX1000 | 649 MHz | 27 | MICROSEMI CORP | AX1000-FGG896M | 649 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 516 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | Military grade | -55°C ~ 125°C (TA) | Tray | AX1000 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 125 °C | -55 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 649 MHz | S-PBGA-B896 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | 20.3 kB | 990 ps | 990 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 649 MHz | 18144 | MIL-STD-883 Class B | 12096 | 12096 | 0.99 ns | 12096 | 18144 | 1000000 | 1.73 mm | 31 mm | 31 mm | No | |||
| Mfr Part No M1A3PE3000L-FGG484M | Microchip Technology | Datasheet | 558 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3PE3000 | 250 MHz | 60 | MICROSEMI CORP | M1A3PE3000L-FGG484M | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 341 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | M1A3PE3000L | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 3000000 | 23 mm | 23 mm | |||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000L-FG484M | Microchip Technology | Datasheet | 724 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3PE3000 | 250 MHz | 60 | MICROSEMI CORP | M1A3PE3000L-FG484M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 341 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | M1A3PE3000L | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 25 mA | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 3000000 | 23 mm | 23 mm | |||||||||||||||||||||||||
| Mfr Part No A3PE600L-FGG484M | Microchip Technology | Datasheet | 2082 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | A3PE600 | 250 MHz | 60 | MICROSEMI CORP | A3PE600L-FGG484M | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 270 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | A3PE600L | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 270 | Not Qualified | 1.5 V | 1.2/1.5,1.2/3.3 V | MILITARY | 270 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 13824 | 13824 | 600000 | 23 mm | 23 mm | |||||||||||||||||||||||||||
| Mfr Part No A3P1000-1FGG144M | Microchip Technology | Datasheet | 1788 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P1000 | 350 MHz | 160 | MICROSEMI CORP | A3P1000-1FGG144M | 350 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 97 I/O | 11000 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.23 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -55°C ~ 125°C (TJ) | Tray | A3P1000 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.5 V | 1.5,1.5/3.3 V | MILITARY | 8 mA | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 24576 | 24576 | 1000000 | 13 mm | 13 mm |
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Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire